PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 SINGLE 10-A OUTPUT, 4.75-V to 14-V INPUT, NON-ISOLATED, DIGITAL POWERTRAIN™ MODULE Check for Samples: PTD08A210W FEATURES DESCRIPTION • • • The PTD08A210W is a high-performance single 10-A output, non-isolated digital PowerTrain module. This module is the power conversion section of a digital power system which incorporates TI's UCD7242 MOSFET/driver IC. The PTD08A210W must be used in conjunction with a digital power controller such as the UCD9240, UCD9220 or UCD9110 family. The PTD08A210W receives control signals from the digital controller and provides parametric and status information back to the digital controller. Together, PowerTrain modules and a digital power controller form a sophisticated, robust, and easily configured power management solution. 1 2 • • • • • Single 10-A Output 4.75-V to 14-V Input Voltage Programmable Wide-Output Voltage (0.7 V to 3.6 V) Efficiencies up to 96% Digital I/O – PWM signal – Fault Flag (FF) – Sychronous Rectifier Enable (SRE) Analog I/O – Temperature – Output currrent Safety Agency Approvals: – UL/IEC/CSA-C22.2 60950-1 Operating Temperature: –40°C to 85°C APPLICATIONS • Digital Power Systems using UCD9XXX Digital Controllers Operating from an input voltage range of 4.75 V to 14 V, the PTD08A210W provides step-down power conversion to a wide range of output voltages from, 0.7 V to 3.6 V. The wide input voltage range makes the PTD08A210W particularly suitable for advanced computing and server applications that utilize a loosely regulated 8-V, 9.6-V or 12-V intermediate distribution bus. Additionally, the wide input voltage range increases design flexibility by supporting operation with tightly regulated 5-V or 12-V intermediate bus architectures. The module incorporates output over-current and temperature monitoring which protects against most load faults. Output current and module temperature signals are provided for the digital controller to permit user defined over-current and over-temperature warning and fault scerarios. The module uses single-sided, pin-less surface mount construction to provide a low profile and compact footprint. The package is lead (Pb) - free and RoHS compatible. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. POWERTRAIN is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Standard PTD08A210W Application Digital Lines to/from Digital Controller VI 4 5 6 PWM SRE FF VOUT 1 VIN VOUT 16 2 VIN VOUT 15 PTD08A210W PGND 14 + PGND 13 CIN1 330 mF (Recommended) CIN2 22 mF (Required) PGND 3 TSENSE ISENSE 12 11 CO1 + 47 mF (Required) CO2 330 mF (Recommended) AGND AGND PGND PGND 10 9 8 7 GND GND Analog Lines to Digital Controller UDG-10063 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. DATASHEET TABLE OF CONTENTS DATASHEET SECTION PAGE NUMBER ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS 3 ELECTRICAL CHARACTERISTICS TABLE 4 TERMINAL FUNCTIONS 5 TYPICAL CHARACTERISTICS (VI = 12V) 6 TYPICAL CHARACTERISTICS (VI = 5V) 7 TYPICAL APPLICATION SCHEMATIC 9 GRAPHICAL USER INTERFACE VALUES 10 TAPE & REEL AND TRAY DRAWINGS 11 ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS (Voltages are with respect to GND) UNIT VI Input voltage TA Operating temperature range Over VI range 16 Treflow Solder reflow temperature Surface temperature of module body Tstg Storage temperature 260 (1) (1) °C –55 to 125 Mechanical shock Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 275 Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000 Hz 10 Weight MTBF V –40 to 85 Reliability Per Telcordia SR-332, 50% stress, TA = 40°C, ground benign Flammability Meets UL94V-O G 3.9 grams 13.3 106 Hr During reflow do not elevate peak temperature of the module or internal components above the stated maximum. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W 3 PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS PTD08A210W TA= 25°C, FSW= 750kHz, VI= 12 V, VO= 1.2 V, CIN1= 330 µF, CIN2= 22 µF ceramic, CO1= 47 µF ceramic, CO2= 330 µF, IO= IO(max) (unless otherwise stated) PARAMETER TEST CONDITIONS PTD08A210W MIN IO Output current Over VO range VI Input voltage range VOADJ Output voltage adjust range Efficiency h 25°C, natural convection 10 A Over IO range 4.75 14 V Over IO range 0.7 3.6 (1) V IO = 10 A, fs = 750 kHz VO Ripple (peak-to-peak) 20-MHz bandwidth IB Bias current PWM & SRE to AGND VIH High-level input voltage VIL Low-level input voltage VO = 3.3 V 92.0% VO = 2.5 V 90.4% VO = 1.8 V 88.4% VO = 1.2 V 84.7% VO = 0.8 V 80.0% 11 Standby SRE & PWM input levels VOL 0.8 Frequency range 500 Pulse width limits ILIM -5 2.7 720 mV 3.3 0 0.15 Gain, 3A ≤ IO ≤ 10A 188 0 Offset, IO = 0A, VO = 1.2V CO External output capacitance Ceramic Equivalent series resistance (non-ceramic) (1) (2) (3) (4) (5) (6) 4 22 (3) 47 (4) Nonceramic Ceramic 1 (6) V A 3.5 V 200 212 mV/A 0.3 0.6 10 Nonceramic Capacitance Value 0.6 15 (2) Range °C mV/°C Low-level output voltage, IFAULT = 4mA External input capacitance °C 10 Output Impedance CI 125 5 Slope Overcurrent threshold; Reset, followed by auto-recovery IOUT output kHz ns -40 Accuracy, -40°C ≤ TA ≤ 85°C V 1000 20 High-level output voltage, IFAULT = 4mA FAULT output mA 5.5 (1) Offset, TA = 25°C VOH mVPP 6 2.0 Range TEMP output MAX 0 VOPP PWM input TYP UNIT 330 (3) 330 (4) V kΩ µF 5000 (5) µF mΩ When operating at 12V input and 500kHz, VO is limited to ≤ 2.0V. The current limit threshold is the sum of IO and the peak inductor ripple current. A 22 µF ceramic input capacitor is required for proper operation. An additional 330 µF bulk capacitor rated for a minimum of 500mA rms of ripple current is recommended. When operating at frequencies > 500kHz the 22 µF ceramic capacitor is only recommended. Refer to the UCD9240 controller datasheet and user interface for application specific capacitor specifications. A 47 µF ceramic output capacitor is required for basic operation. An additional 330 µF bulk capacitor is recommended for improved transient response. Refer to the UCD9240 controller datasheet and user interface for application specific capacitor specifications. 5,000 µF is the calculated maximum output capacitance given a 1V/msec output voltage rise time. Additional capacitance or increasing the output voltage rise rate may trigger the overcurrent threshold at start-up. Refer to the UCD9240 controller datasheet and user interface for application specific capacitor specifications. This is the minimum ESR for all non-ceramic output capacitance. Refer to the UCD9240 controller datasheet and user interface for application specific capacitor specifications. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 TERMINAL FUNCTIONS TERMINAL NAME VIN PGND NO. 1, 2 DESCRIPTION The positive input voltage power node to the module, which is referenced to common GND. 3, 7, 8, 13, The common ground connection for the VI and VO power connections. 14 VOUT 15, 16 ISENSE 11 Current sense output. The voltage level on this pin represents the average output current of the module. PWM 4 The PWM input pin. It is a high impedance digital input that accepts 3.3-V or 5-V logic level signals up to 1 MHz. FF 6 Current limit fault flag. The Fault signal is a 3.3-V digital output which is latched high after an over-current condition. The Fault is reset after a complete PWM cycle without an over-current condition (falling edge of the PWM). SRE 5 Synchronous Rectifier Enable. This pin is a high impedance digital input. A 3.3 V or 5 V logic level signals is used to enable the synchronous rectifier switch. When this signal is high, the module will source and sink output current. When this signal is low, the module will only source current. AGND 9, 10 TSENSE 12 Thermal Pad The regulated positive power output with respect to GND. Analog ground return. It is the 0 Vdc reference for the control inputs. Temperature sense output. The voltage level on this pin represents the temperature of the module. This pad is electrically connected to PGND and is the primary thermal conduction cooling path for the module. This pad should be soldered to a grounded copper pad on the host board. For optimum cooling performance, the grounded copper pad should also be tied with multiple vias to the host board internal ground plane. See the Land Pattern drawing for package ECY for recommended pad dimensions. 1 1 XX XX 16 VOUT 16 2 15 VOUT 15 PGND 3 14 PGND 14 PWM 4 13 PGND 13 4 SRE 5 12 TSENSE 12 5 FF 6 11 ISENSE 11 6 PGND 7 10 AGND 10 7 PGND 8 9 AGND 9 8 VIN VIN TOP VIEW 2 Thermal Pad 3 BOTTOM VIEW Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W 5 PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS (VI = 12 V) . (1) (2) 100 100 VIN =12 V fSW =500 kHZ 100 VIN =12 V fSW =750 kHZ 95 90 85 85 75 70 Efficiency (%) 90 85 80 80 75 70 65 65 60 55 55 50 2 4 6 8 10 2 Output Current (A) 4 6 8 10 0 1.5 1 1 0.5 2 4 6 8 10 1 0.5 VIN =12 V fSW =750 kHZ 0 2 4 6 8 10 0 Figure 5. Power Dissipation 80 60 50 40 VIN =12 V fSW = 500 kHz VOUT < 2.0 V Natural Convection 60 50 40 VIN =12 V fSW = 750 kHz All VOUTValues 30 20 TA – Ambient Temerature – °C 80 TA – Ambient Temerature – °C 80 70 2 4 6 8 10 8 10 Natural Convection 70 60 50 40 VIN =12 V fSW = 1 MHz All VOUTValues 30 20 0 6 Figure 6. Power Dissipation 90 Natural Convection 4 Output Current (A) 90 30 2 Output Current (A) 90 70 VIN =12 V fSW =1 MHZ 0 Output Current (A) Figure 4. Power Dissipation 10 1.5 0 2 8 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 1.5 0 6 3 2 VIN =12 V fSW =500 kHZ 4 Output Current (A) Power Dissipation (W) 2 0 2 Figure 3. Efficiency VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 Power Dissipation (W) Power Dissipation (W) 55 3 0.5 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 60 Output Current (A) VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 TA – Ambient Temerature – °C 65 Figure 2. Efficiency 3 6 70 50 0 Figure 1. Efficiency (2) 75 50 0 (1) 80 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 60 VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V VIN =12 V fSW =1 MHZ 95 90 Efficiency (%) Efficiency (%) 95 20 0 2 4 6 8 10 0 2 4 6 8 IOUT – Output Current – A IOUT – Output Current – A IOUT – Output Current – A Figure 7. Safe Operating Area Figure 8. Safe Operating Area Figure 9. Safe Operating Area 10 The electrical characteristic data (Figure 1 through Figure 6) has been developed from actual products tested at 25°C. This data is considered typical for the converter. The temperature derating curves (Figure 7 through Figure 9) represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to modules soldered directly to a 100-mm x 100-mm, double-sided PCB with 2-oz. copper. See the Safe Operating Area application section of this datasheet. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 100 100 95 95 95 90 90 90 85 85 85 80 75 70 65 VIN =5 V fSW =500 kHZ 55 80 75 70 65 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 60 Efficiency (%) 100 Efficiency (%) 60 VIN =5 V fSW =750 kHZ 55 50 2 4 6 8 10 2 Output Current (A) 8 10 0 1.5 1 4 6 8 1 0.5 10 2 1 0.5 2 4 6 8 10 TA – Ambient Temerature – °C Natural Convection 60 50 40 VIN = 5 V fSW = 500 kHz All VOUT Values 90 80 80 Natural Convection 70 6 8 10 4 6 8 10 Figure 15. Power Dissipation 60 50 40 VIN = 5 V fSW = 750 MHz All VOUTValues Natural Convection 70 60 50 40 VIN = 5 V fSW = 1 MHz All VOUTValues 30 20 4 2 Output Current (A) 90 30 20 2 0 Figure 14. Power Dissipation 100 LFM 30 VIN =5 V fSW =1 MHZ Output Current (A) 80 10 0 0 90 8 1.5 VIN =5 V fSW =750 kHZ Output Current (A) Figure 13. Power Dissipation 6 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 0 2 4 Output Current (A) 1.5 VIN =5 V fSW =500 kHZ 0 2 Figure 12. Efficiency Power Dissipation (W) Power Dissipation (W) Power Dissipation (W) 6 3 2 0 TA – Ambient Temerature – °C 4 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 0.5 VIN =5 V fSW =1 MHZ 55 3 2 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 60 Output Current (A) VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V 2.5 (2) 65 Figure 11. Efficiency 3 (1) 70 50 0 Figure 10. Efficiency 0 75 50 0 70 80 VOUT=3.3 V VOUT=2.5 V VOUT=1.8 V VOUT=1.2 V VOUT=0.8 V TA – Ambient Temerature – °C Efficiency (%) TYPICAL CHARACTERISTICS (VI = 5 V) . (1) (2) 20 0 2 4 6 8 10 0 2 4 6 8 IOUT – Output Current – A IOUT – Output Current – A IOUT – Output Current – A Figure 16. Safe Operating Area Figure 17. Safe Operating Area Figure 18. Safe Operating Area 10 The electrical characteristic data (Figure 10 through Figure 15) has been developed from actual products tested at 25°C. This data is considered typical for the converter. The temperature derating curves (Figure 16 through Figure 18) represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to modules soldered directly to a 100-mm x 100-mm, double-sided PCB with 2-oz. copper. See the Safe Operating Area application section of this datasheet. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W 7 PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com TYPICAL CHARACTERISTICS CURRENT SENSE OUTPUT vs OUTPUT CURRENT CURRENT SENSE OUTPUT vs OUTPUT CURRENT 1.2 1.0 0.8 0.6 0.4 0.2 VTSENSE – Temperature Sense Output Voltage – V 1.6 1.4 0 VI = 5 V 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 8 2.0 2.0 VI = 12 V 1.8 VISENSE – Current Sense Output Voltage – V VISENSE – Current Sense Output Voltage – V 2.0 TEMPERATURE SENSE vs JUNCTION TEMPERATURE 2 4 6 8 10 0 2 4 6 8 10 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 –50 –25 0 25 50 75 100 IO – Output Current – A IO – Output Current – A TJ – Junction Temperature – °C Figure 19. Figure 20. Figure 21. Submit Documentation Feedback 125 150 Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 APPLICATION INFORMATION Digital Power Figure 22 shows the UCD9220 power supply controller working with a single PTD08A210W, digital powertrain module. The loop for the power supply is created by the voltage output feeding into the Error ADC differential inputs, and completed by the DPWM output feeding the PTD08A210W module. A second stand-alone power stage can be controlled by the UCD9220 controller. The PTD08A210W's output cannot be paralleled. It can only be used as a single stand-alone 10-A module. VIN 35 33 34 V33A BPCap Vin/Iin V33FB 4 V33D 41 +3.3 V +3.3 V FLT-1A DPWM-1A SRE-1A CS-1A 24 26 27 28 29 30 31 43 44 45 FAULT-2A GPIO-1 DPWM-2A GPIO-2 UCD9220 SRE-2A TMUX-0 CS-2A PowerGood FAULT-3A TCK DPWM-3A SRE-3A TDO/SYNC-OUT TDI/SYNC-IN CS-3A TMS Temp VIN VIN 3 PGND VOUT 16 6 FF VOUT 15 9 4 PWM 42 5 SRE 7 11 6 12 PTD08A210W 18 PGND 14 2 PGND 13 8 14 15 3 VOUT ISENSE 13 To 2nd Power Stage PGND 8 PGND 7 TSENSE AGND AGND TMUX-1 25 16 9 10 12 17 1 46 37 TRST EAP1 ADDR-0 ADDR-1 Vtrack ADCref 36 48 PMBus-CNTL PowerPad 22 23 CS-1B PMBus-Alert 2 EAN1 38 EAP2 39 To 2nd Power Stage EAN2 40 49 21 PMBus-Data DGND1 20 SRE-1B AGND2 19 DPWM-1B PMBus-CLK 32 11 47 10 FAULT-1B RESET AGND1 5 1 UDG-10064 Figure 22. Typical Dual-Output Application Schematic Note: A low dropout linear regulator such as the TI TPS715A33 can provide the 3.3-V bias power to the UCD9220. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W 9 PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com Fusion Digital Power Graphical User Interface (GUI) When using the UCD92x0 digital controller along with digital PowerTrain modules to design a digital power system, several internal parameters of the modules are required to run the Fusion Digital Power Designer GUI. See the plant parameters below for the PTD08A210W digital PowerTrain modules. Table 1. PTD08A210W Plant Parameters PTD08A210W Plant Parameters L (µH) DCR (mΩ) RDS(on)-high (mΩ) RDS(on)-low (mΩ) 0.47 2.6 15.5 6.5 Internal output capacitance is present on the digital PowerTrain modules themselves. When using the GUI interface this capacitance information must be included along with any additional external capacitance. See the capacitor parameters below for the PTD08A210W digital PowerTrain modules. Table 2. PTD08A210W Capacitor Parameters PTD08A210W Capacitor Parameters 10 C (µF) ESR (mΩ) ESL (nH) Quantity 47 1.5 2.5 1 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PTD08A210W www.ti.com SLTS300 – SEPTEMBER 2010 TAPE & REEL Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W 11 PTD08A210W SLTS300 – SEPTEMBER 2010 www.ti.com TRAY 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): PTD08A210W PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2010 PACKAGING INFORMATION Orderable Device PTD08A210WAC PTD08A210WACT Status (1) ACTIVE Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) DIP MODULE ECY 16 42 TBD Call TI Call TI Purchase Samples PREVIEW DIP MODULE ECY 16 250 TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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