Replaces X25643/X25645 X5643/X5645 CPU Supervisor with 64Kbit SPI EEPROM FEATURES DESCRIPTION • Selectable watchdog timer • Low VCC detection and reset assertion —Five standard reset threshold voltages —Re-program low VCC reset threshold voltage using special programming sequence —Reset signal valid to VCC = 1V • Determine watchdog or low voltage reset with a volatile flag bit • Long battery life with low power consumption —<50µA max standby current, watchdog on —<1µA max standby current, watchdog off —<400µA max active current during read • 64Kbits of EEPROM • Built-in inadvertent write protection —Power-up/power-down protection circuitry —Protect 0, 1/4, 1/2 or all of EEPROM array with Block Lock™ protection —In circuit programmable ROM mode • 2MHz SPI interface modes (0,0 & 1,1) • Minimize EEPROM programming time —32-byte page write mode —Self-timed write cycle —5ms write cycle time (typical) • 2.7V to 5.5V and 4.5V to 5.5V power supply operation • Available packages —8-lead PDIP, 14-lead SOIC These devices combine four popular functions, Poweron Reset Control, Watchdog Timer, Supply Voltage Supervision, and Block Lock Protect Serial EEPROM Memory in one package. This combination lowers system cost, reduces board space requirements, and increases reliability. Applying power to the device activates the power on reset circuit which holds RESET/RESET active for a period of time. This allows the power supply and oscillator to stabilize before the processor can execute code. The Watchdog Timer provides an independent protection mechanism for microcontrollers. When the microcontroller fails to restart a timer within a selectable time out interval, the device activates the RESET/RESET signal. The user selects the interval from three preset values. Once selected, the interval does not change, even after cycling the power. The device’s low VCC detection circuitry protects the user’s system from low voltage conditions, resetting the system when VCC falls below the minimum VCC trip point. RESET/RESET is asserted until VCC returns to proper operating level and stabilizes. Five industry standard VTRIP thresholds are available, however, Xicor’s unique circuits allow the threshold to be reprogrammed to meet custom requirements or to fine-tune the threshold for applications requiring higher precision. BLOCK DIAGRAM Watchdog Transition Detector WP SO SCK CS/WDI Protect Logic RESET/RESET Data Register Status Register Command Decode & Control Logic 16Kbits VCC Threshold Reset logic 32Kbits 16Kbits + VCC VTRIP REV 1.1.1 3/5/01 EEPROM Array SI Watchdog Timer Reset - www.xicor.com Reset & Watchdog Timebase X5643 = RESET X5645 = RESET Power On and Low Voltage Reset Generation Characteristics subject to change without notice. 1 of 19 X5643/X5645 PIN CONFIGURATION 14-Lead SOIC 8-Lead PDIP 1 CS/WDI VCC 8 1 14 2 13 VCC SO 12 4 X5643/45 11 VCC RESET/RESET SCK CS/WDI SO 2 WP 3 VSS 4 X5643/45 7 RESET/RESET 6 SCK 5 SI NC NC CS/WDI 3 WP 5 10 VSS 6 9 SI NC 7 8 NC Pin PDIP Pin SOIC Pin TSSOP Name Function 1 2&3 2 CS/WDI Chip Select Input. CS HIGH, deselects the device and the SO output pin is at a high impedance state. Unless a nonvolatile write cycle is underway, the device will be in the standby power mode. CS LOW enables the device, placing it in the active power mode. Prior to the start of any operation after power up, a HIGH to LOW transition on CS is required. Watchdog Input. A HIGH to LOW transition on the WDI pin restarts the watchdog timer. The absence of a HIGH to LOW transition within the watchdog time out period results in RESET/RESET going active. 2 4 3 SO Serial Output. SO is a push/pull serial data output pin. A read cycle shifts data out on this pin. The falling edge of the serial clock (SCK) clocks the data out. 5 9 13 SI Serial Input. SI is a serial data input pin. Input all opcodes, byte addresses, and memory data on this pin. The rising edge of the serial clock (SCK) latches the input data. Send all opcodes (Table 1), addresses and data MSB first. 6 10 14 SCK Serial Clock. The serial clock controls the serial bus timing for data input and output. The rising edge of SCK latches in the opcode, address, or data bits present on the SI pin. The falling edge of SCK changes the data output on the SO pin. 3 5 7 WP Write Protect. The WP pin works in conjunction with a nonvolatile WPEN bit to “lock” the setting of the watchdog timer control and the memory write protect bits. 4 6 8 VSS Ground 8 12 & 13 19 VCC Supply Voltage 7 11 18 RESET/ RESET 1, 7, 8, 14 1, 4–6, 9–12, 15–17, 20 NC REV 1.1.1 3/5/01 Reset Output. RESET/RESET is an active LOW/HIGH, open drain output which goes active whenever VCC falls below the minimum VCC sense level. It will remain active until VCC rises above the minimum VCC sense level for 200ms. RESET/RESET goes active if the watchdog timer is enabled and CS remains either HIGH or LOW longer than the selectable watchdog time out period. A falling edge of CS will reset the watchdog timer. RESET/RESET goes active on power up at about 1V and remains active for 200ms after the power supply stabilizes. No internal connections www.xicor.com Characteristics subject to change without notice. 2 of 19 X5643/X5645 PRINCIPLES OF OPERATION Power On Reset Application of power to the X5643/X5645 activates a power on reset circuit. This circuit goes active at about 1V and pulls the RESET/RESET pin active. This signal prevents the system microprocessor from starting to operate with insufficient voltage or prior to stabilization of the oscillator. When VCC exceeds the device VTRIP value for 200ms (nominal) the circuit releases RESET/ RESET, allowing the processor to begin executing code. Low Voltage Monitoring During operation, the X5643/X5645 monitors the VCC level and asserts RESET/RESET if supply voltage falls below a preset minimum VTRIP. The RESET/RESET signal prevents the microprocessor from operating in a power fail or brownout condition. The RESET/RESET signal remains active until the voltage drops below 1V. It also remains active until VCC returns and exceeds VTRIP for 200ms. Watchdog Timer The watchdog timer circuit monitors the microprocessor activity by monitoring the WDI input. The microprocessor must toggle the CS/WDI pin periodically to prevent a RESET/RESET signal. The CS/WDI pin must be toggled from HIGH to LOW prior to the expiration of the watchdog time out period. The state of two nonvolatile control bits in the status register determine the watchdog timer period. The microprocessor can change these watchdog bits, or they may be “locked” by tying the WP pin LOW and setting the WPEN bit HIGH. To set the new VTRIP voltage, apply the desired VTRIP threshold to the Vcc pin and tie the CS/WDI pin and the WP pin HIGH. RESET/RESET and SO pins are left unconnected. Then apply the programming voltage VP to both SCK and SI and pulse CS/WDI LOW then HIGH. Remove VP and the sequence is complete. Figure 1. Set VTRIP Voltage CS VP SCK VP SI Resetting the VTRIP Voltage This procedure sets the VTRIP to a “native” voltage level. For example, if the current VTRIP is 4.4V and the VTRIP is reset, the new VTRIP is something less than 1.7V. This procedure must be used to set the voltage to a lower value. To reset the VTRIP voltage, apply a voltage between 2.7 and 5.5V to the VCC pin. Tie the CS/WDI pin, the WP pin, and the SCK pin HIGH. RESET/RESET and SO pins are left unconnected. Then apply the programming voltage VP to the SI pin ONLY and pulse CS/WDI LOW then HIGH. Remove VP and the sequence is complete. Figure 2. Reset VTRIP Voltage VCC Threshold Reset Procedure The X5643/X5645 has a standard VCC threshold (VTRIP) voltage. This value will not change over normal operating and storage conditions. However, in applications where the standard VTRIP is not exactly right, or for higher precision in the VTRIP value, the X5643/ X5645 threshold may be adjusted. CS SCK VCC VP SI Setting the VTRIP Voltage This procedure sets the VTRIP to a higher voltage value. For example, if the current VTRIP is 4.4V and the new VTRIP is 4.6V, this procedure directly makes the change. If the new setting is lower than the current setting, then it is necessary to reset the trip point before setting the new value. REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 3 of 19 X5643/X5645 Figure 3. VTRIP Programming Sequence Flow Chart VTRIP Programming Execute Reset VTRIP Sequence Set VCC = VCC Applied = Desired VTRIP New VCC Applied = Old VCC Applied + Error Execute Set VTRIP Sequence New VCC Applied = Old VCC Applied - Error Apply 5V to VCC Execute Reset VTRIP Sequence Decrement VCC (VCC = VCC - 10mV) NO RESET pin goes active? YES Error ≥ Emax Measured VTRIP Desired VTRIP Error > Emax Error < Emax Emax = Maximum Desired Error DONE REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 4 of 19 X5643/X5645 Figure 4. Sample VTRIP Reset Circuit VP NC 4.7K NC VTRIP Adj. + 4.7K RESET 1 8 2 7 X5643/45 3 6 4 5 NC Program SPI SERIAL MEMORY The memory portion of the device is a CMOS serial EEPROM array with Xicor’s block lock protection. The array is internally organized as x 8. The device features a Serial Peripheral Interface (SPI) and software protocol allowing operation on a simple four-wire bus. The device utilizes Xicor’s proprietary Direct Write™ cell, providing a minimum endurance of 100,000 cycles and a minimum data retention of 100 years. The device is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of many popular microcontroller families. It contains an 8-bit instruction register that is accessed via the SI input, with data being clocked in on the rising edge of SCK. CS must be LOW during the entire operation. All instructions (Table 1), addresses and data are transferred MSB first. Data input on the SI line is latched on the first rising edge of SCK after CS goes LOW. Data is output on the SO line by the falling edge of SCK. SCK is static, allowing the user to stop the clock and then start it again to resume operations where left off. Reset VTRIP Test VTRIP Set VTRIP 10K 10K Write Enable Latch The device contains a write enable latch. This latch must be SET before a write operation is initiated. The WREN instruction will set the latch and the WRDI instruction will reset the latch (Figure 3). This latch is automatically reset upon a power-up condition and after the completion of a valid Write Cycle. Status Register The RDSR instruction provides access to the status register. The status register may be read at any time, even during a write cycle. The status register is formatted as follows: 7 6 WPEN FLB 5 4 WD1 WD0 3 2 1 0 BL1 BL0 WEL WIP The Write-In-Progress (WIP) bit is a volatile, read only bit and indicates whether the device is busy with an internal nonvolatile write operation. The WIP bit is read using the RDSR instruction. When set to a “1”, a nonvolatile write operation is in progress. When set to a “0”, no write is in progress. Table 1. Instruction Set Instruction Name Instruction Format* WREN 0000 0110 Set the write enable latch (enable write operations) SFLB 0000 0000 Set flag bit WRDI/RFLB 0000 0100 Reset the write enable latch/reset flag bit RSDR 0000 0101 Read status register WRSR 0000 0001 Write status register (watchdog, block lock, WPEN & flag bits) READ 0000 0011 Read data from memory array beginning at selected address WRITE 0000 0010 Write data to memory array beginning at selected address Note: Operation *Instructions are shown MSB in leftmost position. Instructions are transferred MSB first. REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 5 of 19 X5643/X5645 Table 2. Block Protect Matrix WREN CMD Status Register Device Pin Block Block Status Register WEL WPEN WP# Protected Block Unprotected Block WPEN, BL0, BL1 WD0, WD1 0 X X Protected Protected Protected 1 1 0 Protected Writable Protected 1 0 X Protected Writable Writable 1 X 1 Protected Writable Writable The Write Enable Latch (WEL) bit indicates the status of the write enable latch. When WEL = 1, the latch is set HIGH and when WEL = 0 the latch is reset LOW. The WEL bit is a volatile, read only bit. It can be set by the WREN instruction and can be reset by the WRDS instruction. The block lock bits, BL0 and BL1, set the level of block lock protection. These nonvolatile bits are programmed using the WRSR instruction and allow the user to protect one quarter, one half, all or none of the EEPROM array. Any portion of the array that is block lock protected can be read but not written. It will remain protected until the BL bits are altered to disable block lock protection of that portion of memory. Status Register Bits Array Addresses Protected BL1 BL0 X5643/X5645 0 0 None 0 1 $1800–$1FFF 1 0 $1000–$1FFF 1 1 $0000–$1FFF The watchdog timer bits, WD0 and WD1, select the watchdog time out period. These nonvolatile bits are programmed with the WRSR instruction. REV 1.1.1 3/5/01 Status Register Bits WD1 WD0 Watchdog Time Out (Typical) 0 0 1.4 seconds 0 1 600 milliseconds 1 0 200 milliseconds 1 1 disabled The FLAG bit shows the status of a volatile latch that can be set and reset by the system using the SFLB and RFLB instructions. The flag bit is automatically reset upon power up. This flag can be used by the system to determine whether a reset occurs as a result of a watchdog time out or power failure. The nonvolatile WPEN bit is programmed using the WRSR instruction. This bit works in conjunction with the WP pin to provide an in-circuit programmable ROM function (Table 2). WP is LOW and WPEN bit programmed HIGH disables all status register write operations. In Circuit Programmable ROM Mode This mechanism protects the block lock and watchdog bits from inadvertent corruption. In the locked state (programmable ROM mode) the WP pin is LOW and the nonvolatile bit WPEN is “1”. This mode disables nonvolatile writes to the device’s status register. www.xicor.com Characteristics subject to change without notice. 6 of 19 X5643/X5645 Figure 5. Read EEPROM Array Sequence CS 0 1 2 3 4 5 6 7 8 9 10 20 21 22 23 24 25 26 27 28 29 30 SCK Instruction 16 Bit Address 15 14 13 SI 3 2 1 0 Data Out High Impedance 7 SO 6 5 4 3 2 1 0 MSB Setting the WP pin LOW while WPEN is a “1” while an internal write cycle to the status register is in progress will not stop this write operation, but the operation disables subsequent write attempts to the status register. When WP is HIGH, all functions, including nonvolatile writes to the status register operate normally. Setting the WPEN bit in the status register to “0” blocks the WP pin function, allowing writes to the status register when WP is HIGH or LOW. Setting the WPEN bit to “1” while the WP pin is LOW activates the programmable ROM mode, thus requiring a change in the WP pin prior to subsequent status register changes. This allows manufacturing to install the device in a system with WP pin grounded and still be able to program the status register. Manufacturing can then load configuration data, manufacturing time and other parameters into the EEPROM, then set the portion of memory to be protected by setting the block lock bits, and finally set the “OTP mode” by setting the WPEN bit. Data changes now require a hardware change. Read Sequence When reading from the EEPROM memory array, CS is first pulled low to select the device. The 8-bit READ instruction is transmitted to the device, followed by the 16-bit address. After the READ opcode and address are sent, the data stored in the memory at the selected address is shifted out on the SO line. The data stored in memory at the next address can be read sequentially by continuing to provide clock pulses. The address is automatically incremented to the next higher address after each byte of data is shifted REV 1.1.1 3/5/01 out. When the highest address is reached, the address counter rolls over to address $0000 allowing the read cycle to be continued indefinitely. The read operation is terminated by taking CS high. Refer to the read EEPROM array sequence (Figure 1). To read the status register, the CS line is first pulled low to select the device followed by the 8-bit RDSR instruction. After the RDSR opcode is sent, the contents of the status register are shifted out on the SO line. Refer to the read status register sequence (Figure 2). Write Sequence Prior to any attempt to write data into the device, the “Write Enable” Latch (WEL) must first be set by issuing the WREN instruction (Figure 3). CS is first taken LOW, then the WREN instruction is clocked into the device. After all eight bits of the instruction are transmitted, CS must then be taken HIGH. If the user continues the write operation without taking CS HIGH after issuing the WREN instruction, the write operation will be ignored. To write data to the EEPROM memory array, the user then issues the WRITE instruction followed by the 16 bit address and then the data to be written. Any unused address bits are specified to be “0’s”. The WRITE operation minimally takes 32 clocks. CS must go low and remain low for the duration of the operation. If the address counter reaches the end of a page and the clock continues, the counter will roll back to the first address of the page and overwrite any data that may have been previously written. www.xicor.com Characteristics subject to change without notice. 7 of 19 X5643/X5645 For the page write operation (byte or page write) to be completed, CS can only be brought HIGH after bit 0 of the last data byte to be written is clocked in. If it is brought HIGH at any other time, the write operation will not be completed (Figure 4). – SO pin is high impedance. To write to the status register, the WRSR instruction is followed by the data to be written (Figure 5). Data bits 0 and 1 must be “0”. Data Protection The following circuitry has been included to prevent inadvertent writes: – The write enable latch is reset. – The flag bit is reset. – Reset signal is active for tPURST. While the write is in progress following a status register or EEPROM sequence, the status register may be read to check the WIP bit. During this time the WIP bit will be high. – A WREN instruction must be issued to set the write enable latch. OPERATIONAL NOTES – CS must come HIGH at the proper clock count in order to start a nonvolatile write cycle. The device powers-up in the following state: – The device is in the low power standby state. – A HIGH to LOW transition on CS is required to enter an active state and receive an instruction. Figure 6. Read Status Register Sequence CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SCK Instruction SI Data Out SO High Impedance 7 6 5 4 3 2 1 0 MSB Figure 7. Write Enable Latch Sequence CS 0 1 2 3 4 5 6 7 SCK SI SO REV 1.1.1 3/5/01 High Impedance www.xicor.com Characteristics subject to change without notice. 8 of 19 X5643/X5645 Figure 8. Write Sequence CS 0 1 2 3 4 5 6 7 8 9 10 20 21 22 23 24 25 26 27 28 29 30 31 SCK Instruction 16 Bit Address 15 14 13 3 2 SI 1 0 7 6 5 4 Data Byte 1 3 2 1 0 CS 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCK SI 7 6 5 Data Byte 2 4 3 2 1 0 7 6 5 Data Byte 3 4 3 2 1 0 6 5 Data Byte N 4 3 2 1 0 Figure 9. Status Register Write Sequence CS 0 1 2 3 4 5 6 7 8 9 10 7 6 5 11 12 13 14 15 SCK Instruction SI SO Data Byte 4 3 2 1 0 High Impedance SYMBOL TABLE WAVEFORM REV 1.1.1 3/5/01 INPUTS OUTPUTS Must be steady Will be steady May change from LOW to HIGH Will change from LOW to HIGH May change from HIGH to LOW Will change from HIGH to LOW Don’t Care: Changes Allowed N/A Changing: State Not Known Center Line is High Impedance www.xicor.com Characteristics subject to change without notice. 9 of 19 X5643/X5645 ABSOLUTE MAXIMUM RATINGS COMMENT Temperature under bias ...................–65°C to +135°C Storage temperature ........................–65°C to +150°C Voltage on any pin with respect to VSS ..... –1.0v to +7v D.C. output current ............................................... 5mA Lead temperature (soldering, 10 seconds).........300°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; the functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temperature Min. Max. Device Option Supply Voltage Commercial 0°C 70°C –2.7 or -2.7A 2.7V to 5.5V Industrial –40°C +85°C Blank or -4.5A 4.5V-5.5V D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Limits Symbol Parameter ICC1 Min. Typ. Max. Unit Test Conditions VCC write current (active) 5 mA SCK = VCC x 0.1/VCC x 0.9 @ 2MHz, SO = Open ICC2 VCC read current (active) 0.4 mA SCK = VCC x 0.1/VCC x 0.9 @ 2MHz, SO = Open ISB1 VCC standby current WDT=OFF 1 µA CS = VCC, VIN = VSS or VCC, VCC = 5.5V ISB2 VCC standby current WDT=ON 50 µA CS = VCC, VIN = VSS or VCC, VCC = 5.5V ISB3 VCC standby current WDT=ON 20 µA CS = VCC, VIN = VSS or VCC, VCC = 3.6V ILI Input leakage current 10 µA VIN = VSS to VCC ILO Output leakage current VOUT = VSS to VCC 0.1 10 µA VIL(1) Input LOW voltage –0.5 VCC x 0.3 V VIH(1) Input HIGH voltage VCC x 0.7 VCC + 0.5 V VOL1 Output LOW voltage 0.4 V VCC > 3.3V, IOL = 2.1mA VOL2 Output LOW voltage 0.4 V 2V < VCC ≤ 3.3V, IOL = 1mA VOL3 Output LOW voltage 0.4 V VCC ≤ 2V, IOL = 0.5mA VOH1 Output HIGH voltage VCC – 0.8 V VCC > 3.3V, IOH = –1.0mA VOH2 Output HIGH voltage VCC – 0.4 V 2V < VCC ≤ 3.3V, IOH = –0.4mA VOH3 Output HIGH voltage VCC – 0.2 VOLS Reset output LOW voltage REV 1.1.1 3/5/01 0.1 0.4 www.xicor.com V VCC ≤ 2V, IOH = –0.25mA V IOL = 1mA Characteristics subject to change without notice. 10 of 19 X5643/X5645 CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V Symbol COUT(2) (2) CIN Test Max. Unit Conditions Output Capacitance (SO, RESET/RESET) 8 pF VOUT = 0V Input Capacitance (SCK, SI, CS, WP) 6 pF VIN = 0V Notes: (1) VIL min. and VIH max. are for reference only and are not tested. (2) This parameter is periodically sampled and not 100% tested. EQUIVALENT A.C. LOAD CIRCUIT AT 5V VCC 5V A.C. TEST CONDITIONS 5V 4.6KΩ 2.06KΩ Output Input pulse levels VCC x 0.1 to VCC x 0.9 Input rise and fall times 10ns Input and output timing level VCC x0.5 RESET/RESET 3.03KΩ 100pF 30pF A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Serial Input Timing 2.7–5.5V Symbol Parameter Min. Max. Unit 0 2 MHz fSCK Clock frequency tCYC Cycle time 500 ns tLEAD CS lead time 250 ns tLAG CS lag time 250 ns tWH Clock HIGH time 200 ns tWL Clock LOW time 250 ns tSU Data setup time 50 ns tH Data hold time 50 ns (3) Input rise time 100 ns (3) Input fall time 100 ns tRI tFI tCS (4) tWC REV 1.1.1 3/5/01 CS deselect time 500 Write cycle time ns 10 www.xicor.com ms Characteristics subject to change without notice. 11 of 19 X5643/X5645 Serial Input Timing tCS CS tLEAD tLAG SCK tSU tH SI SO tRI tFI MSB IN LSB IN High Impedance Serial Output Timing 2.7–5.5V Symbol Parameter Min. Max. Unit fSCK Clock frequency 2 MHz tDIS Output disable time 250 ns Output valid from clock low 250 ns tV tHO 0 Output hold time 0 ns (3) Output rise time 100 ns (3) Output fall time 100 ns tRO tFO Notes: (3) This parameter is periodically sampled and not 100% tested. (4) tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile write cycle. Serial Output Timing CS tCYC tWH tLAG SCK tV SO SI REV 1.1.1 3/5/01 MSB Out tHO MSB–1 Out tWL tDIS LSB Out ADDR LSB IN www.xicor.com Characteristics subject to change without notice. 12 of 19 X5643/X5645 Power-Up and Power-Down Timing VTRIP VTRIP VCC tPURST 0 Volts tPURST tF tRPD tR RESET (X5643) RESET (X5645) RESET Output Timing Symbol VTRIP VTH tPURST (5) tRPD Parameter Reset trip point voltage, X5643-4.5A, X5643-4.5A Reset trip point voltage, X5643, X5645 Reset trip point voltage, X5643-2.7A, X5645-2.7A Reset trip point voltage, X5643-2.7, X5645-2.7 Min. Typ. Max. Unit 4.5 4.25 2.85 2.55 4.63 4.38 2.93 2.63 4.75 4.5 3.0 2.7 V VTRIP hysteresis (HIGH to LOW vs. LOW to HIGH VTRIP voltage) Power-up reset time out 20 100 VCC detect to reset/output 200 mV 280 500 ms ns tF(5) VCC fall time 100 µs tR(5) VCC rise time 100 µs 1 V VRVALID Note: Reset valid VCC (5) This parameter is periodically sampled and not 100% tested. CS/WDI vs. RESET/RESET Timing CS/WDI tCST RESET tWDO tRST tWDO tRST RESET REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 13 of 19 X5643/X5645 RESET/RESET Output Timing Symbol Parameter Min. Typ. Max. Unit Watchdog time out period, WD1 = 1, WD0 = 0 WD1 = 0, WD0 = 1 WD1 = 0, WD0 = 0 100 450 1 200 600 1.4 300 800 2 ms ms sec tCST CS pulse width to reset the watchdog 400 tRST Reset time out 100 tWDO ns 200 300 ms VTRIP Set Conditions tTHD VCC VTRIP tTSU tP tVPS CS tRP tVPH tVPH tVPS tVPO VP SCK VP tVPO SI VTRIP Reset Conditions VCC* tRP tP tVPS CS SCK tVPS tVP1 tVPH tVPO VCC VP tVPO SI *VCC > Programmed VTRIP REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 14 of 19 X5643/X5645 VTRIP Programming Specifications VCC = 1.7–5.5V; Temperature = 0°C to 70°C Parameter Description Min. Max. Unit tVPS SCK VTRIP program voltage setup time 1 µs tVPH SCK VTRIP program voltage hold time 1 µs VTRIP program pulse width 1 µs tTSU VTRIP level setup time 10 µs tTHD VTRIP level hold (stable) time 10 ms tWC VTRIP write cycle time tRP VTRIP program cycle recovery period (between successive programming cycles) 10 ms SCK VTRIP program voltage off time before next cycle 0 ms Programming voltage 15 18 V VTRIP programed voltage range 1.7 5.0 V Vta1 Initial VTRIP program voltage accuracy (VCC applied–VTRIP) (programmed at 25°C) -0.1 +0.4 V Vta2 Subsequent VTRIP Program Voltage accuracy [(VCC applied–Vta1)—VTRIP) (programmed at 25°C) -25 +25 mV Vtr VTRIP Program Voltage repeatability (successive program operations) (programmed at 25°C) -25 +25 mV Vtv VTRIP program variation after programming (0–75°C). (programmed at 25°C) -25 +25 mV tP tVPO VP VTRAN 10 ms VTRIP programming parameters are periodically sampled and are not 100% tested. REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 15 of 19 X5643/X5645 TYPICAL PERFORMANCE VCC Supply Current vs. Temperature (ISB) tWDO vs. Voltage/Temperature (WD1, 0 = 1, 1) 1.9 18 Watchdog Timer On (VCC = 5V) 16 1.8 1.7 Reset (seconds) 14 Isb (µA) 12 Watchdog Timer On (VCC = 5V) 10 8 6 4 1.3 1.2 1 –40 25 Temp (°C) 1.7 90 VTRIP vs. Temperature (programmed at 25°C) 2.4 3.1 3.8 Voltage 4.5 5.2 tWDO vs. Voltage/Temperature (WD1, 0 = 1, 0) 0.8 5.025 VTRIP = 5V 5.000 0.75 3.525 VTRIP = 3.5V 3.500 3.475 2.525 25°C 0.65 90°C 0.6 0.55 0.5 VTRIP = 2.5V 2.500 –40°C 0.7 Reset (seconds) 4.975 Voltage 90°C 1.4 0 0.45 2.475 0 1.7 85 25 Temperature tPURST vs. Temperature 205 200 200 195 195 Reset (seconds) 205 185 180 175 170 165 160 –40 REV 1.1.1 3/5/01 2.4 3.1 3.8 Voltage 4.5 5.2 tWDO vs. Voltage/Temperature (WD1, 0 0 = 0, 1) 190 Time (ms) 25°C 1.5 1.1 Watchdog Timer Off (VCC = 3V, 5V) 2 –40°C 1.6 –40°C 25°C 190 185 90°C 180 175 170 165 160 25 Degrees °C 90 1.7 2.4 3.1 3.8 4.5 5.2 Voltage www.xicor.com Characteristics subject to change without notice. 16 of 19 X5643/X5645 PACKAGING INFORMATION 8-Lead Plastic Dual In-Line Package Type P 0.430 (10.92) 0.360 (9.14) 0.260 (6.60) 0.240 (6.10) Pin 1 Index Pin 1 0.300 (7.62) Ref. Half Shoulder Width On All End Pins Optional 0.145 (3.68) 0.128 (3.25) Seating Plane 0.025 (0.64) 0.015 (0.38) 0.065 (1.65) 0.045 (1.14) 0.150 (3.81) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) .073 (1.84) Max. 0.060 (1.52) 0.020 (0.51) 0.020 (0.51) 0.016 (0.41) 0.325 (8.25) 0.300 (7.62) 0° 15° Typ. 0.010 (0.25) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 17 of 19 X5643/X5645 PACKAGING INFORMATION 14-Lead Plastic Small Outline Gullwing Package Type S 0.150 (3.80) 0.228 (5.80) 0.158 (4.00) 0.244 (6.20) Pin 1 Index Pin 1 0.014 (0.35) 0.020 (0.51) 0.336 (8.55) 0.345 (8.75) (4X) 7° 0.053 (1.35) 0.069 (1.75) 0.004 (0.10) 0.010 (0.25) 0.050 (1.27) 0.050" Typical 0.010 (0.25) 0.020 (0.50) X 45° 0.050" Typical 0° – 8° 0.0075 (0.19) 0.010 (0.25) 0.250" 0.016 (0.410) 0.037 (0.937) 0.030" Typical 14 Places FOOTPRINT NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 18 of 19 X5643/X5645 Ordering Information VCC Range VTRIP Range Package Operating Temperature Range Part Number RESET (Active LOW) Part Number RESET (Active HIGH) 4.5-5.5V 4.5.4.75 8 pin PDIP 0–70°C X5643P-4.5A X5645P-4.5A 14L SOIC 0–70°C X5643S14-4.5A X5645S14-4.5A -40–85°C X5643S14I-4.5A X5645S14I-4.5A 8 pin PDIP 0–70°C X5643P X5645P 14L SOIC 0–70°C X5643S14 X5645S14 -40–85°C X5643S14I X5645S14I 4.5-5.5V 4.25.4.5 2.7-5.5V 2.85-3.0 14L SOIC 0–70°C X5643S14-2.7A X5645S14-2.7A 2.7-5.5V 2.55-2.7 14L SOIC 0–70°C X5643S14-2.7 X5645S14-2.7 Part Mark Information X5643/45 W X P = 8-Lead PDIP S14 = 14 Lead SOIC Blank = 5V ±10%, 0°C to +70°C, VTRIP = 4.25-4.5 AL = 5V±10%, 0°C to +70°C, VTRIP = 4.5-4.75 I = 5V ±10%, –40°C to +85°C, VTRIP = 4.25-4.5 AM = 5V ±10%, –40°C to +85°C, VTRIP = 4.5-4.75 F = 2.7V to 5.5V, 0°C to +70°C, VTRIP = 2.55-2.7 AN = 2.7V to 5.5V, 0°C to +70°C, VTRIP = 2.85-3.0 G = 2.7V to 5.5V, –40°C to +85°C, VTRIP = 2.55-2.7 AP = 2.7V to 5.5V, –40°C to +85°C, VTRIP = 2.85-3.0 LIMITED WARRANTY ©Xicor, Inc. 2001 Patents Pending Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice. Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied. COPYRIGHTS AND TRADEMARKS Xicor, Inc., the Xicor logo, E2POT, XDCP, XBGA, AUTOSTORE, Direct Write cell, Concurrent Read-Write, PASS, MPS, PushPOT, Block Lock, IdentiPROM, E2KEY, X24C16, SecureFlash, and SerialFlash are all trademarks or registered trademarks of Xicor, Inc. All other brand and product names mentioned herein are used for identification purposes only, and are trademarks or registered trademarks of their respective holders. U.S. PATENTS Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691; 5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending. LIFE RELATED POLICY In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence. Xicor’s products are not authorized for use in critical components in life support devices or systems. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. REV 1.1.1 3/5/01 www.xicor.com Characteristics subject to change without notice. 19 of 19