ZETEX ZXM62N03E6TA

ZXM62N03E6
30V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
V(BR)DSS=30V; RDS(ON)=0.11V; ID=3.2A
DESCRIPTION
This new generation of high density MOSFETs from Zetex utilise a unique
structure that combines the benefits of low on-resistance with fast switching
speed. This makes them ideal for high efficiency, low voltage, power
management applications.
SOT23-6
FEATURES
•
Low on-resistance
•
Fast switching speed
•
Low threshold
•
Low gate drive
•
SOT23-6 package
APPLICATIONS
•
DC - DC Converters
•
Power Management Functions
•
Disconnect switches
•
Motor control
ORDERING INFORMATION
DEVICE
REEL SIZE
(inches)
TAPE WIDTH (mm)
QUANTITY
PER REEL
Top View
ZXM62N03E6TA
7
8mm embossed
3000 units
ZXM62N03E6TC
13
8mm embossed
10000 units
DEVICE MARKING
•
2N03
PROVISIONAL ISSUE A - MAY 1999
97
ZXM62N03E6
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
V DSS
30
V
Gate Source Voltage
V GS
± 20
V
Continuous Drain Current (V GS=10V; T A=25°C)(b)
(V GS=10V; T A=70°C)(b)
ID
3.2
2.6
A
Pulsed Drain Current (c)
I DM
18
A
Continuous Source Current (Body Diode) (b)
IS
2.1
A
Pulsed Source Current (Body Diode)
I SM
18
A
Power Dissipation at T A=25°C (a)
Linear Derating Factor
PD
1.1
8.8
W
mW/°C
Power Dissipation at T A=25°C (b)
Linear Derating Factor
PD
1.7
13.6
W
mW/°C
VALUE
UNIT
THERMAL RESISTANCE
PARAMETER
SYMBOL
Junction to Ambient (a)
R θJA
113
°C/W
Junction to Ambient (b)
R θJA
73
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t<5 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal
Impedance graph.
PROVISIONAL ISSUE A - MAY 1999
98
ZXM62N03E6
Max Power Dissipation (Watts)
CHARACTERISTICS
100
10
0.1
Thermal Resistance (°C/W)
DC
1s
100ms
10ms
1ms
100µs
1
1
0.1
10
100
1.5
Refer Note (b)
Refer Note (a)
1
0.5
0
0
20
40
60
100
80
120
T - Temperature (°)
Safe Operating Area
Derating Curve
80
Refer Note (b)
60
40
D=0.5
20
D=0.2
D=0.1
D=0.05
0
0.0001
2
VDS - Drain-Source Voltage (V)
Thermal Resistance (°C/W)
ID - Drain Current (A)
Refer Note (a)
0.001
Single Pulse
0.01
0.1
1
10
160
120
Refer Note (a)
100
80
60
D=0.5
40
D=0.2
20
D=0.1
D=0.05
Single Pulse
0
0.0001 0.001 0.01
100
140
0.1
1
10
100
1000
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Transient Thermal Impedance
PROVISIONAL ISSUE A - MAY 1999
99
ZXM62N03E6
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN.
TYP.
MAX.
UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
V (BR)DSS
Zero Gate Voltage Drain Current
I DSS
Gate-Body Leakage
I GSS
Gate-Source Threshold Voltage
V GS(th)
Static Drain-Source On-State Resistance (1)
R DS(on)
Forward Transconductance
g fs
30
V
I D=250µA, V GS=0V
1
µA
V DS=30V, V GS=0V
100
nA
V GS=± 20V, V DS=0V
V
I D =250µA, V DS= V GS
Ω
Ω
V GS=10V, I D=2.2A
V GS=4.5V, I D=1.1A
S
V DS=10V,I D=1.1A
1.0
0.11
0.15
1.1
DYNAMIC (3)
Input Capacitance
C iss
380
pF
Output Capacitance
C oss
90
pF
Reverse Transfer Capacitance
C rss
30
pF
Turn-On Delay Time
t d(on)
2.9
ns
Rise Time
tr
5.6
ns
Turn-Off Delay Time
t d(off)
11.7
ns
Fall Time
tf
6.4
ns
Total Gate Charge
Qg
9.6
nC
Gate-Source Charge
Q gs
1.7
nC
Gate Drain Charge
Q gd
2.8
nC
Diode Forward Voltage (1)
V SD
0.95
V
T j=25°C, I S=2.2A,
V GS=0V
Reverse Recovery Time (3)
t rr
18.8
ns
T j=25°C, I F=2.2A,
di/dt= 100A/µs
Reverse Recovery Charge (3)
Q rr
11.4
nC
V DS=25 V, V GS=0V,
f=1MHz
SWITCHING(2) (3)
V DD =15V, I D=2.2A
R G=6.0Ω, R D=6.7Ω
(refer to test
circuit)
V DS=24V,V GS=10V,
I D =2.2A (refer to
test circuit)
SOURCE-DRAIN DIODE
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
PROVISIONAL ISSUE A - MAY 1999
100
ZXM62N03E6
TYPICAL CHARACTERISTICS
100
100
+150°C
ID - Drain Current (A)
10V 8V 7V 6V
VGS
5V
4.5V
10
4V
3.5V
1
3V
0.1
1
0.1
10
3.5V
1
3V
0.1
10
1
100
Output Characteristics
T=150 C
T=25 C
1
2.5
3
3.5
4
4.5
5
5.5
6
6.5
1.6
1.4
RDS(on)
1.2
VGS=10V
ID=2.2A
1.0
VGS=VDS
ID=250uA
0.8
VGS(th)
0.6
0.4
-100
-50
0
100
50
150
200
VGS - Gate-Source Voltage (V)
Tj - Junction Temperature (°C)
Typical Transfer Characteristics
Normalised RDS(on) and VGS(th)
v Temperature
ISD - Reverse Drain Current (A)
ID - Drain Current (A)
RDS(on) - Drain-Source On-Resistance (Ω)
4.5V
4V
Output Characteristics
10
10
1
VGS=3V
VGS=4.5V
0.1
VGS=10V
0.01
5V
VDS - Drain-Source Voltage (V)
VDS=10V
2
VGS
VDS - Drain-Source Voltage (V)
100
0.1
10V 8V 7V 6V
10
0.1
100
Normalised RDS(on) and VGS(th)
ID - Drain Current (A)
+25°C
0.1
1
10
100
100
10
1
T=150°C
T=25°C
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
ID - Drain Current (A)
VSD - Source-Drain Voltage (V)
On-Resistance v Drain Current
Source-Drain Diode Forward Voltage
PROVISIONAL ISSUE A - MAY 1999
101
ZXM62N03E6
TYPICAL CHARACTERISTICS
VGS - Gate-Source Voltage (V)
500
C - Capacitance (pF)
Vgs=0V
f=1Mhz
500
Ciss
Coss
Crss
400
300
200
100
0
0.1
1
10
100
10
ID=2.2A
9
8
7
VDS=15V
6
VDS=24V
5
4
3
2
1
0
0
1
2
3
4
5
6
7
8
VDS - Drain Source Voltage (V)
Q -Charge (nC)
Capacitance v Drain-Source Voltage
Gate-Source Voltage v Gate Charge
Basic Gate Charge Waveform
Gate Charge Test Circuit
Switching Time Waveforms
Switching Time Test Circuit
PROVISIONAL ISSUE A - MAY 1999
102
ZXM62N03E6
PACKAGE DIMENSIONS
b
PAD LAYOUT DETAILS
e
L 2
E1
E
DATUM A
a
e1
D
C
A
A2
DIM
A1
Millimetres
Inches
Min
Max
Min
Max
A
0.90
1.45
0.35
0.057
A1
0.00
0.15
0
0.006
A2
0.90
1.30
0.035
0.051
b
0.35
0.50
0.014
0.019
C
0.09
0.20
0.0035
0.008
D
2.80
3.00
0.110
0.118
E
2.60
3.00
0.102
0.118
E1
1.50
1.75
0.059
0.069
L
0.10
0.60
0.004
0.002
Zetex plc.
Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom.
Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries)
Fax: (44)161 622 4420
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
Zetex Inc.
47 Mall Drive, Unit 4
Commack NY 11725
USA
Telephone: (516) 543-7100
Fax: (516) 864-7630
Zetex (Asia) Ltd.
3510 Metroplaza, Tower 2
Hing Fong Road,
Kwai Fong, Hong Kong
Telephone:(852) 26100 611
Fax: (852) 24250 494
These are supported by
agents and distributors in
major countries world-wide
Zetex plc 1999
Internet:http://www.zetex.com
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any
purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the
right to alter without notice the specification, design, price or conditions of supply of any product or service.
PROVISIONAL ISSUE A - MAY 1999
104