FAIRCHILD FDPF10N60ZUT

TM
UniFET
FDP10N60ZU / FDPF10N60ZUT
tm
N-Channel MOSFET, FRFET
600V, 9A, 0.8Ω
Features
Description
• RDS(on) = 0.65Ω ( Typ.)@ VGS = 10V, ID = 4.5A
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
• Low gate charge ( Typ. 31nC)
• Low Crss ( Typ. 15pF)
This advance technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switching mode power supplies and active power factor
correction.
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• RoHS compliant
D
G
G D S
TO-220
FDP Series
TO-220F
FDPF Series
GD S
S
MOSFET Maximum Ratings TC = 25 C unless otherwise noted*
o
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
FDP10N60ZU
FDPF10N60ZUT
600
Units
V
±30
V
-Continuous (TC = 25oC)
9
9*
-Continuous (TC = 100oC)
5.4
5.4*
ID
Drain Current
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
IAR
Avalanche Current
(Note 1)
9
A
EAR
Repetitive Avalanche Energy
(Note 1)
18
mJ
dv/dt
Peak Diode Recovery dv/dt
- Pulsed
36
(Note 2)
36*
A
100
(Note 3)
mJ
20
V/ns
(TC = 25oC)
180
42
W
- Derate above 25oC
1.45
0.3
W/oC
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
TL
(Note 1)
A
-55 to +150
o
C
300
o
C
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FDP10N60ZU FDPF10N60ZUT
RθJC
Thermal Resistance, Junction to Case
0.7
3.0
RθCS
Thermal Resistance, Junction to Ambient
0.5
-
RθJA
Thermal Resistance, Junction to Ambient
62.5
62.5
©2009 Fairchild Semiconductor Corporation
FDP10N60ZU/FDPF10N60ZUT Rev. A
1
Units
o
C/W
www.fairchildsemi.com
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
April 2009
Device Marking
FDP10N60ZU
Device
FDP10N60ZU
Package
TO-220
Reel Size
-
Tape Width
-
Quantity
50
FDPF10N60ZUT
FDPF10N60ZUT
TO-220F
-
-
50
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVDSS
ΔBVDSS
ΔTJ
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
ID = 250μA, VGS = 0V, TJ = 25oC
600
-
-
V
ID = 250μA, Referenced to 25oC
-
0.8
-
V/oC
IDSS
Zero Gate Voltage Drain Current
VDS = 600V, VGS = 0V
-
-
25
VDS = 480V, TC = 125oC
-
-
250
μA
IGSS
Gate to Body Leakage Current
VGS = ±30V, VDS = 0V
-
-
±10
μA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250μA
3.0
-
5.0
V
Static Drain to Source On Resistance
VGS = 10V, ID = 4.5A
-
0.65
0.8
Ω
gFS
Forward Transconductance
VDS = 40V, ID = 4.5A
-
12.5
-
S
VDS = 25V, VGS = 0V
f = 1MHz
-
1490
1980
pF
-
230
240
pF
-
15
25
pF
-
31
40
nC
-
8
-
nC
-
12
-
nC
-
25
60
ns
-
40
90
ns
-
95
200
ns
-
60
130
ns
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
VDS = 480V, ID = 10A
VGS = 10V
(Note 4)
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 300V, ID = 10A
RG = 25Ω , VGS = 10V
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
9
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
36
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 10A
-
-
1.6
V
trr
Reverse Recovery Time
-
45
-
ns
Qrr
Reverse Recovery Charge
VGS = 0V, ISD = 10A
dIF/dt = 100A/μs
-
52
-
nC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 2mH, IAS = 10A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD ≤ 10A, di/dt ≤ 200A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Essentially Independent of Operating Temperature Typical Characteristics
FDP10N60ZU/FDPF10N60ZUT Rev. A
2
www.fairchildsemi.com
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
30
10
20
o
25 C
ID,Drain Current[A]
20
ID,Drain Current[A]
30
VGS = 10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
o
10
150 C
*Notes:
1. 250μs Pulse Test
* Notes :
1. VDS = 20V
2. 250μs Pulse Test
o
2. TC = 25 C
1
1
1
20
10
VDS,Drain-Source Voltage[V]
3
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
5
6
7
VGS,Gate-Source Voltage[V]
100
IS, Reverse Drain Current [A]
1.1
1.0
0.9
VGS = 10V
0.8
VGS = 20V
0.7
o
150 C
10
o
25 C
Notes:
1. VGS = 0V
o
* Note : TJ = 25 C
2. 250μs Pulse Test
0.6
0
5
10
15
20
ID, Drain Current [A]
25
1
0.0
30
Figure 5. Capacitance Characteristics
2.0
10
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
2000
Ciss
VGS, Gate-Source Voltage [V]
Coss
2500
* Note:
1. VGS = 0V
2. f = 1MHz
1500
1000
500
0.5
1.0
1.5
VSD, Body Diode Forward Voltage [V]
Figure 6. Gate Charge Characteristics
3000
Capacitances [pF]
8
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
1.2
RDS(on) [Ω],
Drain-Source On-Resistance
4
VDS = 150V
VDS = 380V
VDS = 400V
8
6
4
2
Crss
* Note : ID = 10A
0
0.1
0
1
10
VDS, Drain-Source Voltage [V]
FDP10N60ZU/FDPF10N60ZUT Rev. A
0
30
3
10
20
30
Qg, Total Gate Charge [nC]
40
www.fairchildsemi.com
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperaure
Figure 8. Maximum Safe Operating Area
- FDPF10N60ZUT
100
20μs
100μs
ID, Drain Current [A]
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.2
1.1
1.0
0.9
10
1ms
10ms
1
Operation in This Area
is Limited by R DS(on)
* Notes :
0.1
o
* Notes :
1. VGS = 0V
2. ID = 250μA
0.8
-100
-50
0
50
100
150
o
TJ, Junction Temperature [ C]
DC
1. TC = 25 C
o
2. TJ = 150 C
3. Single Pulse
0.01
200
1
10
100
VDS, Drain-Source Voltage [V]
1000
Figure 9. Maximum Drain Current
vs. Case Temperature
10
ID, Drain Current [A]
8
6
4
2
0
25
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 10. Transient Thermal Response Curve - FDPF10N60ZUT
Thermal Response [ZθJC]
5
0.5
1
0.2
0.1
PDM
0.05
0.1
t1
t2
0.02
0.01
* Notes :
o
Single pulse
0.01
-4
10
FDP10N60ZU/FDPF10N60ZUT Rev. A
1. ZθJC(t) = 3.0 C/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
-3
10
-2
-1
10
10
1
10
Rectangular Pulse Duration [sec]
4
2
10
3
10
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FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Typical Performance Characteristics (Continued)
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDP10N60ZU/FDPF10N60ZUT Rev. A
5
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FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
V
DS
_
I
SD
L
D r iv e r
R
V
V GS
( D r iv e r )
G S
G
S am e T ype
as DUT
V
DD
• d v / d t c o n t r o lle d b y R G
• I S D c o n t r o lle d b y p u ls e p e r io d
G a t e P u ls e W id th
D = -------------------------G a te P u ls e P e r io d
10V
I F M , B o d y D io d e F o r w a r d C u r r e n t
I SD
( DUT )
d i/ d t
IR M
B o d y D io d e R e v e r s e C u r r e n t
V DS
( DUT )
B o d y D io d e R e c o v e r y d v / d t
V
V
SD
DD
B o d y D io d e
F o r w a r d V o lt a g e D r o p
FDP10N60ZU/FDPF10N60ZUT Rev. A
6
www.fairchildsemi.com
TO-220
4.50 ±0.20
2.80 ±0.10
(3.00)
+0.10
1.30 –0.05
18.95MAX.
(3.70)
ø3.60 ±0.10
15.90 ±0.20
1.30 ±0.10
(8.70)
(1.46)
9.20 ±0.20
(1.70)
9.90 ±0.20
(45°
1.52 ±0.10
10.08 ±0.30
(1.00)
13.08 ±0.20
)
1.27 ±0.10
0.80 ±0.10
2.54TYP
[2.54 ±0.20]
+0.10
0.50 –0.05
2.54TYP
[2.54 ±0.20]
2.40 ±0.20
10.00 ±0.20
FDP10N60ZU/FDPF10N60ZUT Rev. A
7
www.fairchildsemi.com
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Mechanical Dimensions
FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
Mechanical Dimensions
TO-220F
3.30 ±0.10
10.16 ±0.20
2.54 ±0.20
ø3.18 ±0.10
(7.00)
(1.00x45°)
15.87 ±0.20
15.80 ±0.20
6.68 ±0.20
(0.70)
0.80 ±0.10
0°
(3
9.75 ±0.30
MAX1.47
)
#1
+0.10
0.50 –0.05
2.54TYP
[2.54 ±0.20]
2.76 ±0.20
2.54TYP
[2.54 ±0.20]
9.40 ±0.20
4.70 ±0.20
0.35 ±0.10
Dimensions in Millimeters
FDP10N60ZU/FDPF10N60ZUT Rev. A
8
www.fairchildsemi.com
tm
tm
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I40
FDP10N60ZU/FDPF10N60ZUT Rev. A
9
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FDP10N60ZU/FDPF10N60ZUT N-Channel MOSFET
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