TI TPS53014DGSR

TPS53014
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SLVSBF1 – MAY 2012
Single Synchronous Step-down Controller for Low Voltage Power Rails
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FEATURES
1
•
2
•
•
•
•
•
•
•
•
•
D-CAP2™ Mode Control
– Fast Transient Response
– No External Parts Required For Loop
Compensation
– Compatible with Ceramic Output
Capacitors
High Initial Reference Accuracy (±1%)
Wide Input Voltage Range: 4.5 V to 28 V
Output Voltage Range: 0.77 V to 7.0 V
Low-Side RDS(on) Loss-Less Current Sensing
Adjustable Soft Start
Non-Sinking Pre-Biased Soft Start
500 kHz Switching Frequency
Cycle-By-Cycle Over Current Limiting Control
Auto-Skip Eco-ModeTM for High Efficiency at
Light load
•
•
•
•
OCL/OVP/UVP/UVLO/TSD Protections
Adaptive Gate Drivers with Integrated Boost
PMOS Switch
Thermally Compensated OCP, 4000 ppm/°C
10 pin VSSOP
APPLICATIONS
•
Point-of-Load Regulation in Low Power
Systems for Wide Range of Applications
– Digital TV Power Supply
– Networking Home Terminal
– Digital Set Top Box (STB)
– DVD Player / Recorder
– Gaming Consoles and Other
DESCRIPTION
The TPS53014 is a single, adaptive on-time D-CAP2™ mode synchronous buck controller. The TPS53014
enables system designers to complete the suite of various end equipment's power bus regulators with cost
effective low external component count and low standby current solution. The main control loop for the
TPS53014 uses the D-CAP2™ mode control which provides a very fast transient response with no external
compensation components. The Adaptive on-time control supports seamless transition between PWM mode at
higher load condition and Eco-mode™ operation at light load. Eco-mode™ allows the TPS53014 to maintain high
efficiency during lighter load conditions. The TPS53014 is also able to adapt to both low equivalent series
resistance (ESR) output capacitors such as POSCAP or SP-CAP and ultra-low ESR ceramic capacitors. The
device provides convenient and efficient operation with input voltages from 4.5 V to 28 V and output voltage from
0.77 V to 7.0 V.
The TPS53014 is available in the 3.0mm x 3.0 mm 10-pin VSSOP (DGS) package, and is specified for an
ambient temperature range of –40°C to 85°C.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
D-CAP2, Eco-mode, Eco-Mode are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS53014
SLVSBF1 – MAY 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TYPICAL APPLICATION CIRCUITS
VIN
TPS53014
VBST
10
DRVH
9
SW
8
EN
DRVL
7
VIN
PGND
6
1
VFB
2
SS
3
VREG5
EN
4
VIN
5
VOUT
ORDERING INFORMATION
TA
PACKAGE (1)
–40°C to 85°C
VSSOP
(1)
ORDERING PART NUMBER
TPS53014DGSR
PINS
10
TPS53014DGS
(1)
OUTPUT SUPPLY
ECO PLAN
Tape-and-Reel
Green
(RoHS & no Sb/Br)
Tube
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Operating under free-air temperature range (unless otherwise noted)
(1)
VALUE
Input voltage range
Output voltage range
VIN, EN
–0.3 to 30
VBST
–0.3 to 36
VBST - SW
–0.3 to 6
VFB
–0.3 to 6
SW
–0.3 to 30
SW (10 nsec transient)
–3.0 to 30
DRVH
–2 to 36
DRVH - SW
–0.3 to 6
DRVL, VREG5, SS
–0.3 to 6
PGND
UNIT
V
V
–0.3 to 0.3
TA
Operating ambient temperature range
–40 to 85
°C
TSTG
Storage temperature range
–55 to 150
°C
TJ
Junction temperature range
–40 to 150
°C
(1)
2
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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THERMAL INFORMATION
TPS53014
THERMAL METRIC (1)
θJA
Junction-to-ambient thermal resistance
172.2
θJCtop
Junction-to-case (top) thermal resistance
44.0
θJB
Junction-to-board thermal resistance
93.0
ψJT
Junction-to-top characterization parameter
1.6
ψJB
Junction-to-board characterization parameter
91.4
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
UNITS
DGS (10 PINS)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
Supply input voltage range
Input voltage range
Output Voltage range
MIN
MAX
4.5
28
VBST
–0.1
33.5
VBST - SW
–0.1
5.5
VFB
–0.1
5.5
EN
–0.1
28
SW
–1.0
28
DRVH
–1.0
33.5
DRVH - SW
–0.1
5.5
DRVL, VREG5, SS
–0.1
5.5
PGND
–0.1
0.1
VIN
UNIT
V
V
V
TA
Operating free-air temperature
–40
85
°C
TJ
Operating junction temperature
–40
125
°C
ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range, VIN = 12 V (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
IIN
VIN Supply current
IVINSDN
VIN Shutdown current
VIN current, TA = 25°C, EN = 5V, VVFB = 0.8V,
VSW = 0 V
660
VIN current, TA = 25°C, No Load , VEN = 0V,
VREG5 = OFF
6.0
μA
μA
VFB VOLTAGE and DISCHARGE RESISTANCE
VVFBTHL
VFB Threshold voltage
TA = 25°C , VOUT = 1.05 V
TCVFB
VFB Temperature coefficient
Relative to TA = 25°C (1)
765.3
-140
IVFB
VFB Input current
VFB = 0.8V, TA = 25°C
-150
773.0
-10
780.7
mV
140
ppm/°C
100
nA
VREG5 OUTPUT
VVREG5
VREG5 Output voltage
TA=25°C, 6 V < VIN < 28 V, IVREG5 = 5 mA
5.1
V
IVREG5
Output current
VIN = 5.5V, VVREG5 = 4.0V, TA = 25°C
120
mA
OUTPUT: N-CHANNEL MOSFET GATE DRIVERS
RDRVH
DRVH resistance
RDRVL
DRVL resistance
TD
Dead time
(1)
Source, IDRVH = –50mA, TA = 25°C
3.2
4.7
Sink, IDRVH = 50mA, TA = 25°C
1.4
2.4
Source, IDRVL = –50mA, TA = 25°C
6.9
8.2
Sink, IDRVL = 50mA, TA = 25°C
0.8
1.7
DRVH-low to DRVL-on (1)
15
(1)
20
DRVL-low to DRVH-on
Ω
Ω
ns
Ensured by design. Not production tested.
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ELECTRICAL CHARACTERISTICS (continued)
over recommended free-air temperature range, VIN = 12 V (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
0.1
0.2
V
-7.36
-6.4
-5.44
μA
4.5
5.0
INTERNAL BOOST DIODE
VFBST
Forward voltage
VVREG5-VBST, IF = 10mA, TA = 25°C
SOFT START
Issc
SS Charge current
VSS = 0V , TA = 25°C
Issd
SS Discharge current
VSS = 0.5V , TA = 25°C
TCISSC
ISSC Temperature coefficient
Relative to TA = 25°C
-4.5
mA
4.5
nA/°C
UVLO
VUVVREG5
VREG5 UVLO threshold
VREG5 Rising
4.0
Hysteresis
0.3
V
LOGIC THRESHOLD
VENH
EN H-level threshold voltage
VENL
EN L-level threshold voltage
REN
EN pin resistance to GND
1.6
VEN = 12 V
225
14.3
V
0.5
V
450
900
kΩ
15
15.8
CURRENT SENSE
ITRIP
TRIP Source current
VDRVL = 0.1V, TA = 25°C
TCVTRIP
VTRIP Temperature coefficient
Relative to TA = 25°C
VOCL
Current limit threshold
4000
μA
ppm/°C
RTRIP = 75kΩ, TA = 25°C
234
336
424
RTRIP = 27kΩ, TA = 25°C
121
174
220
RTRIP = 6.8kΩ, TA = 25°C
35
50
63
mV
ON-TIME TIMER CONTROL
TON
On time
VOUT = 1.05 V (2)
250
ns
TOFF(MIN)
Minimum off time
VIN = 4.5 V, VVFB = 0.7 V, TA = 25°C
230
ns
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP
Output OVP trip threshold
TOVPDEL
Output OVP propagation delay
VUVP
Output UVP trip threshold
TUVPDEL
Output UVP delay
TUVPEN
Output UVP enable delay
OVP detect voltage
115
120
UVP detect voltage
63
68
125
%
10
μs
73
1
UVP enable delay / soft start time
X1.4
X1.7
%
ms
X2.0
THERMAL SHUTDOWN
TSDN
(2)
4
Thermal shutdown threshold
Shutdown temperature (2)
Hysteresis
(2)
150
°C
25
Ensured by design. Not production tested.
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PIN FUNCTIONS
PIN
NAME
I/O
DESCRIPTION
VSSOP-10
VFB
1
I
D-CAP2 feedback input. Connect to output voltage with resistor divider.
SS
2
O
Soft start programming pin. Connect capacitor from SS pin to GND to program soft start time.
VREG5
3
O
Output of 5-V linear regulator and supply for MOSFET driver. Bypass to GND with a minimum 4.7-μF high
quality ceramic capacitor. VREG5 is active when EN is asserted high.
EN
4
I
Enable. Pull High to enable converter.
VIN
5
I
Supply Input for 5-V linear regulator. Bypass to GND with a minimum 0.1-μF high quality ceramic capacitor.
PGND
6
I
System ground.
DRVL
7
O
Low-side N-Channel MOSFET gate driver output. PGND referenced driver switches between PGND(OFF)
and VREG5(ON).
SW
8
I/O
Switch node connections for both the high-side driver and over current comparator.
DRVH
9
O
High-side N-channel MOSFET gate driver output. SW referenced driver switches between SW(OFF) and
VBST(ON).
VBST
10
I
High-side MOSFET gate driver bootstrap voltage input. Connect a capacitor from VBST to SW. An internal
diode is connected between VREG5 and VBST
10 PIN VSSOP
(TOP VIEW)
TPS53014
VBST
10
DRVH
9
SW
8
EN
DRVL
7
VIN
PGND
6
1
VFB
2
SS
3
VREG5
4
5
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FUNCTIONAL BLOCK DIAGRAM
VREG5
TPS53014
-32%
+
+
VFB
+20%
-
REF
SS
+
+
-
1
VBST
VIN
10
UV
DRVH
CONTROL
LOGIC
OV
9
SW
XCON
VOUT
8
VREG5
DRVL
7
1
SHOT
PGND
6
10µA
PGND
6.4µA
SGND
OCL
SS
2
+
ADC
SW
VIN
5
SGND
EN
EN
4
EN
LOGIC
UV
OV
UVLO
TSD
VIN
VREG5
SS LOGIC
3
VREG5
REF
REF
UVLO
PGND
PROTECTION
LOGIC
OVERVIEW
The TPS53014 is single synchronous step-down (buck) controller. It operates using D-CAP2™ mode control.
The fast transient response of D-CAP2™ control reduces the required amount of output capacitance to meet a
specific level of performance. Proprietary internal circuitry allows the use of low ESR output capacitors including
ceramic and special polymer types.
DETAILED DESCRIPTION
PWM OPERATION
The main control loop of the TPS53014 is an adaptive on-time pulse width modulation (PWM) controller that
supports a proprietary D-CAP2™ control mode. D-CAP2™ control combines constant on-time control with an
internal compensation circuit for pseudo-fixed frequency and low external component count configuration with
both low ESR and ceramic output capacitors. It is stable even with virtually no ripple at the output. At the
beginning of each cycle, the high-side MOSFET is turned on. this MOSFET is turned off when the internal timer
expires. This timer is set by the converter input voltage VIN, and the output voltage VO, to maintain a pseudofixed frequency over the input voltage range, hence it is called adaptive on-time control. The timer is reset and
the high-side MOSFET is turned on again when the feedback voltage falls below the nominal output voltage. An
internal ramp is added to the reference voltage to simulate output ripple, eliminating the need for ESR induced
output ripple from D-CAP2™ mode control.
6
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AUTO-SKIP Eco-Mode™ CONTROL
The TPS53014 is designed with Auto-Skip Eco-mode™ to increase light load efficiency. As the output current
decreases from heavy load condition, the inductor current is also reduced and eventually comes to point where
its rippled valley touches zero level, which is the boundary between continuous conduction and discontinuous
conduction modes. The rectifying MOSFET is turned off when its zero inductor current is detected. As the load
current further decreases the converter run into discontinuous conduction mode. The on-time is kept almost half
as is was in the continuous conduction mode because it takes longer time to discharge the output capacitor with
smaller load current to the level of the reference voltage. The transition point to the light load operation IOX(LL)
current can be calculated in Equation 1 with 500kHz used as fsw.
(V -V )×VOUT
1
IOUT(LL) =
× IN OUT
2×L×fSW
VIN
(1)
DRIVERS
TPS53014 contains two high-current resistive MOSFET gate drivers. The low-side driver is a PGND referenced,
VREG5 powered driver designed to drive the gate of a high-current, low RDS(on) N-channel MOSFET whose
source is connected to PGND. The high-side driver is a floating SW referenced, VBST powered driver designed
to drive the gate of a high-current, low RDS(on) N-channel MOSFET. To maintain the VBST voltage during the
high-side driver ON time, a capacitor is placed from SW to VBST. Each driver draws average current equal to
Gate Charge (Qg @ Vgs = 5V) times Switching frequency (fsw). To prevent cross-conduction, there is a narrow
dead-time when both high-side and low-side drivers are OFF between each driver transition. During this time the
inductor current is carried by one of the MOSFETs body diodes.
5-VOLT REGULATOR
The TPS53014 has an internal 5V Low-Dropout (LDO) Regulator to provide a regulated voltage for all both
drivers and the ICs internal logic. A high-quality 4.7µF or greater ceramic capacitor from VREG5 to GND is
required to stabilize the internal regulator.
SOFT START AND PRE-BIASED SOFT START
The soft start function is adjustable. When the EN pin becomes high, 6.4-µA current begins charging the
capacitor which is connected from the SS pin to GND. Smooth control of the output voltage is maintained during
start up. The equation for the slow start time is shown in Equation 2. VFB voltage is 0.773 V and SS pin source
current is 6.4-µA.
t
SS
(ms) =
CSS (nF) x VFB(V)
I (mA)
SS
=
CSS (nF) x 0.773 V
6.4mA
(2)
The TPS53014 contains a unique circuit to prevent current from being pulled from the output during startup if the
output is pre-biased. When the soft-start commands a voltage higher than the pre-bias level (internal soft start
becomes greater than internal feedback voltage VFB), the controller slowly activates synchronous rectification by
starting the first low side FET gate driver pulses with a narrow on-time. It then increments that on-time on a
cycle-by-cycle basis until it coincides with the time dictated by (1-D), where D is the duty cycle of the converter.
This scheme prevents the initial sinking of the pre-biased output, and ensures that the output voltage (VO) starts
and ramps up smoothly into regulation from pre-biased startup to normal mode operation.
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OVER CURRENT PROTECTION
TPS53014 has a cycle-by-cycle over current limit feature. The over current limits the inductor valley current by
monitoring the voltage drop across the low-side MOSFET RDS(on) during the low-side driver on-time. If the
inductor current is larger than the over current limit (OCL), the TPS53014 delays the start of the next switching
cycle until the sensed inductor current falls below the OCL current. MOSFET RDS(on) current sensing is used to
provide an accuracy and cost effective solution without external devices. To program the OCL, a resister should
be connected between DRVL and PGND. The recommended values are given inTable 1.
Table 1. OCL Resistor Values
Resister Value ( kΩ)
Vtrip (V)
6.8
0.050
11
0.087
18
0.125
27
0.174
39
0.224
56
0.274
75
0.336
IOCL is determined by Equation 3.
æ (V -V
) V ö V
IOCL = ç IN OUT × OUT ÷ + TRIP
ç 2×L×f
VIN ÷ø RDS(ON)
SW
è
(3)
The trip voltage is set between 0.05V to 0.336V over all operational temperature, including the 4000ppm/°C
temperature slope compensation for the temperature dependency of the RDS(on). If the load current exceeds the
over-current limit, the voltage will begin to drop. If the over-current conditions continues the output voltage will fall
below the under voltage protection threshold and the TPS53014 will shut down.
OVER/UNDER VOLTAGE PROTECTION
TPS53014 monitors a resistor divided feedback voltage to detect over and under voltage. If the feedback voltage
is higher than 120% of the reference voltage, the OVP comparator output goes high and the circuit latches the
high-side MOSFET driver OFF and the low-side MOSFET driver ON.
When the feedback voltage is lower than 68% of the reference voltage, the UVP comparator output goes high
and an internal UVP delay counter begins counting. After 1ms, TPS53014 latches OFF both top and bottom
MOSFET drivers. This function is enabled approximately 1.7 x Tss after power-on. The OVP and UVP latch off is
reset when EN goes low.
UVLO PROTECTION
TPS53014 has under voltage lock out protection (UVLO) that monitors the voltage of VREG5 pin. When the
VREG5 voltage is lower than UVLO threshold voltage, the device is shut off. All output drivers are OFF. The
UVLO is non-latch protection.
THERMAL SHUTDOWN
TPS53014 monitors its temperature. If the temperature exceeds the threshold value (typically 150°C), the device
shuts off. When the temperature falls below the threshold, the IC starts again. When VIN starts up and VREG5
output voltage is below its nominal value, the thermal shutdown threshold is kept lower than 150°C. As long as
VIN rises, TJ must be kept less than 110°C.
8
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TYPICAL CHARACTERISTICS
VIN = 12 V, TA= 25 °C (unless otherwise noted)
VIN SHUTDOWN CURRENT
vs
JUNCTION TEMPERATURE
1200
12
1000
10
Supply Current−Shutdown Current (µA)
Supply Current (µA)
VIN SUPPLY CURRENT
vs
JUNCTION TEMPERATURE
800
600
400
200
8
6
4
2
VIN = 12 V
0
−50
0
50
100
Junction Temperature (°C)
VIN = 12 V
0
−50
150
0
50
100
Junction Temperature (°C)
150
G001
G002
Figure 1.
Figure 2.
EN INPUT CURRENT
VS
EN INPUT VOLTAGE
SWITCHING FREQUENCY
vs
JUNCTION TEMPERATURE
600
80
70
500
Switching Frequency (kHz)
EN Input Current (µA)
60
50
40
30
400
300
200
20
100
VOUT = 1.05 V
VOUT = 1.8 V
VOUT = 3.3 V
10
IOUT = 3 A
VIN = 12 V
0
0
5
10
15
20
EN Input Voltage (V)
25
30
0
−50
0
50
100
Junction Temperature (°C)
G003
Figure 3.
150
G004
Figure 4.
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TYPICAL CHARACTERISTICS (continued)
VIN = 12 V, TA= 25 °C (unless otherwise noted)
SWITCHING FREQUENCY
vs
INPUT VOLTAGE
VFB VOLTAGE
vs
INPUT VOLTAGE
600
0.800
0.795
0.790
0.785
400
VFB Voltage (V)
Switching Frequency (kHz)
500
300
200
0.775
0.770
0.765
0.760
100
VOUT = 1.05 V
VOUT = 1.8 V
VOUT = 3.3 V
IOUT = 3 A
0
0.780
0
5
10
15
20
Input Voltage (V)
25
0.755
0.750
30
IOUT = 50 mA
IOUT = 2 A
0
5
10
15
20
Input Voltage (V)
25
30
G006
Figure 6.
VFB VOLTAGE
vs
AMBIENT TEMPERATURE
LOAD REGULATION
0.800
1.10
0.795
1.09
0.790
1.08
0.785
1.07
Output Voltage (V)
VFB Voltage (V)
G005
Figure 5.
0.780
0.775
0.770
1.06
1.05
1.04
0.765
1.03
0.760
1.02
0.755
0.750
−50
0
50
100
Ambient Temperature (°C)
VIN = 5 V
VIN = 12 V
VIN = 28 V
1.01
IOUT = 50 mA
IOUT = 2 A
150
1.00
0.0
1.0
2.0
3.0
4.0
5.0
Output Current (A)
G007
Figure 7.
10
6.0
7.0
8.0
G008
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
VIN = 12 V, TA= 25 °C (unless otherwise noted)
LINE REGULATION
TRANSIENT RESPONSE
1.10
1.09
VO (50 mV/div ac coupled)
1.08
Output Voltage (V)
1.07
1.06
1.05
IOUT (5 A/div)
1.04
1.03
1.02
1.01
1.00
Slew Rate (0.3 A/µsec)
IOUT = 50 mA
IOUT = 2 A
0
5
10
15
20
Input Voltage (V)
25
Time Scale (100 µsec/div)
30
G009
Figure 9.
Figure 10.
START UP WAVEFORMS
EFFICIENCY
100
EN (10 V/div)
90
80
VREG5 (5 V/div)
SS (2 V/div)
70
Efficiency (%)
VO (500 mV/div)
60
50
40
30
20
VOUT = 1.05 V
VOUT = 1.8 V
VOUT = 3.3 V
10
Time (1 msec/div)
VIN = 12 V
0
0.0
1.0
2.0
3.0
4.0
5.0
Output Current (A)
6.0
7.0
8.0
G012
Figure 11.
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
VIN = 12 V, TA= 25 °C (unless otherwise noted)
LIGHT LOAD EFFICIENCY
OUTPUT VOLTAGE RIPPLE, IOUT = 8 A
100
90
VO = 1.05 V
VO (20 mV/div ac coupled)
80
Efficiency (%)
70
60
50
SW (5 V/div)
40
30
20
VOUT = 1.05 V
VOUT = 1.8 V
VOUT = 3.3 V
10
VIN = 12 V
0
0.001
0.01
0.1
Output Current (A)
1
Time (1 µsec/div)
10
G013
Figure 13.
Figure 14.
OUTPUT VOLTAGE RIPPLE, IOUT = 50 mA
INPUT VOLTAGE RIPPLE, IOUT = 8 A
VO = 1.05 V
VO (20 mV/div ac coupled)
SW (5 V/div)
VO = 1.05 V
SW (5 V/div)
Time (1 µsec/div)
Time (10 µsec/div)
Figure 15.
12
VIN (50 mV/div ac coupled)
Figure 16.
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Product Folder Link(s) :TPS53014
TPS53014
www.ti.com
SLVSBF1 – MAY 2012
TYPICAL CHARACTERISTICS (continued)
VIN = 12 V, TA= 25 °C (unless otherwise noted)
INPUT VOLTAGE RIPPLE, IOUT = 50 mA
VO = 1.05 V
VIN (10 mV/div ac coupled)
SW (5 V/div)
Time (10 µsec/div)
Figure 17.
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Product Folder Link(s) :TPS53014
13
TPS53014
SLVSBF1 – MAY 2012
www.ti.com
APPLICATION INFORMATION
APPLICATION SCHEMATIC
A typical application schematic is shown in Figure 18.
VIN
R1
3.96k
R2
10.0k
C1
0.01µF
C2
4.7µF
SGND
VIN
EN
1
TPS53014
VBST
VFB
2
SS
3
VREG5
4
5
C3
10µF
C5
10µF
10
DRVH
9
SW
8
EN
DRVL
7
VIN
PGND
6
Q1
CSD17307Q5A
L1 1.5µH
C4
0.1µF
VOUT
Q2
CSD17510Q5A
R3
C6
22µF
C7
22µF
C8
22µF
PGND
PGND
Figure 18. Application Schematic
COMPONENT SELECTION
INDUCTOR
The inductance value is selected to provide approximately 30% peak to peak ripple current at maximum load.
Larger ripple current increases output ripple voltage, improve S/N ratio and contribute to stable operation.
Equation 4 can be used to calculate te value for LOUT.
VIN(MAX) -VOUT
V
L OUT =
× OUT
IL(RIPPLE) ×fSW VIN(MAX)
(4)
The inductors current ratings needs to support both the RMS (thermal) current and the peak (saturation) current.
The RMS and peak inductor current can be estimated as follows:
VIN(MAX) -VOUT
V
IL(RIPPLE) =
× OUT
LOUT ×fSW
VIN(MAX)
(5)
V
IL(PEAK) = TRIP +IL(RIPPLE)
RDS(ON)
(6)
IL(RMS) = IOUT 2 + 1 ×IL(RIPPLE)2
12
(7)
Note:
The calculation above shall serve as a general reference. To further improve transient response, the output
inductance could be reduced further. This needs to be considered along with the selection of the output
capacitor.
OUTPUT CAPACITOR
The capacitor value and ESR determines the amount of output voltage ripple and load transient response.
Ceramic output capacitors with X5R dielectric or better are recommended .
IL(RIPPLE)
1
COUT =
×
8×VOUT(RIPPLE) fSW
(8)
14
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COUT =
SLVSBF1 – MAY 2012
ΔILOAD2
×L OUT
2×VOUT ×ΔVOS
(9)
2
COUT =
ΔILOAD
×L OUT
2×K×ΔVUS
(10)
Where:
K= (VIN -VOUT )×
•
•
•
TON
TON -TOFF(MIN)
(11)
ΔVOS = The allowable amount of overshoot voltage in load transition
ΔVUS = The allowable amount of undershoot voltage in load transition
TOFF(MIN) = Minimum off time
Select the capacitance value greater than the largest value calculated from Equation 8, Equation 9 and
Equation 10. The minimum recommended output capacitance is 44 μF.
INPUT CAPACITOR
The TPS53014 requires an input decoupling capacitor and a bulk capacitor is needed depending on the
application. A minimum 10-μF high-quality ceramic capacitor is recommended for the input capacitor. The
capacitor voltage rating needs to be greater than the maximum input voltage.
BOOTSTRAP CAPACITOR
The TPS53014 requires a bootstrap capacitor from SW to VBST to provide the floating supply for the high-side
drivers. A minimum 0.1-μF high-quality ceramic capacitor is recommended. The capacitor voltage rating should
be greater than 10 V.
VREG5 CAPACITOR
The TPS53014 requires that the VREG5 regulator is bypassed. A minimum 4.7-μF high-quality ceramic capacitor
must be connected between the VREG5 and PGND for proper operation. The capacitor voltage rating should be
greater than 10 V.
CHOOSE OUTPUT VOLTAGE RESISTORS
The output voltage is set with a resistor divider from output voltage node to the VFB pin. It is recommended to
use 1% tolerance or better resistors. Select R2 between 10 kΩ and 100 kΩ and use Equation 12 to calculate R1.
æV
ö
R1 = ç OUT -1÷ ×R2
è VVFB ø
(12)
spacer
LAYOUT SUGGESTIONS
•
•
•
•
•
•
Keep the input switching current loop as small as possible.
Place the input capacitor close to the top switching FET. The output current loop should also be kept as small
as possible.
Keep the SW node as physically small and short as possible as to minimize parasitic capacitance and
inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the
feedback pin (VFB) of the device.
Keep analog and non-switching components away from switching components.
Make a single point connection from the signal ground to power ground.
Do not allow switching current to flow under the device.
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15
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
TPS53014DGS
ACTIVE
MSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
TPS53014DGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS53014DGSR
Package Package Pins
Type Drawing
MSOP
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
3.4
1.4
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jun-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS53014DGSR
MSOP
DGS
10
2500
366.0
364.0
50.0
Pack Materials-Page 2
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