HITACHI 2SC4628

2SC4628
Silicon NPN Planar
Application
High frequency amplifier
Outline
TO-92 (2)
1. Emitter
2. Collector
3. Base
3
2
1
2SC4628
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
20
V
Collector to emitter voltage
VCEO
20
V
Emitter to base voltage
VEBO
3
V
Collector current
IC
20
mA
Collector power dissipation
PC
200
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
20
—
—
V
I C = 10 µA, IE = 0
Collector to emitter breakdown
voltage
V(BR)CEO
20
—
—
V
I C = 1 mA, RBE = ∞
Emitter cutoff current
I EBO
—
—
10
µA
VEB = 3 V, IC = 0
Collector cutoff current
I CBO
—
—
1
µA
VCB = 15 V, IE = 0
DC current transfer ratio
hFE
60
—
320
Gain bandwidth product
fT
600
—
—
MHz
VCE = 10 V, IC = 2 mA
Reverse transfer capacitance
Cre
—
—
0.9
pF
VCB = 10 V, IE = 0,
emitter common,
f = 1 MHz
Power gain
PG
10
—
—
dB
VCB = 10 V, IC = 2 mA,
f = 800 MHz
Noise figure
NF
—
—
7.0
dB
2
VCE = 10 V, IC = 2 mA
2SC4628
DC Current Transfer Ratio vs.
Collector Current
Maximum Collector Dissipation Curve
100
DC Current Transfer Ratio hFE
Collector Power Dissipation PC (mW)
300
200
100
VCE = 10 V
80
60
40
20
0
50
100
Ambient Temperature Ta (°C)
0
1
150
Gain Bandwidth Product vs.
Collector Current
1600
1200
800
400
0
50
Ceverse Transfer Capacitance Cre (pF)
Gain Bandwidth Product fT (MHz)
VCE = 10 V
2
5
10
20
Collector Current IC (mA)
50
Reverse Transfer Capacitance vs.
Collector to Base Voltage
2000
1
2
5
10
20
Collector Current IC (mA)
5
f = 1 MHz
IE = 0
2
1.0
0.5
0.2
0.1
1
2
5
10
20
50
Collector to Base Voltage VCB (V)
3
2SC4628
Power Gain vs. Collector Current
Noise Figure vs. Collector Current
20
VCB = 10 V
f = 800 MHz
Noise Figure NF (dB)
16
Power Gain PG (dB)
10
12
8
4
2
4
6
8
Collector Currrent IC (mA)
0
8
6
4
2
0
10
VCB = 10 V
f = 800 MHz
2
4
6
8
Collector Currrent IC (mA)
800 MHz Power Gain and Noise Figure Test Circuit
Input
Rg = 50 Ω
40 p
100 p
D.U.T.
50 p
Output
RL = 50 Ω
L
RFC
390
C
2.2 k
1000 p
1000 p
IC
VAGC
VCC
C
L
: 0.5 to 10 pF variable capacitance
: λ/4 silver platede copper 26 × 3 × 1 (mm)
Collector tap to ground distance: 7 mm
Output tap to ground distance: 3 mm
RFC : 0.17 mm copper wire, 2.4 mm inside dia, 16 turns
–3 dB down bandwidth is 40 MHz
4
Unit
R:Ω
C:F
10
Unit: mm
4.8 ± 0.3
2.3 Max
0.7
0.60 Max
0.45 ± 0.1
12.7 Min
5.0 ± 0.2
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-92 (2)
Conforms
Conforms
0.25 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.