P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter FEATURES •Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards. •Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. •Longer male bottom Pins available at special request for easy use of probe clips. •Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter. GENERAL SPECIFICATIONS •BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2 standards, with 1-oz. Cu traces, both sides •PADS: HASL •PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M •PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE-AMS-QQ-N-290 •OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. ALL DIMENSIONS: INCHES [MILLIMETERS] CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N 1110748 P/N 1110748-P for Panelized Version ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC -610B CLASS 2 GUIDELINES CONSULT FACTORY FOR MOUNTING CONSIDERATIONS OF CONSIGNED CHIPS. CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18043 Rev. AA