CLARE IAD112N

IAD112N
Integrated Telecom Circuits
Load Voltage
Load Current
Max RON
IAD112N
350
100
35
Description
The IAD112N Multifunction Telecom switch combines a
350V Form A relay and two optocouplers in a single package. The relay uses optically coupled MOSFET technology to provide 1500V of input to output isolation. The
efficient MOSFET switch and photovoltaic die use Clare’s
patented OptoMOS architecture. The optically coupled
input uses highly efficient GaAIAs infrared LEDs.
IAD112N’s allow telecom circuit designers to combine
three discrete functions in a single component. The
IAD112N’s small package uses less space than traditional discrete component solutions.
Units
V
mA
Ω
Features
• 16 Pin Narrow SOIC Package
• Three Functions in One Package
• Bi-Directional Current Sensing
• Bi-Directional Current Switching
• 3750VRMS Input/Output Isolation
• FCC Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Versions Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hookswitch
• Dial Pulsing
• Ground Start
• Ringer Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Approvals
• UL Recognized: File Number E76270
• CSA Certified: File Number LR 43639-12
• VDE Compatible
• BSI Certified:
• BS EN 60950:1992 (BS7002:1992)
Certificate #:7969
• BS EN 41003:1993
Certificate #:7969
Ordering Information
Part #
IAD112N
IAD112N
Description
16 Pin SOIC (Narrow) (50/Tube)
16 Pin SOIC (Narrow) (1000/Reel)
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
Switching Characteristics of
Normally Closed (Form B) Devices
10ms
10ms
CONTROL
CONTROL
90%
+
+
90%
LOAD
10%+
10%+
TON
DS-IAD112N-R2
www.clare.com
TOFF
+
90%
+10%
TOFF
TON
1
IAD112N
Absolute Maximum Ratings (@ 25˚ C)
Parameter
Total Package Dissipation
Isolation Voltage
Input to Output
Operational Temperature
Storage Temperature
Soldering Temperature
(10 Seconds Max.)
1
Min
3750
-40
-40
-
Absolute Maximum Ratings are stress ratings. Stresses
in excess of these ratings can cause permanent damage
to the device. Functional operation of the device at these
or any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings
for an extended period may degrade the device and effect
its reliability.
Typ Max Units
11
W
-
VRMS
+85
°C
+125 °C
+220 °C
Above 25˚ derate linerity 1.67mw/˚C
Electrical Characteristics
Parameter
Relay Portion
Output Characteristics @ 25°C
Load Voltage (Peak)
Load Current (Continuous)
Peak Load Current
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Relay Portion
Input Characteristics @ 25°C
Input Control Current
Input Dropout Current
Input Voltage Drop
Reverse Input Voltage
Reverse Input Current
Detector Portion
Output Characteristics @ 25°C
Phototransistor Blocking Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Detector Portion
Input Characteristics @ 25°C
Input Control Current
Input Voltage Drop
Input Current
(Detector must be off)
Input to Output Capacitance
Input to Output Isolation
2
Conditions
Symbol
Min
Typ
Max
Units
IL= 1µA
10ms
IL=100mA
VL=350V; TJ=25°C
VL
IL
ILPK
RON
ILEAK
-
-
350
100
350
35
1
V
mA
mA
Ω
µA
IF=5mA, VL =10V
IF=5mA, VL=10V
VL=50V, f=1MHz
TON
TOFF
-
-
25
3
3
-
ms
ms
pF
IL=100mA
IL=1mA
IF=5mA
VR=5V
IF
IF
VF
VR
IR
5
0.4
0.9
-
1.2
-
50
1.4
5
10
mA
mA
V
V
µA
IC =10µA
VCE=5V, IF =0mA
IC=2mA, IF=16mA
IF=6mA, VCE=0.5V
BVCEO
ICEO
VSAT
CTR
20
33
50
50
0.3
-
500
0.5
-
V
nA
V
%
IC=2mA,VCE=0.5V
IF=5mA
IC=1µA, VCE=5V
IF
ICEO
-
6
0.9
5
2
1.2
25
1.4
-
mA
V
µA
VL=50V, f=1MHz
-
CI/O
VI/O
3750
3
-
-
pF
VRMS
www.clare.com
Rev. 2
IAD112N
Mechanical Dimensions
PC Board Pattern
(Top View)
1.270
16 Pin SOIC Narrow (“N” Suffix)
(0.050)
6.09 ± .10
(.240 ± .004)
.38 x 45°
(.015 x 45°)
1.01 ± .025
(.040 ± .001)
2.18 MAX.
(.086)
.20 ± .025
(.008 ± .001)
3.81 ± .05
(.150 ± .002)
1.27 TYP.
(.050 TYP.)
5.080 ± .127
(.200 ± .005)
1.193
(.047)
9.93 ± .12
(.391 ± .005)
.787
(.031)
.38 TYP.
(.015 TYP.)
Tape and Reel Packaging for 8 and 16 Pin Narrow SOIC Package
330.2 DIA.
(13.00)
6.73
(.265)
Top Cover
Tape Thickness
.10 MAX.
(.004)
12.09
(.476)
1.75
(.069)
.41
(.016)
2.70
(.106)
2.30
(.091)
Top Cover
Tape
Embossed Carrier
Embossment
2.01
(.079)
1.50
(.059)
7.49
(.295)
16.00
(.630)
1
2.00
(.079)
.05R TYP.
3.99
(.157)
6.80
(.268) 10.30
(.406)
11.99
(.472)
3.00
(.118)
6.50
(.256)
1.55 ± .102
(.061 ± .004)
User Direction of Feed
Dimensions
mm
(inches)
Rev. 2
3
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http://www.clare.com
Clare cannot assume responsibility for use of any circuitry other
than circuitry entirely embodied in this Clare product. No circuit
patent licenses nor indemnity are expressed or implied. Clare
reserves the right to change the specification and circuitry, without notice at any time. The products described in this document
are not intended for use in medical implantation or other direct life
support applications where malfunction may result in direct physical harm, injury or death to a person.
Specification: DS-IAD112N-R2
©Copyright 2000, Clare, Inc.
All rights reserved. Printed in USA.
3/23/01