TI SN64BCT306

SN64BCT306
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS048B – MARCH 1990 – REVISED NOVEMBER 1993
•
D OR P PACKAGE
(TOP VIEW)
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
High-Impedance State During Power Up
and Power Down
3-State True Outputs Drive Bus Lines or
Buffer-Memory Address Registers
P-N-P Inputs Reduce DC Loading
Package Options Include Plastic
Small-Outline (D) Packages and Standard
Plastic 300-mil DIPs (P)
•
•
•
•
•
1OE
VCC
2OE
2A
1
8
2
7
3
6
4
5
2Y
1A
GND
1Y
description
This dual buffer and line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN64BCT306 is characterized for operation from – 40°C to 85°C and 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
H
X
Z
L
L
L
L
H
H
logic symbol†
1
1OE
1A
logic diagram (positive logic)
1OE
EN
7
1
5
1A
3
2A
4
EN
2A
1
8
7
5
1Y
1Y
2OE
2OE
1
3
4
8
2Y
2Y
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
Copyright  1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3–1
SN64BCT306
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS048B – MARCH 1990 – REVISED NOVEMBER 1993
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . – 0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input negative-voltage rating may be exceeded if the input clamp-current rating is observed.
recommended operating conditions (see Note 2)
MIN
NOM
MAX
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
V
Input clamp current
–18
mA
IOH
IOL
High-level output current
–15
mA
Low-level output current
64
∆t /∆VCC
Power-up ramp rate
High-level input voltage
2
V
mA
µs / V
2
TA
Operating free-air temperature
NOTE 2: Unused or floating inputs must be held high or low.
V
– 40
85
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
MIN
TYP‡
II = –18 mA
IOH = – 3 mA
2.4
3.3
2
3.1
VCC = 4.5 V,
VOH
VCC = 4
4.5
5V
VOL
II
VCC = 4.5 V,
VCC = 5.5 V,
IIH
IIL
VCC = 5.5 V,
VCC = 5.5 V,
IOZ
VCC = 0 to 2.3 V (power up)
VCC = 1.8 to 0 V (power down)
VO = 2
2.7
7 V or 0
0.5
5 V,
V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
VCC = 5.5 V,
VCC = 5.5 V,
VO = 0
Outputs open
VCC = 5.5 V,
VCC = 5.5 V,
IOZH
IOZL
IOS§
ICCL
ICCH
ICCZ
IOH = – 15 mA
IOL = 64 mA
0.42
VI = 7 V
VI = 2.7 V
VI = 0.5 V
UNIT
–1.2
V
V
0.55
V
0.1
mA
20
µA
–1
mA
± 50
OE = 0.8
08V
± 50
– 100
µA
50
µA
– 50
µA
–225
mA
53
80
mA
Outputs open
23
40
mA
Outputs open
4
10
mA
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
3–2
MAX
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN64BCT306
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS048B – MARCH 1990 – REVISED NOVEMBER 1993
switching characteristics over recommended range of supply voltage, CL = 50 pF (unless
otherwise noted) (see Note 3)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
1OE or 2OE
Y
tPHZ
tPLZ
1OE or 2OE
Y
PARAMETER
TA = – 40°C
to 85°C
VCC = 5 V,
TA = 25°C
TA = 0°C
to 70°C
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
1.2
4.4
0.9
5.3
0.7
5
1.7
5
1.4
6
1.4
5.5
2
7.8
2
9
2
8.7
2
8.1
2
9.4
2
8.9
2
6.7
2
8
2
7.7
2
7.6
2
9.8
2
8.9
ns
ns
ns
NOTE 3: Load circuits and voltage waveforms are shown in Section 1.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3–3
SN64BCT306
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCBS048B – MARCH 1990 – REVISED NOVEMBER 1993
3–4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SN64BCT306D
OBSOLETE
SOIC
D
8
TBD
Call TI
Call TI
SN64BCT306DR
OBSOLETE
SOIC
D
0
TBD
Call TI
Call TI
SN64BCT306P
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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