NEC PS8101-V-F4

DATA SHEET
PHOTOCOUPLER
PS8101
1 Mbps HIGH CMR ANALOG OUTPUT TYPE
5-PIN SOP (SO-5) PHOTOCOUPLER
−NEPOC Series−
DESCRIPTION
The PS8101 is an optically coupled isolator containing a GaAlAs LED on the light emitting diode (input side) and a
PIN photodiode and a high-speed amplifier transistor on the output side on one chip.
This is a plastic SOP (Small Out-line Package) type for high density applications.
FEATURES
<R>
• High common mode transient immunity (CMH, CML = ±15 kV/μs MIN.)
• Small package (SO-5)
PIN CONNECTION
(Top View)
5
• High supply voltage (VCC = 35 V)
4
3
• High isolation voltage (BV = 3 750 Vr.m.s.)
1. Anode
2. Cathode
3. GND
4. VO
5. VCC
• High-speed response (tPHL = 0.8 μs MAX., tPLH = 1.2 μs MAX.)
• Ordering number of taping product: PS8101-F3, F4: 2 500 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
<R>
1
2
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40008902 (Option)
APPLICATIONS
• Computer and peripheral manufactures
• General purpose inverter
• Substitutions for relays and pulse transformers
• Power supply
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10260EJ06V0DS (6th edition)
Date Published August 2009 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2003, 2009
PS8101
<R>
PACKAGE DIMENSIONS (UNIT: mm)
3.4
5
+0.3
–0.1
4
3
7.0±0.3
4.4
2
2.6±0.2
0.15 +0.10
–0.05
1
0.1±0.1
<R>
0.5±0.3
1.27
0.4 +0.10
–0.05
0.25 M
MARKING EXAMPLE
SnBi PLATING
Ni/Pd/Au PLATING
8101
N931
No. 1 pin Mark
Initial of NEC
(Engraved mark)
N
No. 1 pin Mark
Initial of NEC
(Engraved mark)
*1
N
8101
N931
Type Number
Assembly Lot
9 31
*1
<R>
Bar : Pb-Free
*1
Bar : Pb-Free
2
PS8101
Air Distance (MIN.)
4.2 mm
Outer Creepage Distance (MIN.)
4.2 mm
Isolation Distance (MIN.)
0.2 mm
9 31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
PHOTOCOUPLER CONSTRUCTION
Parameter
N
N
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
Type Number
Assembly Lot
*1
Data Sheet PN10260EJ06V0DS
PS8101
<R>
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Packing Style
Safety Standard
Application Part
Approval
Number
Specification
PS8101
PS8101-A
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8101-F3
PS8101-F3-A
(SnBi)
Embossed Tape 2 500 pcs/reel
(UL, CSA approved)
PS8101-F4
PS8101-F4-A
PS8101-V
PS8101-V-A
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8101-V-F3
PS8101-V-F3-A
Embossed Tape 2 500 pcs/reel
(VDE0884 Part2)
PS8101-V-F4
PS8101-V-F4-A
PS8101
PS8101-AX
Pb-Free
20 pcs (Tape 20 pcs cut)
Standard products
PS8101-F3
PS8101-F3-AX
(Ni/Pd/Au)
Embossed Tape 2 500 pcs/reel
(UL, CSA approved)
PS8101-F4
PS8101-F4-AX
PS8101-V
PS8101-V-AX
20 pcs (Tape 20 pcs cut)
DIN EN60747-5-2
PS8101-V-F3
PS8101-V-F3-AX
Embossed Tape 2 500 pcs/reel
(VDE0884 Part2)
PS8101-V-F4
PS8101-V-F4-AX
*1
PS8101
Approved (Option)
Approved (Option)
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current
IF
25
mA
Reverse Voltage
VR
5.0
V
PD
45
mW
Supply Voltage
VCC
35
V
Output Voltage
VO
35
V
IO
8.0
mA
PC
100
mW
BV
3 750
Vr.m.s.
Operating Ambient Temperature
TA
–55 to +100
°C
Storage Temperature
Tstg
–55 to +125
°C
Diode
Power Dissipation
Detector
*1
Output Current
Power Dissipation
Isolation Voltage
*2
*3
*1 Reduced to 0.45 mW/°C at TA = 25°C or more.
*2 Reduced to 1.00 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-2 shorted together, 3-5 shorted together.
Data Sheet PN10260EJ06V0DS
3
PS8101
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Diode
Symbol
Forward Voltage
VF
IF = 16 mA
Reverse Current
IR
VR = 3 V
Forward Voltage
Temperature Coefficient
Terminal Capacitance
Detector
Coupled
Conditions
ΔVF/ΔTA
Ct
MIN.
TYP.
MAX.
Unit
1.7
2.2
V
10
μA
−2.1
mV/°C
V = 0 V, f = 1 MHz
30
pF
3
IF = 16 mA
High Level Output Current
IOH (1)
IF = 0 mA, VCC = VO = 5.5 V
High Level Output Current
IOH (2)
IF = 0 mA, VCC = VO = 30 V
Low Level Output Voltage
VOL
IF = 16 mA, VCC = 4.5 V, IO = 1.2 mA
0.1
Low Level Supply Current
ICCL
IF = 16 mA, VO = open, VCC = 30 V
50
High Level Supply Current
ICCH
IF = 0 mA, VO = open, VCC = 30 V
0.01
2
CTR
IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
20
35
Current Transfer Ratio
*1
15
500
nA
100
μA
0.4
V
μA
Isolation Resistance
RI-O
VI-O = 1 kVDC, RH = 40 to 60%
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
0.4
Propagation Delay Time
*2
(H → L)
tPHL
IF = 16 mA, VCC = 5 V, RL = 2.2 kΩ,
CL = 15 pF
0.5
0.8
Propagation Delay Time
*2
(L → H)
tPLH
0.6
1.2
<R>
Common Mode
Transient Immunity at
*3
High Level Output
CMH
IF = 0 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
15
<R>
Common Mode
Transient Immunity at
*3
Low Level Output
CML
IF = 16 mA, VCC = 5 V, RL = 4.1 kΩ,
VCM = 1.5 kV
−15
*1 CTR rank
K : 20 to 35 (%)
N : 15 to 35 (%)
4
Data Sheet PN10260EJ06V0DS
%
Ω
11
10
pF
μs
kV/μs
PS8101
*2 Test circuit for propagation delay time
Pulse input
0.1 μ F
(Pulse width = 100 μ s,
Duty cycle = 1/10)
Input
(Monitor)
Input
VCC = 5 V
RL = 2.2 kΩ
VO (Monitor)
CL = 15 pF
50%
5V
Output
1.5 V
VOL
47 Ω
tPHL
tPLH
CL is approximately 15 pF which includes probe and stray wiring capacitance.
*3 Test circuit for common mode transient immunity
1.5 kV
VCM 90%
IF
0.1 μ F
VCC = 5 V
RL = 4.1 kΩ
VO (Monitor)
10%
0V
tr
VO
(IF = 0 mA)
VCM
VO
(IF = 16 mA)
tf
5V
2V
0.8 V
VOL
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between
the leads of the photocoupler and capacitor is no more than 10 mm.
3. Avoid storage at a high temperature and high humidity.
Data Sheet PN10260EJ06V0DS
5
PS8101
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION vs.
AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
120
Detector Power Dissipation PC (mW)
40
30
20
10
25
0
50
75
40
20
50
75
100
FORWARD CURRENT vs.
FORWARD VOLTAGE
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
TA = +100°C
+50°C
+25°C
1
0°C
–25°C
0.1
1.2
1.4
1.6
1.8
2.0
2.2
IF = 0 mA
100
VCC = VO = 30 V
VCC = VO = 5.5 V
10
1
0.1
–25
2.4
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (°C)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
80
VCC = 4.5 V,
VO = 0.4 V
70
60
50
40
30
20
10
0
0.5
1
5
10
50
1.6
Remark
Normalized to 1.0
at TA = 25°C, IF = 16 mA,
VCC = 4.5 V, VO = 0.4 V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
–50
–25
0
25
50
75
Ambient Temperature TA (°C)
Forward Current IF (mA)
6
25
Ambient Temperature TA (°C)
High Level Output Current IOH (nA)
Forward Current IF (mA)
60
1 000
0.01
1.0
Current Transfer Ratio CTR (%)
80
Ambient Temperature TA (°C)
100
10
100
0
100
Normalized Current Transfer Raio CTR
Diode Power Dissipation PD (mW)
50
The graphs indicate nominal characteristics.
Data Sheet PN10260EJ06V0DS
100
PS8101
OUTPUT VOLTAGE vs.
FORWARD CURRENT
OUTPUT CURRENT vs.
OUTPUT VOLTAGE
6
5
IF = 25 mA
6
20 mA
15 mA
4
10 mA
5 mA
2
0
Propagation Delay Time tPHL, tPLH (μs)
Output Voltage VO (V)
8
2
4
6
8
4
3
10 12
14 16
0
18 20
5.6 kΩ
2
4
6
8
10
12
14 16
18 20
Output Voltage VO (V)
Forward Current IF (mA)
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
3.0
VCC = 5 V,
RL = 2.2 kΩ
2.0
tPHL
1.0
tPLH
0
5
10
15
20
25
10
VCC = 5 V,
IF = 16 mA
tPLH
1
tPHL
0.1
1k
Forward Current IF (mA)
Normalized Propagation Delay Time tPHL, tPLH
RL = 2.2 kΩ
2
1
Propagation Delay Time tPHL, tPLH (μs)
Output Current IO (mA)
10
10 k
100 k
Load Resistance RL (Ω)
NORMALIZED PROPAGATION DELAY TIME
vs. AMBIENT TEMPERATURE
5
Normalized to 1.0
at TA = 25°C,
IF = 16 mA, VCC = 5 V,
RL = 2.2 kΩ
4
3
2
tPLH
tPHL
1
0
–50
–25
0
25
50
75
100
Ambient Temperature TA (°C)
Remark
The graphs indicate nominal characteristics.
Data Sheet PN10260EJ06V0DS
7
PS8101
TAPING SPECIFICATIONS (UNIT: mm)
1.55±0.1
7.4±0.1
5.5±0.1
1.5+0.1
–0
12.0±0.2
2.0±0.05
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
3.45 MAX.
3.0±0.1
3.9±0.1
8.0±0.1
0.3±0.05
Taping Direction
PS8101-F4
PS8101-F3
Outline and Dimensions (Reel)
2.0±0.5
φ 100±1.0
φ 21.0±0.8
φ 13.0±0.2
R 1.0
φ 330±2.0
2.0±0.5
φ13.0±0.2
13.5±1.0
17.5±1.0
Packing: 2 500 pcs/reel
8
Data Sheet PN10260EJ06V0DS
11.9 to 15.4
Outer edge of
flange
PS8101
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.27
0.8
1.45
5.5
Data Sheet PN10260EJ06V0DS
9
PS8101
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
• Time of peak reflow temperature
10 seconds or less
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C
120±30 s
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
260°C or below (molten solder temperature)
• Time
10 seconds or less
• Preheating conditions
120°C or below (package surface temperature)
• Number of times
One (Allowed to be dipped in solder including plastic mold portion.)
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature)
350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
10
Data Sheet PN10260EJ06V0DS
PS8101
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
<R>
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between VCC
and GND at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
Data Sheet PN10260EJ06V0DS
11
PS8101
<R>
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Speck
Unit
55/100/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
UIORM
707
Vpeak
Upr
1 061
Vpeak
Upr
1 326
Vpeak
UTR
6 000
Vpeak
Upr = 1.5 × UIORM, Pd < 5 pC
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
CTI
Material group (DIN EN 60664-1 VDE0110 Part 1)
175
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–55 to +100
°C
VIO = 500 V dc at TA = 25°C
Ris MIN.
10
12
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Ris MIN.
10
11
Ω
Package temperature
Tsi
150
°C
Current (input current IF, Psi = 0)
Isi
200
mA
Power (output or total power dissipation)
Psi
300
mW
Ris MIN.
10
Isolation resistance, minimum value
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Isolation resistance
VIO = 500 V dc at TA = Tsi
12
Data Sheet PN10260EJ06V0DS
9
Ω
PS8101
• The information in this document is current as of August, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
Data Sheet PN10260EJ06V0DS
13
PS8101
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.