AZM AZP53PG

AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
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DESCRIPTION
FEATURES
The AZP53 is a sine wave/CMOS to LVPECL buffer/divider optimized for
very low phase noise (-165dBc/Hz). It is particularly useful in converting
crystal or SAW based oscillators into LVPECL outputs for up 800MHz of
bandwidth. For greater bandwidth, refer to the AZP63.
•
•
•
•
•
The AZP53 is one of a family of parts that provide options of fixed ÷1,
fixed ÷2 and selectable ÷1, ÷2 modes as well as active high enable or active
low enable to oscillator designers. Refer to Table 2 for the comparison of
parts within the AZP5x and AZP63 family.
LVPECL outputs optimized
for very low phase noise
(-165dBc/Hz)
Up to 800MHz bandwidth
Selectable ÷1, ÷2 output
Selectable Enable logic
3.0V to 3.6V operation
BLOCK DIAGRAM
APPLICATIONS
•
Converting crystal or SAW
based oscillators to LVPECL
output
PACKAGE AVAILABILITY
•
Order Number
•
•
Available in die
QFN8
SON8
•
Green/RoHS Compliant/Pb-Free
Package
Marking
1
AZP53PG
QFN8
D3 <Date Code>2
AZP53QG1
SON8
D <Date Code>2
1
Tape & Reel - Add 'R1' at end of order number for 7in (1k parts), 'R2' (2.5k) for 13in
2
See www.azmicrotek.com for date code format
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1630 S Stapley Dr, Suite 127
Mesa, AZ 85204 USA
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PIN DESCRIPTION AND CONFIGURATION
Table 1 - Pin Description
Pin
1
Name
Q
Type
Output
Function
LVPECL Output
2
Q
Output
LVPECL Output
3
4
5
6
7
8
EN
GND
D
EN_SEL
DIV_SEL
VDD
Input
Power
Input
Input
Input
Power
Enable
Negative Supply
Sine or CMOS Input
Enable Select
Divide Select
Positive Supply
VDD
Q
Q
EN
1
2
7
D3
<Date Code>
3
6
5
Q
1
Q
2
EN
3
GND
4
DIV_SEL
EN_SEL
D
4
D<Date Code>
8
8
VDD
7
DIV_SEL
6
EN_SEL
5
D
GND
Figure 1 - Pin Configuration for QFN8 & SON8, respectively
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
ENGINEERING NOTES
FUNCTIONALITY
The AZP53 is one of a family of parts that provide options of fixed ÷1, fixed ÷2 and selectable ÷1, ÷2 modes as well as
active high enable or active low enable to oscillator designers. Table 2 details the differences between the parts to assist
designers in selecting the optimal part for their design.
Table 3 lists the specific AZP53 functional operation.
Figure 2 plots the S-parameters of the D input. S-parameter and IBIS model files for the AZP53 are also available for
download.
Table 2 - AZP51-54 & AZP63 Family
Part Number
Divide Ratio
EN Logic
AZP51
AZP52
AZP53
AZP54
AZP63
÷1
÷2
Selectable ÷1 or ÷2
÷1
Selectable ÷1 or ÷2
active HIGH
active HIGH
selectable
active LOW
selectable
EN pullup/pull-down
Pull-up
Pull-up
selectable
Pull-down
selectable
Bandwidth
> 800MHz
> 800MHz
> 800MHz
> 800MHz
≥ 1GHz
Table 3 - AZP53 Functional Operation, ÷1 mode
Part Number
EN_SEL
High, NC1
Inputs
EN
Low, NC1
High
AZP53
Low
High, NC1
Low
DIV_SEL
Low, NC
High
1
Not connected
2
Don't care
3
Tri-State
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1
D
Low
High
X2
Q
Low
High
Z3
Outputs
Q
High
Low
Z3
Low
Low
High
High
High
Low
X
2
3
Z3
Z
Divide Ratio
÷1
÷2
3
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
Figure 2- S11, Parameters, D Input
INPUT TERMINATION
The D input bias is VDD/2 fed through an internal 10kΩ resistor. For clock applications, an input signal of at least
750mVpp ensures the AZP53 meets AC specifications. The input should also be AC coupled to maintain a 50% duty cycle
on the outputs. The input can be driven to any voltage between 0V and VDD without damage or waveform degradation.
Input signal
D
10kΩ
A/R
VDD/2
Figure 3 - Input Termination
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
OUTPUT TERMINATION TECHNIQUES
The LVPECL compatible output stage of the AZP53 uses a current drive topology to maximize switching speed as
illustrated below in Figure 4. Two current source PMOS transistors (M1-M2) feed the output pins. M5 is an NMOS
current source which is switched by M3 and M4. When M4 is on, M5 takes current from M2. This produces an output
current of 5.1mA (low output state). M3 is off, and the entire 21.1mA flows through the output pin. The associated output
voltage swings match LVPECL levels when external 50Ω resistors terminate the outputs.
Both Q and Q
¯ should always be terminated identically to avoid waveform distortion and circulating current caused by
unsymmetrical loads. This rule should be followed even if only one output is in use.
VDD (+3.3 V)
Output
Stage
Vbp
External
Circuitry
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
Vbn
21.1mA - High
5.1mA - Low
M5
50Ω
50Ω
VTT = VDD - 2.0V
16mA
Figure 4 - Typical Output Termination
DUAL SUPPLY LVPECL OUTPUT TERMINATION
The standard LVPECL loads are a pair of 50Ω resistors connected between the outputs and VDD-2.0V (Figure 4). The
resistors provide both the DC and the AC loads, assuming 50Ω interconnect. If an additional supply is available within the
application, a four resistor termination configuration is possible (Figure 5).
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
VDD (+3.3 V)
Output
Stage
VDD (+3.3 V)
M2
M1
Vbp
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
21.1mA
External
Circuitry
130Ω
130Ω
82Ω
82Ω
21.1mA
Q
Q
M4
M3
D
21.1mA - High
5.1mA - Low
M5
Vbn
16mA
Figure 5 - Dual Supply Output Termination
THREE RESISTOR TERMINATION
Another termination variant eliminates the need for the additional supply (Figure 6). Alternately three resistors and
one capacitor accomplish the same termination and reduce power consumption.
VDD (+3.3 V)
Output
Stage
Vbp
External
Circuitry
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
21.1mA - High
5.1mA - Low
50Ω
0.01µF
Vbn
M5
50Ω
50Ω
16mA
Figure 6 - Three Resistor Termination
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
EVALUATION BOARD (EBP53)
Arizona Microtek’s evaluation board EBP53 provides the most convenient way to test and prototype AZP53 series
circuits. Built for the AZP53Q 1.5x1.0 mm package, it is designed to support both dual and single supply operation. Dual
supply operation (VDD=+2.0V, VSS=-1.3V) enables direct coupling to 50Ω time domain test equipment (Figure 7).
VDD (+2.0 V)
Output
Stage
Vbp
Test
Equipment
Terminations
M2
M1
21.1mA
21.1mA
Q
Q
M4
M3
D
Vbn
21.1mA - High
5.1mA - Low
50Ω
50Ω
M5
16mA
VSS (-1.3 V)
Figure 7 - Split Supply LVPECL Output Termination
AC TERMINATION
Clock applications or phase noise/frequency domain testing scenarios typically require AC coupling. Figure 8 below
shows the AC coupling technique. The 200Ω resistors form the required DC loads, and the 50Ω resistors provide the AC
termination. The parallel combination of the 200Ω and 50Ω resistors results in a net 40Ω AC load termination. In many
cases this will work well. If necessary, the 50Ω resistors can be increased to about 56Ω. Alternately, bias tees combined
with current setting resistors will eliminate the lowered AC load impedance. The 50Ω resistors are typically connected to
ground but can be connected to the bias level needed by the succeeding stage.
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
VDD (+3.3 V)
Output
Stage
Vbp
21.1mA
M4
M3
Vbn
External
Circuitry
M2
M1
21.1mA
D
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
21.1mA - High
5.1mA - Low
Q
0.01µF
Q
0.01µF
200Ω
M5
200Ω
50Ω
50Ω
GND or VT
16mA
Figure 8 - AC Termination
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PERFORMANCE DATA
Table 4 - Absolute Maximum Ratings
Absolute Maximum Ratings are those values beyond which device life may be impaired.
Symbol
Characteristic
Rating
Unit
VDD
Power Supply
0 to +5.5
V
VI
Input Voltage
-0.5 to VDD + 0.5
V
TA
Operating Temperature Range
-40 to +85
°C
TSTG
Storage Temperature Range
-65 to +150
°C
ESDHBM
Human Body Model
2500
V
ESDMM
Machine Model
200
V
ESDCDM
Charged Device Model
2500
V
Table 5 - DC Characteristics
DC Characteristics (VDD = 3.0V to 3.6V unless otherwise specified, TA = -40 to 85 °C)
Symbol
Characteristic
Conditions
-40 C
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
1
1
Min
Typ
Max
2.05
2.415
2.05
2.48
85 C
2.05
2.54
-40 C
1.365
1.615
1.43
1.68
1.49
1.74
-10
10
25 C
VDD = 3.3V
25 C
VDD = 3.3V
85 C
Unit
V
V
μA
IZ
Output Leakage Current, Tri-state2
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
EN
IPU
Pullup Current
EN_SEL
2.2
μA
IPD
Pulldown Current
DIV_SEL
-2.2
μA
IP
Pullup/Pulldown Current
EN
±2.2
μA
RBIAS
Bias Resistor
D Input to Internal VDD/2 Reference
10k
Ω
IDD
Power Supply Current
IDDZ
EN=Disable
EN_SEL
DIV_SEL
V
0.8
22
Power Supply Current –
D Input ≤ VIL
Outputs Tri-state1
EN=Disable
1
Specified with outputs terminated through 50Ω resistors to VDD - 2V or Thevenin equivalent.
2
Measured at Q / Q pins.
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2
V
35
mA
8
mA
9
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
Table 6 - AC Characteristics
AC Characteristics (VDD = 3.0V to 3.6V, TA = -40 to 85 °C)
Symbol
Characteristic
Min
Max
Unit
80
250
ps
÷1
800
MHz
÷2
1300
VINMAX
Maximum Recommended Input Signal
VDD
VINMIN
Minimum Recommended Input Signal
1,2
tr / tf
Output Rise/Fall
(20% - 80%)
Maximum Input Frequency - Sine wave2
fMAX
nP
1,2
Phase Noise - 1MHz offset
0.2
V p-p
-165
1
Specified with outputs terminated through 50W resistors to VCC - 2V or Thevenin equivalent.
2
1.5 v p-p sine wave input, AC coupled to D pin.
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V p-p
dBc/Hz
10
May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PACKAGE DIAGRAM
QFN8 (1.5x1.5x0.55mm)
Green/RoHS compliant/Pb-Free
MSL =1
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
PACKAGE DIAGRAM
SON8 (1.5x1.0x0.4mm)
Green/RoHS compliant/Pb-Free
MSL =1
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May 2012, Rev 2.1
Arizona Microtek, Inc.
AZP53
Low Phase Noise Sine Wave/CMOS
to LVPECL Buffer/Divider
DIE SPECIFICATIONS
Die Size 754µ x 354µ
Pad Size 52.1µ
Octagonal Die Coordinates (Center 0,0)
D
X Coordinate
(µm)
-273.875
Pad Name
Y Coordinate
(µm)
-106.575
EN_SEL
-140.35
-106.65
DIV_SEL
-43.625
-106.65
VDD
302.875
-20.45
Q
170.925
105.725
QN
72.55
105.725
EN
-175.3
106
GND
-296.35
72.325
Arizona Microtek, Inc. reserves the right to change circuitry and specifications at any time without prior notice.
Arizona Microtek, Inc. makes no warranty, representation or guarantee regarding the suitability of its products for
any particular purpose, nor does Arizona Microtek, Inc. assume any liability arising out of the application or use of
any product or circuit and specifically disclaims any and all liability, including without limitation special,
consequential or incidental damages. Arizona Microtek, Inc. does not convey any license rights nor the rights of
others. Arizona Microtek, Inc. products are not designed, intended or authorized for use as components in systems
intended to support or sustain life, or for any other application in which the failure of the Arizona Microtek, Inc.
product could create a situation where personal injury or death may occur. Should Buyer purchase or use Arizona
Microtek, Inc. products for any such unintended or unauthorized application, Buyer shall indemnify and hold
Arizona Microtek, Inc. and its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Arizona Microtek, Inc. was negligent regarding the design or manufacture of the part.
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May 2012, Rev 2.1