TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 FEATURES 1 12 4 11 5 10 6 9 7 8 VCC(5.0) VPU(3.3) Vreg(3.3) D+ D– OE SUSPEND RGT PACKAGE (BOTTOM VIEW) APPLICATIONS • • • 3 Cellular Phones Personal Digital Assistants (PDAs) Handheld Computers VM 4 VP 3 RCV 2 SPEED 1 NC • 13 SUSPEND • 14 2 5 6 7 8 GND (Exposed die pad) 16 15 14 9 OE 10 D– 11 D+ 12 Vreg(3.3) 13 VPU(3.3) • 1 VCC(5.0) • SPEED RCV VP VM SOFTCON GND GND • VCC(I/O) VCC(I/O) • PW PACKAGE (TOP VIEW) SOFTCON • Complies With Universal Serial Bus Specification Rev. 2.0 (USB 2.0) Transmits and Receives Serial Data at Both Full-Speed (12-Mbit/s) and Low-Speed (1.5-Mbit/s) Data Rates Integrated Bypassable 5-V to 3.3-V Voltage Regulator for Powering Via USB VBUS Low-Power Operation, Ideal for Portable Equipment Meets the IEC-61000-4-2 Contact (±9KV) and Air-gap (±9KV) ESD Ratings Separate I/O Supply With Operation Down to 1.65 V Very-Low Power Consumption to Meet USB Suspend Current Requirements No Power-Supply Sequencing Requirements NC • NC – No internal connection DESCRIPTION/ORDERING INFORMATION The TUSB2551 is a single-chip transceiver that complies with the physical-layer specifications of universal serial bus (USB) 2.0. The device supports both full-speed (12-Mbit/s) and low-speed (1.5-Mbit/s) operation. The TUSB2551 delivers superior edge rate control, producing crisper eye diagrams, which ease the task of passing USB compliance testing. A dual supply-voltage operation allows the TUSB2551 to reference the system interface I/O signals to a supply voltage down to 1.6 V, while independently powered by the USB VCC(5.0). This allows the system interface to operate at its core voltage without the addition of buffering logic, and also reduce system operating current. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RGT Reel of 2000 TUSB2551RGTR ZWT TSSOP – PW Reel of 3000 TUSB2551PWR TU2551 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 BLOCK DIAGRAM To Internal Circuitry LDO Regulator VCC(I/O) VCC(5.0) Vreg(3.3) VPU(3.3) SOFTCON D+ SPEED OE D– Level Translator RCV VP VM SUSPEND GND 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 TERMINAL FUNCTIONS TERMINAL RGT NO. PW NO. I/O VCC(I/O) 15 1 I System interface supply voltage. Used to provide reference supply voltage for system I/O interface signaling. SPEED 1 2 I Speed. Edge-rate control: A logic HIGH operates at edge rates for full-speed operation. A logic LOW operates at edge rates for low-speed operation. RCV 2 3 O Receive data. Output for USB differential data. VP 3 4 I/O If OE = 1, VP = Receiver output (+) If OE = 0, VP = Driver input (+) VM 4 5 I/O If OE = 1, VM = Receiver output (–) If OE = 0, VM = Driver input (–) SOFTCON 5 6 I GND 6 7 SUSPEND 7 8 NAME DESCRIPTION Soft connect. Controls state of VPU(3.3). Refer to VPU(3.3) pin description for details. Ground reference I Suspend. Active high. Turns off internal circuits to reduce supply current. NC 8, 16 No internal connection OE 9 9 I D–, D+ 10, 11 10, 11 I/O Differential data lines conforming to the USB standard Vreg(3.3) 12 12 O 3.3-V reference supply. Requires a minimum 0.1-µF decoupling capacitor for stability. A 1-µF capacitor is recommended. VPU(3.3) 13 13 O Pullup supply voltage. Used to connect 1.5-kΩ pullup speed detect resistor. If SOFTCON = 1, VPU(3.3) is high impedance. If SOFTCON = 0, VPU(3.3) = 3.3 V. VCC(5.0) 14 14 I USB bus supply voltage. Used to power USB transceiver and internal circuitry. Output enable. Active low. Enables the transceiver to transmit data onto the bus. When inactive, the transceiver is in the receive mode. FUNCTIONAL DESCRIPTION FUNCTION SELECTION (1) SUSPEND OE D+, D– RCV VP, VM 0 0 Driving Active Active Normal transmit mode FUNCTION 0 1 Receiving Active Active Normal receive mode 1 0 Hi-Z 0 Not active 1 1 Hi-Z 0 Active Low power state Receiving during suspend (low power state) (1) During suspend, VP and VM are active in order to detect out-of-band signaling conditions. TRUTH TABLE DURING NORMAL MODE OE = 0 INPUT OUTPUT RESULT VP VM D+ D– RCV 0 0 0 0 X (1) SE0 0 1 0 1 0 Logic 0 1 0 1 0 1 Logic 1 1 (1) 1 1 1 X Undefined D+ D– VP VM RCV 0 0 0 0 X (1) SE0 0 1 0 1 0 Logic 0 1 0 1 0 1 Logic 1 1 (1) OE = 1 Input 1 (1) Output 1 1 X RESULT Undefined X = Undefined Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 3 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 Power-Supply Configurations The TUSB2551 can be used with different power-supply configurations, which can be dynamically changed. An overview is given in Table 1. • Normal mode – Both VCC(I/O) and VCC(5.0) or VCC(5.0) and Vreg(3.3) are connected. For 5-V operation, VCC(5.0) is connected to a 5-V source (4 V to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3-V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3-V source (3 V to 3.6 V). VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external circuit. • Disable mode – VCC(I/O) is not connected; VCC(5.0) or VCC(5.0) and Vreg(3.3) are connected. In this mode, the internal circuits of the TUSB2551 ensure that the D+ and D– pins are in 3-state, and the power consumption drops to the low-power (suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost. • Sharing mode – VCC(I/O) is connected; VCC(5.0) and Vreg(3.3) are not connected. In this mode, the D+ and D– pins are made 3-state, and the TUSB2551 allows external signals of up to 3.6 V to share the D+ and D– lines. The internal circuits of the TUSB2551 ensure that virtually no current (maximum 10 mA) is drawn via the D+ and D– lines. The power consumption through VCC(I/O) drops to the low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of Vreg(3.3) lost. Table 1. Power-Supply Configuration Overview Configuration Mode VBUS/VTRM VIF Notes Normal Connected Connected Normal supply configuration and operation. Disconnect (D+/D– sharing) Open Connected VP/VM are HIGH outputs, RCV is LOW. With OE# = 0 and SUSPEND = 1, data lines may be driven with external devices up to 3.6 V. With D+, D– floating, ICC(I/O) draws less than 1 µA. Disconnect Ground Connected VP/VM are HIGH outputs, RCV is LOW. With D+, D– floating, ICC(I/O)F draws less than 1 µA. Disable Mode Connected Open Prohibited Connected Ground Logic controlled inputs pins are Hi-Z Prohibited condition Table 2. Pin States in Disable or Sharing Mode PINS DISABLE-MODE STATE SHARING-MODE STATE VCC(5.0)/Vreg(3.3) 5-V input/3.3-V output, 3.3-V input/3.3-V input Not present VCC(I/O) Not present 1.65-V to 3.6-V input VPU(3.3) High impedance (off) High impedance (off) D+, D– High impedance High impedance VP, VM Invalid (1) H RCV Invalid (1) L Inputs (SPEED, SUSPEND, OE, SOFTCON) High impedance High impedance (1) 4 High impedance or driven LOW Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 Power-Supply Input Options The TUSB2551 has two power-supply input options. • Internal regulator – VCC(5.0) is connected to 4 V to 5.5 V. The internal regulator is used to supply the internal circuitry with 3.3 V (nominal). Vreg(3.3) becomes a 3.3-V output reference. • Regulator bypass – VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed, and the internal circuitry is supplied directly from the Vreg(3.3) power supply. The voltage range is 3 V to 3.6 V to comply with the USB specification. The supply-voltage range for each input option is specified in Table 3. Table 3. Power-Supply Input Options INPUT OPTION VCC(5.0) Vreg(3.3) VCC(I/O) Internal regualtor Supply input for internal regulator (4 V to 5.5 V) Voltage-reference output (3.3 V, 300 µA) Supply input for digital I/O pins (1.4 V to 3.6 V) Regulator bypass Connected to Vreg(3.3) with maximum voltage drop of 0.3 V (2.7 V to 3.6 V) Supply input (3 V to 3.6 V) Supply input for digital I/O pins (1.4 V to 3.6 V) Electrostatic Discharge (ESD) PIN NAME ESD IEC61000-4-2, Air-Gap Discharge D+, D–, VCC(5.0) All other pins IEC61000-4-2, Contact Discharge TYP ±9 ±9 Human-Body Model ±15 Human-Body Model ±2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 UNIT kV kV 5 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC(5.0) Supply voltage range –0.5 6 V VCC(I/O) I/O supply voltage range –0.5 4.6 V Vreg(3.3) Regulated voltage range –0.5 4.6 VI DC input voltage range –0.5 VCC(I/O) + 0.5 mA IO(D+, D-) Output Current (D+, D-) ±50 mA IO Output Current (all others) ±15 mA II Input Current ±50 mA Tstg Storage temperature range 150 °C (1) –65 UNIT V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS MIN TYP MAX UNIT VCC(5.0) Supply voltage, internal regulator option PARAMETER 5-V operation TEST CONDITIONS 4 5 5.25 V Vreg(3.3) Supply voltage, regulator bypass option 3.3-V operation 3 3.3 3.6 V VCC(I/O) I/O supply voltage 3.6 V 1.65 VIL Low-level input voltage (1) VCC(I/O) –0.3 0.15 VCC(I/O) V VIH High-level input voltage (1) 0.85 VCC(I/O) VCC(I/O) + 0.3 V D+, D– Input voltage on analog I/O pins 0 3.6 V Tc Junction temperature range –40 85 °C (1) 6 Specification applies to the following pins: SUSPEND, SPEED, RCV, SOFTCON, VP, VM, OE Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 DC ELECTRICAL CHARACTERISTICS SYSTEM AND USB INTERFACE (1) VCC(I/O) = 3.6 V, VCC(5.0) = 5 V (unless otherwise noted), TA = 25 C. Bold indicates specifications over temperature, –40°C to 85°C PARAMETER VOH High-level output voltage (2) VOL Low-level output voltage (2) IIL Input leakage current ICC(I/O) ICC(5.0) TEST CONDITIONS MIN IOH = 20 µA TYP MAX 0.9 VCC(I/O) V IOL = 20 µA (2) –5 0.1 V 1.5 5 µA SPEED SUSPEND OE 1 0 1 1 5 1 0 0 1 5 0 0 1 1 5 0 0 0 1 5 0 1 0 VCC(I/O) supply current VCC(5.0) supply current VOLTAGE VCC(5.0) = 5.25 V, VCC(I/O) = 3.6 V LOAD µA 1 5 1 2 mA 260 280 µA 1 0 0 f = 6 MHz, CL = 50 pF 0 0 0 f = 750 kHz, CL = 600 pF 1 0 1 800 1100 1 0 0 3000 5000 0 0 1 230 350 0 0 0 400 700 0 1 0 130 200 1 0 0 f = 6 MHz, CL = 50 pF 6 10 0 0 0 f = 750 kHz, CL = 600 pF 4..3 5 VCC(5.0) = 5.25 V, VCC(I/O) = 3.6 V UNIT µA mA IPU(3.3)LEAK VPU(3.3) leakage current SOFTCON = 1, VPU(3.3) = 0 V –5 5 µA ICC(I/O)LEAK VCC(I/O) leakage current VCC(I/O) = 3.6 V, VCC(5.0) = 0 V –5 5 µA VPU(3.3) Pullup output voltage Ireg(3.3) = 200 µA, VCC(5.0) = 4 V to 5.25 V 3.6 V RSW VPU(3.3) switch resistance Ireg(3.3) = 10 mA, VCC(5.0) = 4 V to 5.25 V 10 10 pulses ±9 10 pulses ±9 3 3.3 Ω ESD PROTECTION IEC-61000-4- Air-Gap Discharge 2 (D+, D–, Contact Discharge VCC(5.0) only) (1) (2) kV Specification for packaged product only Specification applies to the following pins: RCV, VP, VM, OE. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 7 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 DC ELECTRICAL CHARACTERISTICS TRANSCEIVER (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LEAKAGE CURRENT ILO Hi-Z state data line leakage (suspend mode) 0 V < VIN < 3.3 V, SUSPEND = 1 –10 10 µA INPUT LEVELS VDI Differential input sensitivity |(D+) – (D–)| 0.2 VCM Differential common mode range Includes VDI range 0.8 2.5 V VSE Single-ended receiver threshold 0.8 2 V Receiver hysteresis V 200 mV OUTPUT LEVELS VOL Static output low RL = 1.5 kΩ to 3.6 V VOH Static output high RL = 15 kΩ to GND 2.8 0.3 V 3.6 V CAPACITANCE CIN Transceiver capacitance Pin to GND ZDRV Driver output resistance Steady-state drive (1) 8 10 1 6 pF 11 Ω Specification for packaged product only Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 AC ELECTRICAL CHARACTERISTICS (1) PARAMETER TEST CONDITIONS MIN MAX UNIT DRIVER CHARACTERISTICS (LOW SPEED) TR Transition rise time CL = 200 pF, See Figure 2 CL = 600 pF 75 300 ns TF Transition fall time CL = 200 pF, See Figure 2 CL = 600 pF 75 300 ns LRFM Rise/fall time matching TR, TF VCRS Output signal crossover voltage 80 125 % 1.3 2 V DRIVER CHARACTERISTICS (FULL SPEED) TR Transition rise time CL = 50 pF, See Figure 2 4 20 ns TF Transition fall time CL = 50 pF, Figure 2 4 20 ns FRFM Rise/fall time matching (TR, TF) 90 111.1 % VCRS Output signal crossover voltage 1.3 2 V 15 ns TRANSCEIVER TIMING (FULL SPEED) tPVZ OE to receiver 3-state delay See Figure 1 tPZD Receiver 3-state to transmit delay See Figure 1 tPDZ OE to driver 3-state delay See Figure 1 tPZV Driver 3-state to receive delay See Figure 1 tPLH tPHL VP, VM to D+, D– propagation delay See Figure 4 17 ns tPLH tPHL D+, D– to RCV propagation delay See Figure 3 17 ns tPLH tPHL D+, D– to VP, VM propagation delay See Figure 3 10 ns (1) 15 ns 15 15 ns ns Specification for packaged product only Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 9 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 TIMING DIAGRAMS RECEIVE TRANSMIT OE tPVZ t PZV VP/VM tPZD tPDZ D+/D– Figure 1. Enable and Disable Times FALL TIME RISE TIME Differential Data Lines 90% 90% 10% 10% tR tF Figure 2. Rise and Fall Times D+ VCRS D– Differential Data Lines VCRS tPHL tPLH VOH VOL VSS Figure 3. Receiver Propagation Delay VOH VOL D+ tPLH tPHL VCRS D– Differential Data Lines VCRS Figure 4. Driver Propagation Delay 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 TUSB2551 ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER www.ti.com SCES667 – FEBRUARY 2008 TEST CIRCUITS D.U.T. 25 pF Figure 5. Load for VP, VM, RCV VTRM 15k D. U. T. 20 15k CL Figure 6. Load for D+, D– Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TUSB2551 11 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) TUSB2551PW PREVIEW TSSOP PW 14 90 TBD Call TI Call TI TUSB2551PWR PREVIEW TSSOP PW 14 2000 TBD Call TI Call TI TUSB2551RGTR ACTIVE QFN RGT 16 3000 Green (RoHS & no Sb/Br) TUSB2551RSVR PREVIEW QFN RSV 16 3000 TBD CU NIPDAU Call TI Level-1-260C-UNLIM Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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