XICOR X25644S14I

8K x 8 Bit
4K x 8 Bit
2K x 8 Bit
X25644/46
X25324/26
X25164/66
64K
32K
16K
Programmable Watchdog Timer w/Serial E2PROM
FEATURES
DESCRIPTION
• Programmable Watchdog Timer with Reset
Assertion
—Reset Signal Valid to Vcc=1V
—Power Up Reset Control
• Save Critical Data With Block LockTM Protection
—Block LockTM Protect 0, 1/4, 1/2 or all of
Serial E2PROM Memory Array
• In Circuit Programmable ROM Mode
• Long Battery Life With Low Power Consumption
—<50µA Max Standby Current, Watchdog On
—<1µA Max Standby Current, Watchdog Off
—<5mA Max Active Current during Write
—<400µA Max Active Current during Read
• 1.8V to 3.6V, 2.7V to 5.5V and 4.5V to 5.5V Power
Supply Operation
• 2MHz Clock Rate
• Minimize Programming Time
—32 Byte Page Write Mode
—Self-Timed Write Cycle
—5ms Write Cycle Time (Typical)
• SPI Modes (0,0 & 1,1)
• Built-in Inadvertent Write Protection
—Power-Up/Power-Down Protection Circuitry
—Write Enable Latch
—Write Protect Pin
• High Reliability
• Available Packages
—14-Lead SOIC (X2564x)
—14-Lead TSSOP (X2532x, X2516x)
—8-Lead SOIC (X2532x, X2516x)
These devices combine two popular functions, Watchdog
Timer, and Serial E2PROM Memory in one package. This
combination lowers system cost, reduces board space
requirements, and increases reliability.
The Watchdog Timer provides an independent protection
mechanism for microcontrollers. During a system failure,
the device will respond with a RESET/RESET signal
after a selectable time-out interval. The user selects the
interval from three preset values. Once selected, the
interval does not change, even after cycling the power.
The memory portion of the device is a CMOS Serial
E2PROM array with Xicor’s Block LockTM Protection. The
array is internally organized as x 8. The device features a
Serial Peripheral Interface (SPI) and software protocol
allowing operation on a simple four-wire bus.
The device utilizes Xicor’s proprietary Direct WriteTM cell,
providing a minimum endurance of 100,000 cycles per
sector and a minimum data retention of 100 years.
BLOCK DIAGRAM
SI
SO
PAGE DECODE LOGIC
DATA
REGISTER
X - DECODE
LOGIC
CS
COMMAND
DECODE &
CONTROL
LOGIC
RESET/RESET
RESET
CONTROL
STATUS
REGISTER
SCK
32
8
SERIAL
E2PROM
ARRAY
WATCHDOG
TIMER
WP
Xicor, Inc. 1994, 1995, 1996 Patents Pending
7050 -1.0 6/20/97 T0/C0/D0 SH
HIGH
VOLTAGE
CONTROL
WRITE,
BLOCK LOCK &
ICP ROM CONTROL
7029 FRM 01
1
Characteristics subject to change without notice
X25644/46
X25324/26
X25164/66
PIN CONFIGURATION
PIN DESCRIPTIONS
Serial Output (SO)
SO is a push/pull serial data output pin. During a read
cycle, data is shifted out on this pin. Data is clocked out by
the falling edge of the serial clock.
Not to Scale
14-LEAD SOIC
Serial Input (SI)
SI is a serial data input pin. All opcodes, byte addresses,
and data to be written to the memory are input on this pin.
Data is latched by the rising edge of the serial clock.
NC
1
14
NC
CS
2
13
V CC
12
11
V CC
RESET/RESET
SCK
CS
3
0.345” SO
4
WP
5
10
VSS
NC
6
9
SI
8
NC
Serial Clock (SCK)
The Serial Clock controls the serial bus timing for data
input and output. Opcodes, addresses, or data present on
the SI pin are latched on the rising edge of the clock input,
while data on the SO pin change after the falling edge of
the clock input.
X25644/46
7
0.244”
8-LEAD SOIC
CS
SO
Chip Select (CS)
When CS is HIGH, the device is deselected and the SO
output pin is at high impedance and unless a nonvolatile
write cycle is underway, the device will be in the standby
power mode. CS LOW enables the device’s, placing it in
the active power mode. It should be noted that after
power-up, a HIGH to LOW transition on CS is required
prior to the start of any operation.
0.197”
WP
VSS
1
V CC
8
X25324/26
2
7
X25164/66
3
6
RESET/RESET
4
SI
5
SCK
0.244”
14-LEAD TSSOP
Write Protect (WP)
When WP is low and the nonvolatile bit WPEN is “1”,
nonvolatile writes to the device’s Status Register are
disabled, but the part otherwise functions normally. When
WP is held high, all functions, including nonvolatile writes
to the Status Register operate normally. If an internal
Status Register Write Cycle has already been initiated,
WP going low while WPEN is a “1” will have no effect on
this write. Subsequent write attempts to the Status
Register under these conditions will be disabled.
V CC
CS
1
14
SO
2
13
NC
NC
NC
3 X25324/28 12
4 X25164/66 11
NC
5
10
NC
WP
VSS
6
9
SCK
7
8
SI
0.200”
RESET/RESET
NC
0.177”
The WP pin function is blocked when the WPEN bit in the
Status Register is “0”. This allows the user to install the
device in a system with WP pin grounded and still be able
to program the Status Register. The WP pin functions will
be enabled when the WPEN bit is set to a “1”.
7036 FRM 02
PIN NAMES
Symbol
Reset (RESET/RESET)
RESET/RESET is an active LOW/HIGH, open drain output which goes active whenever the Watchdog Timer is
enabled and CS remains either HIGH or LOW longer than
the selectable Watchdog time-out period. It will remain
active for tRST, the Reset Timeout period. A falling edge of
CS will reset the Watchdog Timer.
Description
CS
Chip Select Input
SO
Serial Output
SI
Serial Input
SCK
Serial Clock Input
WP
Write Protect Input
VSS
Ground
VCC
Supply Voltage
RESET/RESET
Reset Output
7029 FRM T01
2
X25644/46
X25324/26
X25164/66
The Write-In-Progress (WIP) bit is a volatile, read only bit
and indicates whether the device is busy with an internal
nonvolatile write operation. The WIP bit is read using the
RDSR instruction. When set to a “1”, a nonvolatile write
operation is in progress. When set to a “0”, no write is in
progress.
PRINCIPLES OF OPERATION
The device is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of many popular microcontroller families.
The device monitors the bus and asserts RESET/RESET
output if there is no bus activity within user programmable
time-out period. The device contains an 8-bit instruction
register. It is accessed via the SI input, with data being
clocked in on the rising edge of SCK. CS must be LOW
during the entire operation.
The Write Enable Latch (WEL) bit indicates the Status of
the Write Enable Latch. When WEL=1, the latch is set
HIGH and when WEL=0 the latch is reset LOW. The WEL
bit is a volatile, read only bit. It can be set by the WREN
instruction and can be reset by the WRDI instruction.
All instructions (Table 1), addresses and data are transferred MSB first. Data input on the SI line is latched on the
first rising edge of SCK after CS goes LOW. Data is output on the SO line by the falling edge of SCK. SCK is
static, allowing the user to stop the clock and then start it
again to resume operations where left off.
The Block Lock bits, BL0 and BL1, set the level of Block
LockTM Protection. These nonvolatile bits are programmed using the WRSR instruction and allow the user
to protect one quarter, one half, all or none of the
E2PROM array. Any portion of the array that is Block Lock
Protected can be read but not written. It will remain protected until the BL bits are altered to disable Block Lock
Protection of that portion of memory.
Write Enable Latch
The device contains a Write Enable Latch. This latch must
be SET before a Write Operation is initiated. The WREN
instruction will set the latch and the WRDI instruction will
reset the latch (Figure 3). This latch is automatically reset
upon a power-up condition and after the completion of a
valid Write Cycle.
Status
Register
Bits
BL1 BL0
Status Register
The RDSR instruction provides access to the Status Register. The Status Register may be read at any time, even
during a Write Cycle. The Status Register is formatted as
follows:
7
6
WPEN FLB
5
4
WD1 WD0
3
2
1
BL1
BL0
WEL
Array Addresses Protected
X2564x
X2532x
X2516x
None
None
None
0
0
0
1
$1800–$1FFF $0C00–$0FFF $0600–$07FF
1
0
$1000–$1FFF $0800–$0FFF $0400–$07FF
1
1
$0000–$1FFF $0000–$0FFF $0000–$07FF
7029 FRM T03
0
WIP
7029 FRM T02
Table 1. Instruction Set
Instruction Name
Instruction Format*
Operation
WREN
0000 0110
Set the Write Enable Latch (Enable Write Operations)
SFLB
0000 0000
Set Flag Bit
WRDI/RFLB
0000 0100
Reset the Write Enable Latch/Reset Flag Bit
RSDR
0000 0101
Read Status Register
WRSR
0000 0001
Write Status Register(Watchdog, BlockLock & WPEN Bits)
READ
0000 0011
Read Data from Memory Array Beginning at Selected Address
WRITE
0000 0010
Write Data to Memory Array Beginning at Selected Address
*Instructions are shown MSB in leftmost position. Instructions are transferred MSB first.
3
7029 FRM T04
X25644/46
X25324/26
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sent, the data stored in the memory at the selected
address is shifted out on the SO line. The data stored in
memory at the next address can be read sequentially by
continuing to provide clock pulses. The address is automatically incremented to the next higher address after
each byte of data is shifted out. When the highest address
is reached, the address counter rolls over to address
$0000 allowing the read cycle to be continued indefinitely.
The read operation is terminated by taking CS high. Refer
to the Read E2PROM Array Sequence (Figure 1).
The Watchdog Timer bits, WD0 and WD1, select the
Watchdog Time-out Period. These nonvolatile bits are
programmed with the WRSR instruction.
Status Register Bits
WD1
WD0
Watchdog Time-out
(Typical)
0
0
1.4 Seconds
0
1
600 Milliseconds
1
0
200 Milliseconds
1
1
Disabled
To read the Status Register, the CS line is first pulled low
to select the device followed by the 8-bit RDSR instruction. After the RDSR opcode is sent, the contents of the
Status Register are shifted out on the SO line. Refer to
the Read Status Register Sequence (Figure 2).
7029 FRM T05
The FLAG bit shows the status of a volatile latch that can
be set and reset by the system using the SFLB and RFLB
instructions. The Flag bit is automatically reset upon
power up.
Write Sequence
Prior to any attempt to write data into the device, the
“Write Enable” Latch (WEL) must first be set by issuing
the WREN instruction (Figure 3). CS is first taken LOW,
then the WREN instruction is clocked into the device.
After all eight bits of the instruction are transmitted, CS
must then be taken HIGH. If the user continues the Write
Operation without taking CS HIGH after issuing the
WREN instruction, the Write Operation will be ignored.
The nonvolatile WPEN bit is programmed using the
WRSR instruction. This bit works in conjunction with the
WP pin to provide Programmable Hardware Write Protection (Table 2). When WP is LOW and the WPEN bit is programmed HIGH, all Status Register Write Operations are
disabled.
In Circuit Programmable ROM Mode
This mechanism protects the Block Lock and Watchdog
bits from inadvertant corruption. It may be used to perform an In Circuit Programmable ROM function by hardwiring the WP pin to ground, writing and Block Locking
the desired portion of the array to be ROM, and then programming the WPEN bit HIGH.
To write data to the E2PROM memory array, the user then
issues the WRITE instruction followed by the 16 bit
address and then the data to be written. Any unused
address bits are specified to be “0’s”. The WRITE operation minimally takes 32 clocks. CS must go low and
remain low for the duration of the operation. If the address
counter reaches the end of a page and the clock continues, the counter will roll back to the first address of the
page and overwrite any data that may have been previously written.
Read Sequence
When reading from the E2PROM memory array, CS is
first pulled low to select the device. The 8-bit READ
instruction is transmitted to the device, followed by the 16bit address. After the READ opcode and address are
Table 2. Block Protect Matrix
STATUS
REGISTER
STATUS
REGISTER
DEVICE
PIN
BLOCK
BLOCK
STATUS
REGISTER
UNPROTECTED
BLOCK
WPEN, BL0, BL1
WD0, WD1 BITS
WEL
WPEN
WP#
PROTECTED
BLOCK
0
X
X
Protected
Protected
Protected
1
1
0
Protected
Unprotected
Protected
1
0
X
Protected
Unprotected
Unprotected
1
X
1
Protected
Unprotected
Unprotected
7029 FRM T06
4
X25644/46
X25324/26
X25164/66
For the Page Write Operation (byte or page write) to be
completed, CS can only be brought HIGH after bit 0 of the
last data byte to be written is clocked in. If it is brought
HIGH at any other time, the write operation will not be
completed (Figure 4).
The RESET/RESET output is an open drain output and
requires a pull up resistor.
To write to the Status Register, the WRSR instruction is
followed by the data to be written (Figure 5). Data bits 0
and 1 must be “0” .
• The device is in the low power standby state.
• A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
• SO pin is high impedance.
• The Write Enable Latch is reset.
• The Flag Bit is reset.
• Reset Signal is active for tPURST
Operational Notes
The device powers-up in the following state:
While the write is in progress following a Status Register
or E2PROM Sequence, the Status Register may be read
to check the WIP bit. During this time the WIP bit will be
high.
Data Protection
The following circuitry has been included to prevent inadvertent writes:
RESET/RESET Operation
The RESET (X25xx4) output is designed to go LOW
whenever the Watchdog timer has reached its programmable time-out limit.
• A WREN instruction must be issued to set the Write
Enable Latch.
• CS must come HIGH at the proper clock count in order
to start a nonvolatile write cycle.
The RESET (X25xx6) output is designed to go HIGH
whenever the watchdog timer has reached its programmable time-out limit.
Figure 1. Read E2PROM Array Sequence
CS
0
1
2
3
4
5
6
7
8
9
10
20 21 22 23 24 25
26 27 28 29 30
SCK
INSTRUCTION
16 BIT ADDRESS
15 14 13
SI
3
2
1
0
DATA OUT
HIGH IMPEDANCE
7
SO
MSB
5
6
5
4
3
2
1
0
7029 FRM 03
X25644/46
X25324/26
X25164/66
Figure 2. Read Status Register Sequence
CS
0
1
2
3
4
5
6
7
8
9
10
7
6
5
11 12 13 14
SCK
INSTRUCTION
SI
DATA OUT
SO
HIGH IMPEDANCE
MSB
4
3
2
1
0
7029 FRM 04
Figure 3. Write Enable Latch/Flag Bit Sequence
CS
0
1
2
3
4
5
6
7
SCK
SI
SO
HIGH IMPEDANCE
7029 FRM 05
6
X25644/46
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Figure 4. Write Sequence
CS
0
1
2
3
4
5
6
7
8
9
15
14
20
10
21
22
23
24
25
26
1
0
7
6
5
27
28
29
30
31
1
0
SCK
INSTRUCTION
16 BIT ADDRESS
SI
13
3
DATA BYTE 1
2
4
3
2
CS
32
33
34
7
6
5
35
36
37
38
39
40
41
42
1
0
7
6
5
43
44
45
46
47
1
0
SCK
DATA BYTE 2
SI
4
3
DAT A BYTE 3
2
4
3
2
DATA BYTE N
6
5
4
3
2
1
0
7029 FRM 06
Figure 5. Status Register Write Sequence
CS
0
1
2
3
4
5
6
7
8
9
10
7
6
5
11
12
13
14
15
1
0
SCK
DATA BYTE
INSTRUCTION
SI
SO
4
3
2
HIGH IMPEDANCE
7029 FRM 07
Symbol Table
WAVEFORM
7
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from LOW
to HIGH
Will change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
N/A
Changing:
State Not
Known
Center Line
is High
Impedance
X25644/46
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ABSOLUTE MAXIMUM RATINGS*
*COMMENT
Temperature under Bias ........................–65°C to +135°C
Storage Temperature .............................–65°C to +150°C
Voltage on any Pin with Respect to VSS....... –1.0V to +7V
D.C. Output Current ....................................................5mA
Lead Temperature (Soldering, 10 seconds)............ 300°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
listed in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temp
Min.
Max.
Commercial
0°C
70°C
Industrial
–40°C
+85°C
Supply Voltage
X25xxx–1.8
X25xxx–2.7
X25xxx
7029 FRM T07
Limits
1.8V-3.6V
2.7V to 5.5V
4.5V-5.5V
7029 FRM T08
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Typ.
Max.
Units
Test Conditions
ICC1
VCC Write Current (Active)
5
mA
SCK = VCC x 0.1/VCC x 0.9 @ 2MHz,
SO = Open
ICC2
VCC Read Current (Active)
0.4
mA
SCK = VCC x 0.1/VCC x 0.9 @ 2MHz,
SO = Open
ISB1
VCC Standby Current WDT=OFF
1
µA
CS = VCC, VIN = VSS or VCC
ISB2
VCC Standby Current WDT=ON
50
µA
CS = VCC, VIN = VSS or VCC, VCC = 5.5V
ISB3
VCC Standby Current WDT=ON
20
µA
CS = VCC, VIN = VSS or VCC, VCC =3.6V
ILI
Input Leakage Current
0.1
10
µA
VIN = VSS to VCC
ILO
Output Leakage Current
0.1
10
µA
VOUT = VSS to VCC
VIL(1)
Input LOW Voltage
–0.5
VCCx0.3
V
VIH(1)
Input HIGH Voltage
VCCx0.7
VCC+0.5
V
VOL1
Output LOW Voltage
0.4
V
VCC > 3.3V, IOL = 2.1mA
VOL2
Output LOW Voltage
0.4
V
2V < VCC ≤ 3.3V, IOL = 1mA
VOL3
Output LOW Voltage
0.4
V
VCC ≤ 2V, IOL = 0.5mA
VOH1
Output HIGH Voltage
VCC–0.8
V
VCC > 3.3V, IOH = –1.0mA
VOH2
Output HIGH Voltage
VCC–0.4
V
2V < VCC ≤ 3.3V, IOH = –0.4mA
VOH3
Output HIGH Voltage
VCC–0.2
V
VCC ≤ 2V, IOH = –0.25mA
VOLRS
Reset Output LOW Voltage
V
IOL = 1mA
0.4
7029 FRM T09
POWER-UP TIMING
Symbol
Parameter
Min.
Max.
Units
tPUR(2)
Power-up to Read Operation
1
ms
tPUW(2)
Power-up to Write Operation
5
ms
7029 FRM T10
8
X25644/46
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CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V.
Symbol
COUT(2)
CIN(2)
Notes:
Test
Max.
Units
Conditions
Output Capacitance (SO, RESET/RESET)
8
pF
VOUT = 0V
Input Capacitance (SCK, SI, CS, WP)
6
pF
VIN = 0V
(1) VIL min. and VIH max. are for reference only and are not tested.
(2) This parameter is periodically sampled and not 100% tested.
EQUIVALENT A.C. LOAD CIRCUIT AT 5V VCC
5V
VCC x 0.1 to VCC x 0.9
Input Pulse Levels
Input Rise and Fall Times
3.3KΩ
10ns
VCC x0.5
Input and Output Timing Level
OUTPUT
1.64KΩ
A.C. TEST CONDITIONS
5V
1.64KΩ
7029 FRM T11
RESET/RESET
100pF
7029 FRM T12
30pF
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)
Data Input Timing
Symbol
Parameter
Voltage Range
Min.
Max.
Units
2
1
MHz
fSCK
Clock Frequency
2.7V–5.5V
1.8V–3.6V
0
tCYC
Cycle Time
2.7V–5.5V
1.8V–3.6V
500
1000
ns
tLEAD
CS Lead Time
2.7V–5.5V
1.8V–3.6V
250
500
ns
tLAG
CS Lag Time
2.7V–5.5V
1.8V–3.6V
250
500
ns
tWH
Clock HIGH Time
2.7V–5.5V
1.8V–3.6V
200
400
ns
tWL
Clock LOW Time
2.7V–5.5V
1.8V–3.6V
200
400
ns
tSU
Data Setup Time
2.7V–5.5V
1.8V–3.6V
50
ns
tH
Data Hold Time
2.7V–5.5V
1.8V–3.6V
50
ns
tRI(3)
Input Rise Time
2.7V–5.5V
1.8V–3.6V
100
ns
tFI(3)
Input Fall Time
2.7V–5.5V
1.8V–3.6V
100
ns
tCS
CS Deselect Time
2.7V–5.5V
1.8V–3.6V
tWC(4)
Write Cycle Time
2.7V–5.5V
1.8V–3.6V
500
ns
10
ms
7029 FRM T13
9
X25644/46
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Data Output Timing
Symbol
Parameter
Voltage Range
Min.
Max.
Units
0
2
1
MHz
fSCK
Clock Frequency
2.7V–5.5V
1.8V–3.6V
tDIS
Output Disable Time
2.7V–5.5V
1.8V–3.6V
250
ns
tV
Output Valid from Clock Low
2.7V–5.5V
1.8V–3.6V
200
400
ns
tHO
Output Hold Time
2.7V–5.5V
1.8V–3.6V
tRO(3)
Output Rise Time
2.7V–5.5V
1.8V–3.6V
100
ns
tFO(3)
Output Fall Time
2.7V–5.5V
1.8V–3.6V
100
ns
0
ns
7036 FRM T14
Notes:
(3) This parameter is periodically sampled and not 100% tested.
(4) tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal
nonvolatile write cycle.
Serial Output Timing
CS
t CYC
tWH
t LAG
SCK
tV
SO
SI
tHO
MSB OUT
t WL
tDIS
MSB–1 OUT
LSB OUT
ADDR
LSB IN
Serial Input Timing
tCS
CS
tLEAD
tLAG
SCK
tSU
SI
tH
tRI
MSB IN
t FI
LSB IN
HIGH IMPEDANCE
SO
10
X25644/46
X25324/26
X25164/66
CS vs. RESET/RESET Timing
CS
t CST
RESET
t WDO
tWDO
tRST
t RST
RESET
7029 FRM 11
Power Up and Down Timing Diagram
VCC
tPURST
VRST
RESET
RESET
7029 FRM 12
RESET/RESET Output Timing
Symbol
Parameter
Min.
Typ.
Max.
Units
tWDO
Watchdog Timeout Period,
WD1 = 1, WD0 = 0
WD1 = 0, WD0 = 1
WD1 = 0, WD0 = 0
100
450
1
200
600
1.4
300
800
2
ms
ms
sec
tCST
CS Pulse Width to Reset the Watchdog
400
tRST
Reset Timeout
100
tPURST
Power Up Reset Timeout
100
VRST
Reset Valid Voltage
1.0
ns
200
300
ms
350
ms
V
7029 FRM T15
11
X25644/46
X25324/26
X25164/66
PACKAGING INFORMATION
14-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
PIN 1 INDEX
PIN 1
0.014 (0.35)
0.020 (0.51)
0.336 (8.55)
0.345 (8.75)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.10)
0.010 (0.25)
0.050 (1.27)
0.050" Typical
0.010 (0.25)
X 45°
0.020 (0.50)
0.050" T ypical
0° – 8°
0.250"
0.0075 (0.19)
0.010 (0.25)
0.016 (0.410)
0.037 (0.937)
FOO TPRINT
0.030" Typical
14 Places
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
12
X25644/46
X25324/26
X25164/66
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
PIN 1 INDEX
PIN 1
0.014 (0.35)
0.019 (0.49)
0.188 (4.78)
0.197 (5.00)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.19)
0.010 (0.25)
0.050 (1.27)
0.010 (0.25)
0.020 (0.50) X 45°
0.050" TYPICAL
0.050"
TYPICAL
0° – 8°
0.0075 (0.19)
0.010 (0.25)
0.250"
0.016 (0.410)
0.037 (0.937)
FOOTPRINT
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
13
0.030"
TYPICAL
8 PLACES
X25644/46
X25324/26
X25164/66
14-LEAD PLASTIC, TSSOP, PACKAGE TYPE V
.025 (.65) BSC
.169 (4.3)
.252 (6.4) BSC
.177 (4.5)
.193 (4.9)
.200 (5.1)
.047 (1.20)
.0075 (.19)
.0118 (.30)
.002 (.05)
.006 (.15)
.010 (.25)
Gage Plane
0° – 8°
Seating Plane
.019 (.50)
.029 (.75)
Detail A (20X)
.031 (.80)
.041 (1.05)
See Detail “A”
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
14
X25644/46
X25324/26
X25164/66
ORDERING INFORMATION
X25644/46
X25324/26
X25164/66
P
T
-V
VCC Limits
Blank = 5V ±10%
2.7 = 2.7V to 5.5V
1.8 = 1.8V to 3.6V
Device
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
Package
S14 = 14-Lead SOIC
S8 = 8-Lead SOIC
V14 = 14-Lead TSSOP
Part Mark Convention
X25644/46
X
Blank = 14-Lead SOIC
X25324/26
X25164/66
X
X
Blank = 8-Lead SOIC
V = 14 Lead TSSOP
X
Blank = 5V ±10%, 0°C to +70°C
I = 5V ±10%, –40°C to +85°C
F = 2.7V to 5.5V, 0°C to +70°C
G = 2.7V to 5.5V, –40°C to +85°C
AG = 1.8V to 3.6V, 0°C to +70°C
Blank = 5V ±10%, 0°C to +70°C
I = 5V ±10%, –40°C to +85°C
F = 2.7V to 5.5V, 0°C to +70°C
G = 2.7V to 5.5V, –40°C to +85°C
AG = 1.8V to 3.6V, 0°C to +70°C
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc.
makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the
described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the
right to discontinue production and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents,
licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481;
4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967;
4,883, 976. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with
appropriate error detection and correction, redundancy and back-up features to prevent such an occurence.
Xicor’s products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system, or to affect its safety or effectiveness.
15