AZM AZP52SG

AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
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FEATURES
DESCRIPTION
•
The AZP52 is a sine wave/CMOS to LVPECL buffer/divider optimized for
very low phase noise (-165dBc/Hz). It is particularly useful in converting
crystal or SAW based oscillators into LVPECL outputs greater than
800MHz of bandwidth. For greater bandwidth, refer to the AZP63.
•
The AZP52 is one of a family of parts that provide options of fixed ÷1,
fixed ÷2 and selectable ÷1, ÷2 modes as well as active high enable or active
low enable to oscillator designers. Refer to Table 2 for the comparison of
parts within the AZP5x and AZP63 family.
•
•
LVPECL outputs optimized
for very low phase noise
(-165dBc/Hz)
Greater than 800MHz
bandwidth
Fixed ÷2 output
3.0V to 3.6V operation
BLOCK DIAGRAM
APPLICATIONS
•
Converting crystal or SAW
based oscillators to LVPECL
output
PACKAGE AVAILABILITY
•
SC70-6
o
Order Number
1
AZP52SG
Green/RoHS Compliant/Pb-Free
Package
Marking
SC70-6
C <Date Code>2
1
Tape & Reel - Add 'R1' at end of order number for 7in (1k parts), 'R2' (2.5k) for 13in
2
See www.azmicrotek.com for date code format
www.azmicrotek.com
+1-480-962-5881
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1630 S Stapley Dr, Suite 127
Mesa, AZ 85204 USA
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PIN DESCRIPTION AND CONFIGURATION
Table 1 - Pin Description
Name
VDD
GND
D
EN
Type
Power
Power
Input
Input
Function
Positive Supply
Negative Supply
Sine or CMOS Input
Enable
5
Q
Output
LVPECL Output
6
Q
Output
LVPECL Output
VDD
1
GND
2
D
3
C<Date Code>
Pin
1
2
3
4
6
Q
5
Q
4
EN
Figure 1 – Pin Configuration
ENGINEERING NOTES
FUNCTIONALITY
The AZP52 is one of a family of parts that provide options of fixed ÷1, fixed ÷2 and selectable ÷1, ÷2 modes as well as
active high enable or active low enable to oscillator designers. Table 2 details the differences between the parts to assist
designers in selecting the optimal part for their design.
Table 3 lists the specific AZP52 functional operation.
Figure 2 plots the S-parameters of the D input. S-parameter and IBIS model files for the AZP52 are also available for
download.
Table 2 - AZP51-54 & AZP63 Family
Part Number
Divide Ratio
EN Logic
AZP51
AZP52
AZP53
AZP54
AZP63
÷1
÷2
Selectable ÷1 or ÷2
÷1
Selectable ÷1 or ÷2
active HIGH
active HIGH
selectable
active LOW
selectable
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EN pullup/pull-down
Pull-up
Pull-up
selectable
Pull-down
selectable
Bandwidth
> 800MHz
> 800MHz
> 800MHz
> 800MHz
≥ 1GHz
2
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
Table 3 - AZP52 Functional Operation
Inputs
EN
Part Number
Outputs
D
High, NC1
AZP52
Low
1
Not connected
2
Don't care
3
Tri-State
4
Every other clock cycle
Q
4
Q
High4
Low
Low
High
High4
Low4
X2
Z3
Z3
Figure 2- S11, Parameters, D Input
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
INPUT TERMINATION
The D input bias is VDD/2 fed through an internal 10kΩ resistor. For clock applications, an input signal of at least
750mVpp ensures the AZP52 meets AC specifications. The input should also be AC coupled to maintain a 50% duty cycle
on the outputs. The input can be driven to any voltage between 0V and VDD without damage or waveform degradation.
Input signal
D
10kΩ
A/R
VDD/2
Figure 3 - Input Termination
OUTPUT TERMINATION TECHNIQUES
The LVPECL compatible output stage of the AZP52 uses a current drive topology to maximize switching speed as
illustrated below in Figure 4. Two current source PMOS transistors (M1-M2) feed the output pins. M5 is an NMOS
current source which is switched by M3 and M4. When M4 is on, M5 takes current from M2. This produces an output
current of 5.1mA (low output state). M3 is off, and the entire 21.1mA flows through the output pin. The associated output
voltage swings match LVPECL levels when external 50Ω resistors terminate the outputs.
Both Q and Q
¯ should always be terminated identically to avoid waveform distortion and circulating current caused by
unsymmetrical loads. This rule should be followed even if only one output is in use.
VDD (+3.3 V)
Output
Stage
Vbp
External
Circuitry
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
Vbn
21.1mA - High
5.1mA - Low
M5
50Ω
50Ω
VTT = VDD - 2.0V
16mA
Figure 4 - Typical Output Termination
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
DUAL SUPPLY LVPECL OUTPUT TERMINATION
The standard LVPECL loads are a pair of 50Ω resistors connected between the outputs and VDD-2.0V (Figure 4). The
resistors provide both the DC and the AC loads, assuming 50Ω interconnect. If an additional supply is available within the
application, a four resistor termination configuration is possible (Figure 5).
VDD (+3.3 V)
Output
Stage
Vbp
VDD (+3.3 V)
M2
M1
21.1mA
External
Circuitry
130Ω
130Ω
82Ω
82Ω
21.1mA
Q
Q
M4
M3
D
21.1mA - High
5.1mA - Low
M5
Vbn
16mA
Figure 5 - Dual Supply Output Termination
THREE RESISTOR TERMINATION
Another termination variant eliminates the need for the additional supply (Figure 6). Alternately three resistors and
one capacitor accomplish the same termination and reduce power consumption.
VDD (+3.3 V)
Output
Stage
Vbp
External
Circuitry
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
21.1mA - High
5.1mA - Low
50Ω
0.01µF
Vbn
M5
50Ω
50Ω
16mA
Figure 6 - Three Resistor Termination
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
EVALUATION BOARD (EBP53)
Arizona Microtek’s evaluation board EBP53 provides the most convenient way to test and prototype AZP52 series
circuits. Built for the AZP53Q 1.5x1.0 mm package, it is designed to support both dual and single supply operation. Dual
supply operation (VDD=+2.0V, VSS=-1.3V) enables direct coupling to 50Ω time domain test equipment (Figure 7).
VDD (+2.0 V)
Output
Stage
Vbp
Test
Equipment
Terminations
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
Vbn
21.1mA - High
5.1mA - Low
50Ω
50Ω
M5
16mA
VSS (-1.3 V)
Figure 7 - Split Supply LVPECL Output Termination
AC TERMINATION
Clock applications or phase noise/frequency domain testing scenarios typically require AC coupling. Figure 8 below
shows the AC coupling technique. The 200Ω resistors form the required DC loads, and the 50Ω resistors provide the AC
termination. The parallel combination of the 200Ω and 50Ω resistors results in a net 40Ω AC load termination. In many
cases this will work well. If necessary, the 50Ω resistors can be increased to about 56Ω. Alternately, bias tees combined
with current setting resistors will eliminate the lowered AC load impedance. The 50Ω resistors are typically connected to
ground but can be connected to the bias level needed by the succeeding stage.
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
VDD (+3.3 V)
Output
Stage
Vbp
21.1mA
M4
M3
Vbn
External
Circuitry
M2
M1
21.1mA
D
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
21.1mA - High
5.1mA - Low
Q
0.01µF
Q
0.01µF
200Ω
50Ω
200Ω
M5
50Ω
GND or VT
16mA
Figure 8 - AC Termination
PERFORMANCE DATA
Table 4 - Absolute Maximum Ratings
Absolute Maximum Ratings are those values beyond which device life may be impaired.
Symbol
Characteristic
Rating
Unit
VDD
Power Supply
0 to +5.5
V
VI
Input Voltage
-0.5 to VDD + 0.5
V
TA
Operating Temperature Range
-40 to +85
°C
TSTG
Storage Temperature Range
-65 to +150
°C
ESDHBM
Human Body Model
2500
V
ESDMM
Machine Model
200
V
ESDCDM
Charged Device Model
2500
V
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
Table 5 - DC Characteristics
DC Characteristics (VDD = 3.0V to 3.6V unless otherwise specified, TA = -40 to 85 °C)
Symbol
Characteristic
Conditions
-40 C
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
1
1
Output Leakage
Current, Tri-state2
IPD
High Level Input
Voltage
Low Level Input
Voltage
Pull-down Current
RBIAS
Bias Resistor
IDD
Power Supply Current
VIH
VIL
Power Supply Current
IDDZ
Outputs Tri-state
1
Typ
2.415
2.05
2.48
85 C
2.05
2.54
-40 C
1.365
1.615
1.43
1.68
1.49
1.74
EN=Low
-10
10
EN
2
25 C
VDD = 3.3V
25 C
VDD = 3.3V
Unit
Max
2.05
85 C
IZ
Min
V
V
μA
V
EN
0.8
V
EN
-2.2
μA
D Input to Internal VDD/2
Reference
10k
Ω
22
D Input ≤ VIL
EN=Low
1
Specified with outputs terminated through 50Ω resistors to VDD - 2V or Thevenin equivalent.
2
Measured at Q / Q pins.
35
mA
8
mA
Table 6 - AC Characteristics
AC Characteristics (VDD = 3.0V to 3.6V, TA = -40 to 85 °C)
Symbol
Characteristic
Min
Max
Unit
80
250
ps
1,2
tr / tf
Output Rise/Fall
(20% - 80%)
fMAX
Maximum Input Frequency - Sine wave2
1300
MHz
VINMAX
Maximum Recommended Input Signal
VDD
V p-p
VINMIN
Minimum Recommended Input Signal
pn
1,2
Phase Noise - 1MHz offset
0.2
V p-p
-165
1
Specified with outputs terminated through 50Ω resistors to VCC - 2V or Thevenin equivalent.
2
1.5 v p-p sine wave input, AC coupled to D pin.
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dBc/Hz
8
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP52
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PACKAGE DIAGRAM
SC70-6
Green/RoHS compliant/Pb-Free
MSL=1
Arizona Microtek, Inc. reserves the right to change circuitry and specifications at any time without prior notice.
Arizona Microtek, Inc. makes no warranty, representation or guarantee regarding the suitability of its products for
any particular purpose, nor does Arizona Microtek, Inc. assume any liability arising out of the application or use of
any product or circuit and specifically disclaims any and all liability, including without limitation special,
consequential or incidental damages. Arizona Microtek, Inc. does not convey any license rights nor the rights of
others. Arizona Microtek, Inc. products are not designed, intended or authorized for use as components in systems
intended to support or sustain life, or for any other application in which the failure of the Arizona Microtek, Inc.
product could create a situation where personal injury or death may occur. Should Buyer purchase or use Arizona
Microtek, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold
Arizona Microtek, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Arizona Microtek, Inc. was negligent regarding the design or manufacture of the part.
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May 2012, Rev 2.1