WL1271-TiWi SWRS100A – JANUARY 2011 – REVISED MARCH 2011 www.ti.com WLAN 802.11 b/g/n and Bluetooth® v2.1 + EDR Module FEATURES APPLICATIONS • IEEE 802.11 b/g/n Compliant • Typical WLAN Transmit power: – +20dBm, 11Mbps, CCK (b) – +14.5dBm, 54Mbps, OFDM (g) – +12.5dBm, 65Mbps, OFDM (n) • Typical WLAN Receiver sensitivity: – –89dBm, 8% PER, 11Mbps – –76dBm, 10% PER, 54Mbps – –73dBm, 10% PER, 65Mbps • Bluetooth v2.1 + Enhanced Data Rate (EDR) • Increased Bluetooth Transmit Power: +9.5dBm Typical • -92dBm typical Bluetooth® Receiver Sensitivity • Best-In-Class WLAN and Bluetooth Coexistence Technology on a Single-Chip • Enhanced Low Power (ELP™) Technology for Extended Battery Life • On Board TCXO, Power Regulation and U.FL Antenna Connector • Hardware and Software Pre-integration With TI's AM/DM37x (ARM Cortex™-A8), AM18xx (ARM9), and OMAP4™ (ARM Cortex™-A9) Platforms • Software Upgradable for ANT and Bluetooth Low Energy • Dimensions: 13mm x 18mm x 1.9mm • FCC/IC/CE Certified • Operating Temperature Range: –40°C to 85°C • • • • • • 1 2345 Consumer Devices Industrial and Home Automation Point of Sale and Point of Purchase Video Conferencing, Video Camera and VoIP Medical Devices Security and Surveillance DESCRIPTION The following product brief applies to LS Research’s WLAN + Bluetooth module, series name: TiWi. The WLAN + Bluetooth chip used is the WL1271 from Texas Instruments. The WL1271-TiWi is a fully-integrated high performance module offered by LS Research using TI’s single-chip WL1271 2.4GHz IEEE 802.11 b/g/n and Bluetooth v2.1 + Enhanced Data Rate (EDR) Transceiver. Based on TI’s 6th generation WLAN technology and 7th generation Bluetooth technology, the solution provides best-in-class coexistence capabilities coupled with TI’s Enhanced Low Power (ELP) technology. The WL1271-TiWi is provided as a module to help customers reduce development time, lower manufacturing costs, save board space, ease certification, and minimize RF expertise required. For evaluation and development, various platforms are available which integrate the WL1271-TiWi module, Linux WLAN drivers, BlueZ Bluetooth stack, and sample source applications running on a TI host processor (AM/DM37x, AM18x, OMAP4). The full specification and purchasing of the WL1271-TiWi module can be found on LSR's website (www.lsr.com/tiwi). More information on TI’s wireless platform solutions can be found on the Wireless Connectivity Wiki (www.ti.com/connectivitywiki). Disclaimer: All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of the third party products or services referenced on this product brief. This information is provided subject to TI’s Terms of Use. Be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OMAP4 is a trademark of Texas Instruments. Cortex is a trademark of ARM. Bluetooth is a registered trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 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