TI TPS60231RGTTG4

TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
WHITE LED CHARGE PUMP CURRENT SOURCE
WITH PWM BRIGHTNESS CONTROL
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Regulated Output Current With 0.4%
Matching
Drives up to 3 LEDs at 25 mA Each
LED Brightness Control Through PWM
Control Signal
High Efficiency by Fractional Conversion
With 1x and 1.5x Modes
1 MHz Switching Frequency
2.7 V to 6.5 V Operating Input Voltage Range
Internal Softstart Limits Inrush Current
Low Input Ripple and Low EMI
Overcurrent and Overtemperature Protected
Undervoltage Lockout With Hysteresis
Ultra-Small 3mm x 3mm QFN Package
APPLICATIONS
•
•
White LED Backlight for Color Displays in
Cellular Phones, Smart Phones, PDAs,
Handheld PCs, Digital Cameras, and
Camcorders
Keypad Backlight
DESCRIPTION
The TPS60231 charge pump is optimized for white
LED supplies in color display backlight applications.
The device provides a constant current for each LED,
which the initial value can be set by an external
resistor. The supply voltage ranges from 2.7 V to
6.5 V and is ideally suited for all applications powered
by a single LI-Ion battery cell or three to four NiCd,
NiMH, or alkaline battery cells. Over an input voltage
range from 3.1 V to 6.5 V, the device provides a high
output current of up to 25 mA per LED with a total of
75 mA. High efficiency is achieved by utilizing a
1x/1.5x fractional conversion technique in combination with very low dropout current sources. In
addition, the current controlled charge pump ensures
low input current ripple and EMI. Only two external
1 µF and two 0.47 µF capacitors are required to build
a complete small and low cost power supply solution.
To reduce board space to a minimum, the device
switches at 1 MHz operating frequency and is available in a small 16-pin QFN (RGT) package.
VIN = 2.7 V
to 6.5 V
VIN
VOUT
C1+
D1
C1−
D2
0.47 F
1 F
D3
0.47 F
C2+
C2−
1 F
EN1
EN2
GND
ISET
PGND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGED DEVICE (1) (2)
PACKAGE
MARKING
TPS60231RGTR
QFN
BKH
(1)
(2)
T indicates shipment in tape and reel on a mini reel with 250 units
per reel.
R indicates shipment in tape and reel with 3000 units per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
VI
Supply voltage
–0.3 V to 7 V
Voltage at EN1, EN2, VOUT, ISET
–0.3 V to VI
Output current at VOUT
150 mA
TJ
Maximum junction temperature
150°C
TA
Operating free-air temperature
–40°C to 85°C
Tst
Storage temperature
–65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
300°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS (1)
(1)
PACKAGE
TA≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
16-Pin QFN (RGT)
1.9 W
20 mW/°C
1W
760 mW
The thermal resistance junction to ambient of the QFN package is 52°C/W.
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
6.5
UNIT
Supply voltage at VIN
2.7
Maximum output current at VOUT
75
mA
1
µF
Ci
Input capacitor
Co
Output capacitor
0.47
1
Flying capacitor, C1, C2
0.22
0.47
Operating junction temperature
2
MAX
-40
V
µF
µF
125
°C
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
ELECTRICAL CHARACTERISTICS
VI = 3.6 V, EN1 = EN2 = VI, TA = -40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
SUPPLY VOLTAGE AND CURRENT
VI
Input voltage range
IO = 0 mA to 75 mA
2.7
6.5
V
VI = 4.2 V, x1-mode, EN1 = EN2 = 1, ISET = 20 µA
200
µA
IO = 0 mA, x1.5-mode
2.1
mA
EN2 = EN1 = GND
0.1
Overvoltage limit
LED1 unconnected, VI = 4.2 V
5.5
V
Startup time
CO = 1 µF, IDX≥ 0.9 IDX, set
375
µs
IQ
Operating quiescent current
ISD
Shutdown current
1
µA
CHARGE PUMP STAGE
VOUT
Softstart duration
160
f
Switching frequency
0.75
η
Efficiency
VI = 3.7 V, ILED = 15 mA each, VDX = 3.1 V
Shutdown temperature
Temperature rising
µs
1.25
MHz
83%
°C
160
Shutdown temperature hysteresis
Input current limit
1
EN2 = EN1 = 1, ISET = 100 µA
20
°C
350
mA
CURRENT SINKS
IDx
Recommended maximum current per current sink
3.2 V ≤ VI≤ 6.5 V
25
mA
IDx
Current into each current sink when ISET
is shorted to GND
3.0 V ≤ VI≤ 6.5 V, ISET shorted to GND
50
mA
Current matching between any two outputs
VDx = 3.1 V, TA = 25°C
Line regulation
3.2 V ≤ VI≤ 6.5 V, VDx = 3.1 V, EN1 = EN2 = 1,
ISET = 80 µA
VISET
Reference voltage for current set
Iset
Recommended ISET pin current range
K
IDx to ISET current ratio
200
EN2 = 1, EN1 = 0
400
Voltage at Dx to GND
580
600
4
EN2 = EN1 = 1, ISET = 80 µA
2%
±3%
EN2 = 0, EN1 = 1
EN2 = 1, EN1 = 1
Vsource
–2% 0.4%
230
mV
620
130
260
EN2 = 0, EN1 = 1
200
EN2 = 1, EN1 = 0
300
EN2 = 1, EN1 = 1
400
µA
280
mV
ENABLE 1, ENABLE 2
VIH
EN1, EN2 high level input voltage
VIL
EN1, EN2 low level input voltage
1.3
V
0.3
EN1, EN2 trip point hysteresis
50
V
mV
IIKG
EN2 input leakage current
EN1, EN2 = GND or EN2 = VI, VI = 6.5 V
0.01
1
µA
IIKG
EN1 input leakage current
EN1 = VI, VI = 4.2 V
11
15
µA
V(UVLO)
Undervoltage lockout threshold
Input voltage falling
2.1
V
50
mV
Undervoltage lockout hysteresis
Frequency range at PWM
0
Recommended ON-time for PWM signal
Shutdown delay time
50
2.5
Delay time when EN1 = EN2 go to GND after which
the TPS60231 shuts down completely
0.5
0.85
kHz
µs
1.5
ms
3
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
PIN ASSIGNMENT
12
13
11
C2+
C1+
C1−
C2−
QFN PACKAGE
(TOP VIEW)
9
10
VOUT
VIN
8
14
PGND
GND
7
15
D1
EN1
6
16
D2
EN2
5
D3
4
NC
3
NC
2
ISET
1
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
C1+
10
–
Connect to the flying capacitor C1
C1–
11
–
Connect to the flying capacitor C1
C2+
9
–
Connect to the flying capacitor C2
C2–
12
–
Connect to the flying capacitor C2
D1-D3
6-4
I
Current sink input. Connect the cathode of the white LEDs to these inputs.
EN1
15
I
Enable input. A logic high enables the converter, logic low forces the device into shutdown mode reducing
the supply current to less than 1 µA if EN2 is tied to GND.
EN2
16
I
An applied PWM signal reduces the LED current as a function of the duty cycle of the PWM signal. EN1 and
EN2 can be tied together for PWM dimming between 0 mA and the maximum set with ISET. EN1 and EN2
can also be used for digital dimming with 4 steps from 0 mA to the maximum current set with ISET. See the
application section for more details.
GND
14
–
Analog ground
ISET
1
I
Connect a resistor between this pin and GND to set the maximum current through the LEDs.
2, 3
–
No internal connection
PGND
7
–
Power ground
VIN
13
I
Supply voltage input
VOUT
8
0
Connect the output capacitor and the anode of the LEDs to this pin.
Power PAD
–
–
Connect with PGND and GND
NC
4
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
FUNCTIONAL BLOCK DIAGRAM
1 F
VOUT
C1+
0.47 F
Current
Sinks
C1−
C2+
0.47 F
VIN
Charge
Pump
D3
D2
D1
C2−
1 F
Reference
Control
ISET
EN1
EN2
RSET
PGND
GND
5
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED),
EN2 = 0, EN1 = 1
η
Efficiency
IQ Quiescent current
fs
1
vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED), EN2 =
1, EN1 = 0
2
vs Input voltage (ILED = 25 mA, 15 mA, 10 mA, 5 mA per LED),
EN2 = EN1 = 1
3
vs Input voltage (TA = –40°C, 25°C, 85°C) (measured with ID1 = 5 mA)
4
Maximum output current from charge pump
stage
vs Input voltage (TA = –40°C, 25°C, 85°C)
5
Switching frequency
vs Free-Air Temperature (TA = -40°C to 85°C, VI = 3.6 V)
6
LED current, ILED
vs Duty cycle on PWM (ILED max set to 20 mA)
For f = 32 kHz and f = 1 kHz, DC = 1% to 100%, VI = 3.6 V
7
Line transient response
VI and ID1 vs time on scope, LED current at D1 with
VI = 4.2 V to 3.6 V to 4.2 V with EN2 = EN1 = 11, 3 x 20 mA
8
Dimming response
PWM signal and current at D1 vs time on scope
f = 32 kHz and f = 1 kHz, VI = 3.6 V, duty cycle = 50%,
EN1 = EN2 = PWM
Startup timing
VI = 3.6 V, 3 x 20 mA, EN1 = EN2 = 00 changed to
EN2 = EN1 = 11
EFFICIENCY
vs
INPUT VOLTAGE
9, 10
11
EFFICIENCY
vs
INPUT VOLTAGE
100
100
ILED = 25 mA
90
90
ILED = 25 mA
80
80
70
60
60
ILED = 10 mA
50
40
Efficiency − %
Efficiency − %
ILED = 15 mA
70
ILED = 5 mA
20
20
10
10
3.5
3.9
4.3
4.7
5.1
5.5 5.9
VI − Input Voltage − V
Figure 1.
6
6.3
ILED = 5 mA
40
30
3.1
ILED = 10 mA
50
30
0
2.7
ILED = 15 mA
0
2.7
3.1
3.5
3.9 4.3 4.7 5.1 5.5
VI − Input Voltage − V
Figure 2.
5.9
6.3
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
EFFICIENCY
vs
INPUT VOLTAGE
QUIESCENT CURRENT
vs
INPUT VOLTAGE
90
3
2.8
80
IQ − Quiescent Current − mA
ILED = 25 mA
ILED = 15 mA
70
Efficiency − %
60
50
40
ILED = 10 mA
ILED = 5 mA
30
20
2.2
TA = 25C
2
1.8
1.6
TA = 85C
1.4
1.2
1
0.8
0.4
3.1 3.5
3.9 4.3 4.7 5.1 5.5
VI − Input Voltage − V
5.9
0.2
0
2.7
6.3
3.1 3.5
3.9 4.3 4.7 5.1 5.5
VI − Input Voltage − V
Figure 3.
Figure 4.
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
SWITCHING FREQUENCY
vs
FREE-AIR TEMPERATURE
0.15
5.9
6.3
1040
VLED = 3 V
TA = 25C
VI = 3.6 V
VLED = 3.2 V
1030
Switching Frequency − kHz
I O − Maximum Output Current − A
TA = −40C
2.4
0.6
10
0
2.7
2.6
VLED = 3.4 V
0.10
VLED = 3.6 V
VLED = 3.8 V
0.05
1020
1010
1000
990
0
2.7
3.1
3.5
3.9 4.3 4.7 5.1 5.5
VI − Input Voltage − V
Figure 5.
5.9
6.3
980
−40 −30 −20 −10 0 10 20 30 40 50 60 70 80
TA − Free-Air Temperature − C
Figure 6.
7
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
D1 LED CURRENT
vs
DUTY CYCLE
LINE TRANSIENT
25
500 mV/div
20
EN1 = 1, EN2 = 1, VI = 3.6 V to 4.2 V,
ILED = 20 mA, 3 LEDs Connected,
ILED(D1) Measured With 1 Resistor,
TA = 25C
VI
3.6 V
15
10
f = 32 kHz
1 mA/div
I LED(D1) − D1 LED Current − mA
VI = 3.6 V,
ILED max set to 20 mA
5
ILED(D1)
AC
f = 1 kHz
0
0
10
20
30
40 50 60 70
Duty Cycle − %
80
90
100
100 s/div
Figure 7.
Figure 8.
DIMMING RESPONSE
DIMMING RESPONSE
PWM
0V
2 V/div
2 V/div
PWM
0V
PWM Into EN1 and EN2, VI = 3.6 V,
ILED = 20 mA, 3 LEDs Connected,
f = 1 kHz, TA = 25C
ILED(D1)
0A
10 mA/div
10 mA/div
PWM Into EN1 and EN2, VI = 3.6 V,
ILED = 20 mA, 3 LEDs Connected,
f = 32 kHz, TA = 25C
ILED(D1)
0A
5 s/div
Figure 9.
8
200 s/div
Figure 10.
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
5 V/div
STARTUP TIMING
EN1 + EN2
0V
1 V/div
VO
0V
20 mA/div
ILED
VI = 3.6 V , ILED = 20 mA,
3 LED’s Connected,
TA = 25C
0A
20 s/div
Figure 11.
DETAILED DESCRIPTION
OPERATION
The TPS60231 uses a fractional conversion charge pump to generate a supply voltage for the integrated current
sinks. These current sinks are used to ensure a constant current for each LED. Depending on the input voltage
and programmed LED current, the charge pump either operates in the 1x mode or in the 1.5x mode. By
switching automatically between these two modes, the circuit optimizes power conversion efficiency as well as
extends operating time by allowing the discharge of the battery completely.
The charge pump can generate 75 mA of output current, so each of the 3 LED outputs can be powered with up
to 25 mA of current. The maximum LED current is set by a resistor connected to the ISET pin. This resistor
programs a reference current, which is current mirrored to set the LED current.
Applying a PWM signal to the EN1 pin and/or the EN2 pin controls the LED brightness. See a detailed
description in the section Analog Dimming Using ISET Pin.
LED CURRENT ADJUSTMENT (ISET)
A resistor programs a reference current, which is current mirrored to set the LED current. The voltage at the
ISET pin depends on the status of EN1 and EN2. The current in each LED is typically 260 times the current
through the resistor at ISET.
V
R
ISET K
ISET
I
LED
VISET— Voltage from ISET pin (0.2 V, 0.4 V or 0.6 V) to GND, see Table 1
ILED— Current per LED from Dx pin to GND
K — Dx to ISET current ratio (typically 260)
The LED current varies linearly from 0 mA to ILED(max) mA by applying a PMW signal with 0% to 100% duty cycle.
The LED brightness can however also be controlled by an analog control signal that is fed into the ISET pin.
9
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
DETAILED DESCRIPTION (continued)
SOFT START
The TPS60231 has an internal soft start circuit to limit the inrush current during startup. This prevents possible
voltage drops of the input voltage if a high impedance power source is connected to the input of the TPS60231.
When the device starts up with an output voltage that is below the input voltage, the output capacitor is charged
directly from the input with a current source. The output current increases linearly until the output reaches within
300 mV of the input voltage. When the programmed output current can be reached with the 1x mode, the
TPS60231 terminates the soft start and begins normal operation. When the desired output current cannot be
reached, the charge pump begins operation in 1.5x mode and pumps the output voltage up to the needed level
to reach the programmed output current.
ENABLE (EN1, EN2)
The enable pins EN1 and EN2 are used to enable the device or set it into shutdown. The TPS60231 is enabled if
one of the enable pins is pulled higher than the enable trip point of 1.3 V. The device starts up by going through
the soft start routine as described in the section Soft Start. Pulling both pins to GND, after a delay, programs the
device to shutdown. In shutdown, the charge pump, current sources, voltage reference, oscillator, and all other
functions are turned off and the supply current is reduced to 0.1 µA.
EN1 and EN2 can also be used for dimming. The logic levels at EN1 and EN2 set the minimum voltage at the
current mirrors and the voltage at the ISET pin to GND. This sets the current at the LEDs to be either the full
current or a fraction of the full current. See Table 1 for further details. The maximum current through the LEDs is
set by a resistor connected between ISET and GND.
EN1 and EN2 can also be used for PWM dimming. The PWM signal can either be applied to EN1 or EN2, or
both inputs can be tied together and the PWM signal can be applied to both pins. Depending on the
configuration, the current during PWM dimming is switched between 0 mA and its maximum (EN1 and EN2
connected to the PWM signal) or between 0 mA and 1/3 of the full LED current if EN2 = 0 and EN1 is toggled.
When EN1 = 0 and EN2 is toggled, the output current can be changed between 0 mA and 2/3 of the full range.
Table 1. Enable Levels
ENABLE LEVEL
MODE
LED CURRENT
0
SHUTDOWN
0
0
1
VISET = 200 mV
1/3
1
0
VISET = 400 mV
2/3
1
1
VISET = 600 mV
Full
EN2
EN1
0
UNDERVOLTAGE LOCKOUT
The undervoltage lockout circuit shuts down the device when the voltage at VIN drops below a typical threshold
of 2.15 V. This prevents damage to the device. The UVLO circuit allows the device to start up again after the
voltage on the VIN pin has increased by about 50 mV above the UVLO lockout threshold.
SHORT CIRCUIT AND OVERTEMPERTURE PROTECTION
The current at the VOUT pin is limited typically to 250 mA. When the junction temperature exceeds 160°C, the
device shuts down to protect the device from damage. After the temperature decreases to about 140°C, the
device starts up again if it is enabled.
OVERVOLTAGE PROTECTION AT VOUT
The device uses the voltage at D1 to regulate voltage at VOUT. In case D1 is not connected, an overvoltage
protection circuit ensures that the output voltage at VOUT does not exceed its limits. The connection of the LEDs
must be started using D1 first. For all other LEDs there is no restriction in the sequence. For example, if there
are only 2 LEDs used, the first LED is connected to D1 and the other LED can be connected to any other of the
D2 to D3 pins.
10
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
THEORY OF OPERATION/DESIGN PROCEDURE
Capacitor Selection
Ceramic capacitors such as X5R or X7R are recommended to be used with the TPS60231. For the two flying
capacitors C1 and C2, it is important to use low ESR capacitors to avoid unnecessary efficiency losses. Low
ESR capacitors on VOUT reduce the ripple voltage on the supply of the current sources. Table 2 lists capacitor
types that have been tested with the TPS60231.
Table 2. Capacitors
PART
VALUE
VOLTAGE
MANUFACTURER
SIZE
WEBSITE
C1608X5R1A105M
C1608X5R1A474M
C2012X7R1C105M
1 µF
0.47 µF
1µ F
10 V
10 V
16 V
TDK
0603
0603
0805
www.componnent.tdk.com
LMK107BJ105MA
LMK107BJ474MA
LMK212BJ105MG
1 µF
0.47 µF
1µ F
10 V
10 V
10 V
Taiyo Yuden
0603
0603
0805
www.t-yuden.com
Power Efficiency
The power conversion efficiency of the TPS60231 can be calculated by adding up the products of each LED
current and voltage and dividing it by the product of the input voltage and current. With a fully charged battery
where the input voltage is typically above the LED forward voltage, the charge pump operates in the 1x mode
and efficiency is very high. As the battery discharges, there is a point where the current sources no longer have
enough voltage overhead to maintain a constant current regulation. At that point, the charge pump switches into
the 1.5x mode. The conversion efficiency is lowest at the crossover. As the battery discharges further, the
efficiency again increases until at about 3.1 V where it reaches a second maximum. Below 3.1 V input voltage,
the maximum current per LED is less than 25 mA.
Power Dissipation
The maximum power dissipation inside the TPS60231 can be calculated based on the following equation:
PD max = [(1.5 × VI) – VO + 0.4 V] × IO
The maximum power dissipation occurs when the input voltage is just low enough to operate in 1.5x mode, with
a forward voltage of the white LED at maximum. This is typically for VI = 4.2 V and a forward voltage of 3.6 V.
This needs to be lower than the maximum allowed power dissipation of the package, which can be calculated
using the following equation:
T
T
A
P
Jmax
D max, package
R
ja
For example, the worst case power dissipation occurs at the input voltage level where the charge pump switches
from the 1x mode to the 1.5x mode. At this operating point, the supply voltage to the current sources is at its
maximum and the current sources must drop the most voltage in order to maintain a regulated output current.
The worst case power dissipation occurs when all 3 LED outputs are fully loaded with 25 mA of LED current.
• With: VI = 4.2 V, Vf = 3.6 V, IO = 75 mA (1.5x mode)
• PD max = 0.23 W
11
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
APPLICATION INFORMATION
TYPICAL APPLICATION OF A SMART PHONE DISPLAY WITH RESISTORS CONNECTED IN
PARALLEL
If more than 25 mA of output current is needed, then the input pins to the current sinks can be connected in
parallel as shown in the following application figure. This method can also be used to connect a LC display with
only two connections for the white LEDs.
VIN = 2.7 V
to 6.5 V
VIN
VOUT
C1+
D1
C1−
D2
0.47 F
1 F
D3
0.47 F
C2+
C2−
1 F
EN1
ISET
EN2
Typical Smartphone Display
GND
PGND
Figure 12. Typical Application With Resistors in Parallel
ANALOG DIMMING USING ISET PIN
The ISET pin can be used to connect an analog dc signal in the range of 0 mV to 600 mV (EN1 = EN2 = 1) for
analog dimming of the white LEDs. For an input voltage of 0 V at ISET, the current is at its maximum, whereas at
600 mV, the LED current is zero. The maximum current is:
• For EN2 = EN1 = 1: ILED = Vset/Rset × K = 0.6V/6kR × 260 = 26 mA per LED
• For EN2 = 1, EN0 = 1: ILED = Vset/Rset × K = 0.4V/6kR × 260 = 17 mA per LED
• For EN2 = 0, EN1 = 1: ILED = Vset/Rset × K = 0.2V/6kR × 260 = 8.6 mA per LED
• With EN2, EN1 set to 10 or 01, a voltage of 400 mV or 200 mV is required to set the LED current to zero.
VIN = 2.7 V
to 6.5 V
VIN
VOUT
C1+
D1
C1−
D2
0.47 F
1 F
D3
0.47 F
C2+
C2−
1 F
EN1
EN2
ISET
GND
6 k
V = 0 mV to
600 mV
PGND
Figure 13. Analog Dimming Connections Using ISET Pin
12
TPS60231
www.ti.com
SLVS544 – OCTOBER 2004
APPLICATION INFORMATION (continued)
TYPICAL APPLICATION USING 2 WHITE LEDs AND 6 GREEN LEDs FOR LCD BACKLIGHT AND
KEYBOARD LIGHTING
The TPS60231 can be used to power any kind of LED. It is also possible to mix white LEDs with color LEDs
which have a lower forward voltage. The LED with the highest forward voltage (typically the white LED) has to be
connected to D1, because the output voltage of the charge pump is regulated in such a way to keep the voltage
drop from D1 to GND at 400mV (with EN1 = EN2 = 1). Therefore the output voltage of the charge pump is
regulated to:
VOUT = VD1 + VFLEDD1
VOUT— Output voltage at VOUT
VD1— Voltage from D1 to GND (Vsource at D1 pin, see electrical characteristics)
VFLEDD1— Forward voltage of the LED connected to D1
Resistor Rg is used to provide current sharing between the 6 green LEDs. The upper value is calculated using:
V
V
FLEDD1
Fg
Rg Ig
VFg— Forward voltage of a green LED
Ig— Current per green LED
VIN = 2.7 V
to 6.5 V
VIN
VOUT
C1+
D1
C1−
D2
0.47 F
1 F
2 White
LEDs With
25 mA Each
D3
0.47 F
1 F
C2+
C2−
6 Green
LEDs With
4 mA Each
EN1
EN2
GND
ISET
Rg = 220 6.2 k
Sets Current to 25 mA
Per Current Sink
(With EN2 = EN1 = 1)
Figure 14. LED Connections for LCD Backlight and Keyboard Lighting
PROPOSED LAND PATTERN FOR PCB PRODUCTION
Refer to the application note SLUA271 for the proposed land pattern of the QFN package.
13
PACKAGE OPTION ADDENDUM
www.ti.com
11-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS60231RGTR
ACTIVE
QFN
RGT
16
3000 Green (RoHS &
no Sb/Br)
TPS60231RGTRG4
ACTIVE
QFN
RGT
16
3000
None
Call TI
TPS60231RGTT
ACTIVE
QFN
RGT
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
TPS60231RGTTG4
ACTIVE
QFN
RGT
16
250
None
Call TI
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
Level-2-260C-1 YEAR
Call TI
Level-2-260C-1 YEAR
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated