CET CEK01N6G

CEK01N6G
N-Channel Enhancement Mode Field Effect Transistor
FEATURES
600V, 1A, RDS(ON) = 9.3 Ω @VGS = 10V.
High dense cell design for extremely low RDS(ON).
Rugged and reliable.
D
Lead free product is acquired.
TO-92(Bulk) & TO-92(Ammopack) package.
G
G
D
S
G
TO-92(Ammopack)
ABSOLUTE MAXIMUM RATINGS
D
S
TO-92(Bulk)
S
TA = 25 C unless otherwise noted
Symbol
Limit
Drain-Source Voltage
VDS
600
Units
V
Gate-Source Voltage
VGS
±30
V
Drain Current-Continuous
IDa
0.4
A
Drain Current-Pulsed
IDM
1.6
A
PD
3.1
W
TJ,Tstg
-55 to 150
C
Symbol
Limit
Units
RθJL
40
C/W
Parameter
b
Maximum Power Dissipation
Operating and Store Temperature Range
Thermal Characteristics
Parameter
Thermal Resistance, Junction-to-Lead
Rev 1. 2009.Nov.
http://www.cetsemi.com
Details are subject to change without notice .
1
CEK01N6G
Electrical Characteristics
Parameter
Tc = 25 C unless otherwise noted
Symbol
Test Condition
Min
Drain-Source Breakdown Voltage
BVDSS
VGS = 0V, ID = 250µA
600
Zero Gate Voltage Drain Current
IDSS
Gate Body Leakage Current, Forward
Gate Body Leakage Current, Reverse
Typ
Max
Units
VDS = 600V, VGS = 0V
20
µA
IGSSF
VGS = 30V, VDS = 0V
100
nA
IGSSR
VGS = -30V, VDS = 0V
-100
nA
4
V
9.3
Ω
Off Characteristics
V
On Characteristics
Gate Threshold Voltage
VGS(th)
VGS = VDS, ID = 250µA
RDS(on)
VGS = 10V, ID = 0.4A
Forward Transconductance
gFS b
VDS = 15V, ID = 0.4A
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Static Drain-Source
On-Resistance
2
7.3
Dynamic Characteristics c
VDS = 25V, VGS = 0V,
f = 1.0 MHz
10
S
210
pF
55
pF
25
pF
Switching Characteristics c
Turn-On Delay Time
td(on)
Turn-On Rise Time
tr
Turn-Off Delay Time
td(off)
VDD = 300V, ID = 0.5A,
VGS = 10V, RGEN = 10Ω
19
25
ns
10
13
ns
31
40
ns
Turn-Off Fall Time
tf
37
48
ns
Total Gate Charge
Qg
6
12
nC
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS = 480V, ID = 1A,
VGS = 10V
0.7
nC
3.5
nC
Drain-Source Diode Characteristics and Maximun Ratings
Drain-Source Diode Forward Current
IS
Drain-Source Diode Forward Voltage b
VSD
VGS = 0V, IS = 0.4A
Notes :
a.Repetitive Rating : Pulse width limited by maximum junction temperature.
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
c.Guaranteed by design, not subject to production testing.
2
0.4
A
1.5
V
6
CEK01N6G
1.2
0.6
0.4
VGS=4V
0.2
4
8
12
16
20
0.2
1
2
3
4
5
6
7
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
Ciss
80
Coss
40
Crss
0
5
10
15
20
25
3.0
2.5
ID=0.4A
VGS=10V
2.0
1.5
1.0
0.5
0.0
-100
-50
0
50
100
150
200
VDS, Drain-to-Source Voltage (V)
TJ, Junction Temperature( C)
Figure 3. Capacitance
Figure 4. On-Resistance Variation
with Temperature
VDS=VGS
IS, Source-drain current (A)
ID=250µA
1.1
1.0
0.9
0.8
0.7
0.6
-50
-55 C
VGS, Gate-to-Source Voltage (V)
120
1.2
0.4
0.0
24
160
1.3
0.6
TJ=125 C
200
0
1.0
VDS, Drain-to-Source Voltage (V)
240
C, Capacitance (pF)
ID, Drain Current (A)
0.8
0
0.0
VTH, Normalized
Gate-Source Threshold Voltage
25 C
VGS=10,8,7V
1.0
RDS(ON), Normalized
RDS(ON), On-Resistance(Ohms)
ID, Drain Current (A)
1.2
-25
0
25
50
75
100
125
150
VGS=0V
10
0
10
-1
10
-2
0.4
0.6
0.8
1.0
1.2
1.4
TJ, Junction Temperature( C)
VSD, Body Diode Forward Voltage (V)
Figure 5. Gate Threshold Variation
with Temperature
Figure 6. Body Diode Forward Voltage
Variation with Source Current
3
10
10
VDS=480V
ID=1A
8
ID, Drain Current (A)
VGS, Gate to Source Voltage (V)
CEK01N6G
6
4
2
0
0
1
2
3
4
5
4
RDS(ON)Limit
10
10
10
6
1
0
10ms
100ms
1s
DC
-1
TC=25 C
TJ=150 C
Single Pulse
-2
10
0
10
1
10
2
10
Qg, Total Gate Charge (nC)
VDS, Drain-Source Voltage (V)
Figure 7. Gate Charge
Figure 8. Maximum Safe
Operating Area
VDD
t on
V IN
RL
D
VGS
RGEN
toff
tr
td(on)
td(off)
tf
90%
90%
VOUT
VOUT
10%
INVERTED
10%
G
90%
S
VIN
50%
50%
10%
PULSE WIDTH
Figure 10. Switching Waveforms
Figure 9. Switching Test Circuit
r(t),Normalized Effective
Transient Thermal Impedance
10
0
D=0.5
10
0.2
-1
0.1
0.05
10
PDM
0.02
0.01
-2
t1
Single Pulse
10
-3
10
-4
t2
1. RθJA (t)=r (t) * RθJA
2. RθJA=See Datasheet
3. TJM-TA = P* RθJA (t)
4. Duty Cycle, D=t1/t2
10
-3
10
-2
10
-1
10
0
Square Wave Pulse Duration (msec)
Figure 11. Normalized Thermal Transient Impedance Curve
4
10
1
10
2
3