TI CD4541BMG4

[ /Title
(CD45
41B)
/Subject
(CMO
S Programmable
Timer
High
Voltage
Types
(20V
Rating))
/Autho
r ()
/Keywords
(Harris
Semiconductor,
CD400
0,
metal
gate,
CMOS
, pdip,
cerdip,
mil,
military,
mil
CD4541B
CMOS Programmable Timer
High Voltage Types (20V Rating)
Data sheet acquired from Harris Semiconductor
SCHS085E – Revised September 2003
Features
The output from this timer is the Q or Q output from the 8th,
10th, 13th, or 16th counter stage. The desired stage is chosen
using time-select inputs A and B (see Frequency Select Table).
• Low Symmetrical Output Resistance, Typically 100Ω
at VDD = 15V
The output is available in either of two modes selectable via the
MODE input, pin 10 (see Truth Table). When this MODE input is
a logic “1”, the output will be a continuous square wave having
a frequency equal to the oscillator frequency divided by 2N.
With the MODE input set to logic “0” and after a MASTER
RESET is initiated, the output (assuming Q output has been
selected) changes from a low to a high state after 2N-1 counts
and remains in that state until another MASTER RESET pulse
is applied or the MODE input is set to a logic “1”.
• Built-In Low-Power RC Oscillator
• Oscillator Frequency Range . . . . . . . . . . DC to 100kHz
• External Clock (Applied to Pin 3) can be Used Instead
of Oscillator
• Operates as 2N Frequency Divider or as a SingleTransition Timer
• Q/Q Select Provides Output Logic Level Flexibility
• AUTO or MASTER RESET Disables Oscillator During
Reset to Reduce Power Dissipation
Timing is initialized by setting the AUTO RESET input (pin 5) to
logic “0” and turning power on. If pin 5 is set to logic “1”, the
AUTO RESET circuit is disabled and counting will not start until
after a positive MASTER RESET pulse is applied and returns
to a low level. The AUTO RESET consumes an appreciable
amount of power and should not be used if low-power operation
is desired. For reliable automatic power-on reset, VDD should
be greater than 5V.
• Operates With Very Slow Clock Rise and Fall Times
• Capable of Driving Six Low Power TTL Loads, Three
Low-Power Schottky Loads, or Six HTL Loads Over
the Rated Temperature Range
• Symmetrical Output Characteristics
• 100% Tested for Quiescent Current at 20V
The RC oscillator, shown in Figure 2, oscillates with a
frequency determined by the RC network and is calculated
using:
• 5V, 10V, and 15V Parametric Ratings
• Meets All Requirements of JEDEC Standard No. 13B,
“Standard Specifications for Description of ‘B’ Series
CMOS Devices”
1
f = ----------------------------------2.3 R TC C TC
Description
CD4541B programmable timer consists of a 16-stage binary
counter, an oscillator that is controlled by external R-C components (2 resistors and a capacitor), an automatic power-on
reset circuit, and output control logic. The counter increments
on positive-edge clock transitions and can also be reset via the
MASTER RESET input.
Ordering Information
PART NUMBER
Pinout
CD4541B
(CERDIP, PDIP, SOIC, SOP, TSSOP)
TOP VIEW
RTC 1
14 VDD
CTC 2
13 B
RS 3
12 A
NC 4
11 NC
AUTO RESET 5
Where f is between 1kHz
and 100kHz
and R S ≥ 10k Ω and ≈ 2R TC
TEMP. RANGE
(oC)
-55 to 125
14 Ld CERDIP
CD4541BE
-55 to 125
14 Ld PDIP
CD4541BM
-55 to 125
14 Ld SOIC
CD4541BMT
-55 to 125
14 Ld SOIC
CD4541BM96
-55 to 125
14 Ld SOIC
CD4541BNSR
-55 to 125
14 Ld SOP
CD4541BPW
-55 to 125
14 Ld TSSOP
CD4541BPWR
-55 to 125
14 Ld TSSOP
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
10 MODE
MASTER RESET 6
9
Q/Q SELECT
VSS 7
8
OUTPUT
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
PACKAGE
CD4541BF3A
1
CD4541B
Functional Diagram
12
A
13
B
1
RTC
2
CTC
3
RS
5
AR
6
MR
10
MODE
9
Q/Q
SELECT
8
Q
VDD = PIN 14
VSS = PIN 7
12
13
†A †B
R
N
P
Q
1 OF 3
MUX
N
P
3
†RS
†CTC
†RTC
2
210 213
8-STAGE
COUNTER
OSC
1
AUTO
RESET†
9
216
OR
28
†Q/Q SELECT
VDD
8-STAGE
COUNTER
R
R
10
†MODE
R
5
8
PWR ON
RESET
VSS
VDD = 14
VSS = 7
6
MANUAL RESET†
† All inputs are protected by CMOS Protection Network.
NC = 4, 11
FIGURE 1.
FREQUENCY SELECTION TABLE
A
B
NO. OF
STAGES N
COUNT 2N
0
0
13
8192
0
1
10
1024
1
0
8
256
1
1
16
65536
3
RS
CTC
TRUTH TABLE
STATE
PIN
0
TO CLOCK
CKT
2
INTERNAL
RESET
1
1
5
Auto Reset On
6
Master Reset Off
Master Reset On
9
Output Initially Low After
Reset (Q)
Output Initially High After
Reset (Q)
10
Single Transition Mode
Recycle Mode
RTC
Auto Reset Disable
FIGURE 2. RC OSCILLATOR CIRCUIT
2
CD4541B
Absolute Maximum Ratings
Thermal Information
DC Supply - Voltage Range, VDD
Voltages Referenced to VSS Terminal . . . . . . . . . . -0.5V to +20V
Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VDD +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . ±10mA
Device Dissipation Per Output Transistor
For TA = Full Package Temperature Range
(All Package Types) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mW
Package Thermal Impedance, θJA (see Note 1)
PDIP package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80oC/W
SOIC package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86oC/W
SOP package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76oC/W
TSSOP package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113oC/W
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range (TSTG) . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s)
At Distance 1/16in ± 1/32in (1.59mm ±0.79mm)
from case for 10s Maximum . . . . . . . . . . . . . . . . . . . . . . . . 265oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range TA . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range
For TA = Full Package Temperature Range . . . . . 3V (Min), 18V (Typ)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Electrical Specifications
LIMITS AT INDICATED TEMPERATURES (oC)
CONDITIONS
PARAMETER
Quiescent Device
Current,
(Note 2) IDD (Max)
Output Low (Sink)
Current lOL (Min)
Output High (Source)
Current, IOH (Min)
Output Voltage:
Low-Level, VOL (Max)
Output Voltage:
High-Level, VOH (Min)
Input Low Voltage,
VIL (Max)
25
VO
(V)
VIN
(V)
VDD
(V)
-55
-40
85
125
MIN
TYP
MAX
UNITS
-
0, 5
5
5
5
150
150
-
0.04
5
μA
-
0, 10
10
10
10
300
300
-
0.04
10
μA
-
0, 15
15
20
20
600
600
-
0.04
20
μA
-
0, 20
20
100
100
3000
3000
-
0.08
100
μA
0.4
0, 5
5
1.9
1.85
1.26
1.08
1.55
3.1
-
mA
0.5
0, 10
10
5
4.8
3.3
2.8
4
8
-
mA
1.5
0, 15
15
12.6
12
8.4
7.2
10
20
-
mA
4.6
0, 5
5
-1.9
-1.85
-1.26
-1.08
-1.55
-3.1
-
mA
2.5
0, 5
5
-6.2
-6
-4.1
-3
-5
-10
-
mA
9.5
0, 10
10
-5
-4.8
-3.3
-2.8
-4
-8
-
mA
13.5
0, 15
15
-12.6
-12
-8.4
-7.2
-10
-20
-
mA
-
0, 5
5
-
0.05
-
0
0.05
V
-
0, 10
10
-
0.05
-
0
0.05
V
-
0, 15
15
-
0.05
-
0
0.05
V
-
0, 5
5
-
4.95
4.95
5
-
V
-
0, 10
10
-
9.95
9.95
10
-
V
-
0, 15
15
-
14.95
14.95
15
-
V
0.5, 4.5
-
5
-
1.5
-
-
1.5
V
1, 9
-
10
-
3
-
-
3
V
1.5, 13.5
-
15
-
4
-
-
4
V
3
CD4541B
Electrical Specifications
(Continued)
LIMITS AT INDICATED TEMPERATURES (oC)
CONDITIONS
25
VO
(V)
VIN
(V)
VDD
(V)
-55
0.5, 4.5
-
5
-
1, 9
-
10
1.5, 13.5
-
-
0, 18
PARAMETER
Input High Voltage,
VIH (Min)
Input Current, lIN (Max)
-40
85
MIN
TYP
MAX
UNITS
3.5
3.5
-
-
V
-
7
7
-
-
V
15
-
11
11
-
-
V
18
±0.1
-
±10-5
±0.1
μA
±0.1
±1
125
±1
NOTE:
2. With AUTO RESET enabled, additional current drain at 25oC is:
7μA (Typ), 200μA (Max) at 5V;
30μA (Typ), 350μA (Max) at 10V;
80μA (Typ), 500μA (Max) at 15V
Dynamic Electrical Specifications
PARAMETER
Propagation Delay Times
Clock to Q
TA = 25oC, Input tr , tf = 20ns, CL = 50pF, RL = 200kΩ
SYMBOL
VDD (V)
MIN
TYP
MAX
UNITS
(28) tPHL , tPLH
5
-
3.5
10.5
μs
10
-
1.25
3.8
μs
15
-
0.9
2.9
μs
5
-
6.0
18
μs
10
-
3.5
10
μs
15
-
2.5
7.5
μs
5
-
100
200
ns
10
-
50
100
ns
15
-
40
80
ns
5
-
180
360
ns
10
-
90
180
ns
15
-
65
130
ns
5
900
300
-
ns
10
300
100
-
ns
15
225
85
-
ns
5
-
1.5
-
MHz
10
-
4
-
MHz
15
-
6
-
MHz
(216) tPHL , tPLH
Transition Time
tTHL
tTHL
MASTER RESET, CLOCK
Pulse Width
Maximum Clock Pulse Input
Frequency
Maximum Clock Pulse Input
Rise or Fall time
fCL
tr , tf
5, 10, 15
Unlimited
4
μs
CD4541B
Digital Timer Application
A positive pulse on MASTER RESET resets the counters
and latch. The output goes high and remains high until the
number of pulses, selected by A and B, are counted. This
circuit is retriggerable and is as accurate as the input frequency. If additional accuracy is desired, an external clock
can be used on pin 3. A setup time equal to the width of the
one-shot output is required immediately following initial
power up, during which time the output will be high.
VDD
RTC
CTC
RS
AR
MR
INPUT
1
14
2
3
4
5
6
13
12
11
10
9
7
8
B
A
OUTPUT
t
FIGURE 3. DIGITAL TIMER APPLICATION CIRCUIT
5
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD4541BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4541BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4541BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4541BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
CD4541BM
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BM96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BM96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BM96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BMT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BNSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BNSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4541BPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
Lead/Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD4541BM96
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4541BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4541BPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4541BM96
SOIC
D
14
2500
346.0
346.0
33.0
CD4541BNSR
SO
NS
14
2000
346.0
346.0
33.0
CD4541BPWR
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated