CLD-DS16 Rev 7 Product family data sheet Cree XLamp MC-E LED ® ® MC-E White Product Description MC-E Dynamic White MC-E Color FEATURES Available in white (2600 K – Flux Characteristics..................... 2 of lighting-class, multi-chip LEDs 10,000 K CCT), EasyWhite™, Flux Characteristics, EasyWhite.... 3 that provides high lumen output Dynamic White, or color Characteristics - in a small package. Compared to (RGBW) The XLamp MC-E LED is a family discrete LEDs, XLamp MC-E LEDs • Table of contents • ANSI-compatible neutral & Complete Package.................. 4 Characteristics - warm white chromaticity bins reduce the distance between LED die, creating a small optical source • Individually addressable LEDs for excellent optical control and ef- • MC-E Dynamic White LEDs Per LED Die (White)................ 4 Characteristics Per LED Die (Color)................. 5 ficient color mixing. XLamp MC-E have two cool-white (6,500 K) Relative Spectral Power Distribution LEDs can reduce LED system com- and two warm-white (2,700 - White..................................... 5 plexity by reducing the number of K) LED die Relative Spectral Power Distribution MC-E EasyWhite LEDs avail- - Color...................................... 5 able in 2 and 4-step bins, up Relative Flux Output vs Junction to 85 CRI Temperature.............................. 6 Maximum drive current: 700 Electrical Characteristics.............. 7 mA per LED die Relative Intensity vs. Current....... 7 Reflow solderable – JEDEC Typical Spatial Radiation Pattern... 8 J-STD-020 Reflow Soldering Characteristics... 9 Electrically neutral thermal Notes.......................................10 path Mechanical Dimensions..............11 RoHS and REACH-compliant Tape and Reel...........................12 components required. • Cree XLamp LEDs bring high performance and quality of light to a wide • range of lighting applications, including color-changing lighting, por- • table and personal lighting, outdoor lighting, indoor directional lighting, • and entertainment lighting. • www. cree.com/Xlamp Dry Packaging and Packaging......13 Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 xlamp MC-e leds Flux Characteristics, White, Dynamic White, Color (TJ = 25°C) The following tables provide several base order codes for XLamp MC-E. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document. Part White Color Min. Max. Cool White 5,000 K 10,000 K Neutral White 3,700 K 5,000 K Warm White Dynamic White Color CCT / Dominant Wavelength Range 2,600 K 3,700 K Base order codes Min Luminous Flux (lm) @ 350 mA* Order Code Group Flux (lm) K 370 MCE4WT-A2-0000-000K01 M 430 MCE4WT-A2-0000-000M01 J 320 MCE4WT-A2-0000-000JE4 K 370 MCE4WT-A2-0000-000KE4 G 240 MCE4WT-A2-0000-000GE7 H 280 MCE4WT-A2-0000-000HE7 J 320 MCE4WT-A2-0000-000JE7 2 cool-white die 6,500 K K 100 2 warm-white die 2,700 K G 70 2 cool-white die 6,000 K K 100 2 warm-white die 2,700 K G 70 Red 620 nm 630 nm Green 520 nm 535 nm Blue 450 nm 465 nm Cool White 5,700 K 7,000 K 100 Red 620 nm 630 nm 30.6 Green 520 nm 535 nm Blue 450 nm 465 nm Neutral White 3,700 K 4,300 K MCEDWT-A1-0000-0000A1001 MCEDWT-A1-0000-0000A1002 30.6 A5 67.2 MCE4CT-A2-0000-00A5AAAA1 8.2 A4 67.2 8.2 MCE4CT-A2-0000-00A4AAAB1 80 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements and ±2 on CRI measurements. • Typical CRI for cool white and neutral white (3,700 K - 10,000 K CCT) is 75. • Typical CRI for warm white (2,600 K - 3,700 K CCT) is 80. • Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity of XLamp MC-E White are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp MC-E Dynamic White and MC-E Color are measured individually. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 xlamp MC-e leds Flux Characteristics, Easywhite MC-E LEDs (TJ = 25°C) The following table provides order codes for XLamp MC-E EasyWhite LEDs. For a complete description of the order-code nomenclature, please consult the XLamp MC-E Binning and Labeling document. Color CCT Range 4000 K Standard CRI EasyWhite 3500 K 3000 K 2700 K 4000 K 80-CRI Minimum EasyWhite 3500 K 3000 K 2700 K 85-CRI Minimum EasyWhite 3000 K 2700 K Base Order Codes Min Luminous Flux @ 350 mA, 25° C Group Flux (lm) K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 K 370 J 320 J 320 H 280 J 320 H 280 J 320 H 280 H 280 G 240 H 280 G 240 2-Step Order Code Chromaticity Region 40H 35H 30H 27H 40H 35H 30H 27H 30H 27H 4-Step Order Code Chromaticity Region MCEEZW-A1-0000-0000K040H MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J035H MCEEZW-A1-0000-0000H035H MCEEZW-A1-0000-0000J030H MCEEZW-A1-0000-0000H030H MCEEZW-A1-0000-0000J027H MCEEZW-A1-0000-0000H027H MCEEZW-H1-0000-0000K040H MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J035H MCEEZW-H1-0000-0000H035H MCEEZW-H1-0000-0000J030H MCEEZW-H1-0000-0000H030H MCEEZW-H1-0000-0000J027H MCEEZW-H1-0000-0000H027H MCEEZW-P1-0000-0000H030H MCEEZW-P1-0000-0000G030H MCEEZW-P1-0000-0000H027H MCEEZW-P1-0000-0000G027H 40F 35F 30F 27F 40F 35F 30F 27F 30F 27F MCEEZW-A1-0000-0000K040F MCEEZW-A1-0000-0000J040F MCEEZW-A1-0000-0000J035F MCEEZW-A1-0000-0000H035F MCEEZW-A1-0000-0000J030F MCEEZW-A1-0000-0000H030F MCEEZW-A1-0000-0000J027F MCEEZW-A1-0000-0000H027F MCEEZW-H1-0000-0000K040F MCEEZW-H1-0000-0000J040F MCEEZW-H1-0000-0000J035F MCEEZW-H1-0000-0000H035F MCEEZW-H1-0000-0000J030F MCEEZW-H1-0000-0000H030F MCEEZW-H1-0000-0000J027F MCEEZW-H1-0000-0000H027F MCEEZW-P1-0000-0000H030F MCEEZW-P1-0000-0000G030F MCEEZW-P1-0000-0000H027F MCEEZW-P1-0000-0000G027F Notes: • For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT. • Cree maintains a tolerance of ±7% on flux and power measurements. • Cree maintains a tolerance of ±2 on CRI measurements. • Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with all LEDs lit simultaneously. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 xlamp MC-e leds Characteristics - Complete Package The following table lists the product characteristics for the XLamp MC-E LED package. Characteristics Unit Minimum Typical Thermal Resistance, junction to solder point - white °C/W 3 Thermal Resistance, junction to solder point - color °C/W 4 Viewing Angle (FWHM) - white degrees 110 Viewing Angle (FWHM) - color degrees 115 ESD Classification (HBM per Mil-Std-883D) Maximum Class 2 LED Junction Temperature °C 150 Characteristics - Per LED Die (White, EasyWhite, Dynamic White) The following table lists the product characteristics of each individual LED die within the XLamp MC-E White LED package. Characteristics Unit Temperature Coefficient of Voltage Minimum Typical mV/°C DC Forward Current Maximum -4 mA 700 Reverse Voltage V 5 Forward Voltage (@ 350 mA) V 3.2 Forward Voltage (@ 700 mA) V 3.4 3.9 Characteristics - Per LED Die (Color) The following table lists the product characteristics for each LED die within the XLamp MC-E Color LED package. Characteristics Temperature Coefficient of Voltage DC Forward Current Reverse Voltage Unit Red Green Blue White mV/°C Typ. -2 -4 -4 -4 mA Max. 700 700 700 700 V Max. 5 5 5 5 Typ. 2.1 3.4 3.2 3.2 Max. 2.5 3.9 3.9 3.9 Typ. 2.3 3.7 3.5 3.5 Forward Voltage (@ 350 mA) V Forward Voltage (@ 700 mA) V Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 xlamp MC-e leds Relative Spectral Power Distribution (If = 350 mA per LED) - Whit Relative Spectral Power Distribution (IF = 350 mA per LED) - White The following graph graph represents typicaltypical spectral outputoutput of theofXLamp MC-E MC-E White White LED with allwith fourall LEDs simultaneously. The following represents spectral the XLamp LED fouron LEDs on simultaneously. Relative Radiant Power (%) 100 80 60 5000K - 10000K CCT 3700K - 5000K CCT 40 2600K - 3700K CCT 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Relative Spectral Power Distribution (IF = 350 mA per LED) - Color Relative Spectral Power Distribution (If = 350 mA per LED) - Color The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously. The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously. Relative Radiant Power (%) 100 80 60 RGBW (6000K) RGBW (4000K) 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 xlamp MC-e leds Relative Spectral Power Distribution (IF = 350 mA per LED) - Color (continued) The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently. The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently. Relative Radiant Power (%) 100 80 Red 60 Green Blue 40 White (6000K) White (4000K) 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Relative Flux Output vs Junction Temperature (IF = 350 mA) The following graph represents typical performance of each LED die in the XLamp MC-E LED. 100% Relative Luminous Flux 90% 80% 70% White 60% Red 50% Green 40% Blue 30% 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 xlamp MC-e leds Electrical Characteristics (TJ = 25˚C) The following graph represents typical performance of each LED die in the XLamp MC-E LED. 700 Forward Current (mA) 600 500 400 White, Blue 300 Red Green 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) Relative Intensity vs. Current (T = 25˚C) The following graph represents typical performanceJ of each LED die in the XLamp MC-E LED The following graph represents typical performance of each LED die in the XLamp MC-E LED. Relative Luminous Flux (%) 200 180 160 140 120 White, Blue 100 Red 80 Green 60 40 20 0 0 100 200 300 400 500 600 700 Forward Current (mA) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 xlamp MC-e leds Typical Spatial Radiation Pattern The following graph represents typical output of the XLamp MC-E LED with all four LEDs on simultaneously. Relative Luminous Intensity (%) 120 100 80 White 60 Color 40 20 0 -90 -60 -30 0 30 60 90 Angle (º) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 xlamp MC-e leds Reflow Soldering Characteristics In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 t 25˚C to Peak Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Time Lead-Based Solder Lead-Free Solder 3°C/second max. 3°C/second max. Preheat: Temperature Min (Tsmin) 100°C 150°C Preheat: Temperature Max (Tsmax) 150°C 200°C 60-120 seconds 60-180 seconds 183°C 217°C 60-150 seconds 60-150 seconds 215°C 260°C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max 6 minutes max. 8 minutes max. Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5°C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25°C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 xlamp MC-e leds Notes Moisture Sensitivity XLamp MC-E LEDs are shipped in sealed, moisture-barrier bags (MBB) designed for long shelf life. If XLamp MC-E LEDs are exposed to moist environments after opening the MBB packaging but before soldering, damage to the LED may occur during the soldering operation. The following derating table defines the maximum exposure time (in days) for an XLamp MC-E LED in the listed humidity and temperature conditions. LEDs with exposure time longer than Temperature Maximum Percent Relative Humidity 30% 40% 50% 60% 70% 80% 90% the time specified below must be baked according to 30ºC 9 5 4 3 1 1 1 the baking conditions listed here. 25ºC 12 7 5 4 2 1 1 20ºC 17 9 7 6 2 2 1 Baking Conditions It is not necessary to bake all XLamp MC-E LEDs. Only the LEDs that meet all of the following criteria must be baked: LEDs that have been removed from the original MBB packaging LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above LEDs that have not been soldered LEDs should be baked at 80ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking. Do not bake parts at temperatures higher than 80ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Storage Conditions XLamp MC-E LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ±5ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. RoHS Compliance The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/ EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006. Vision Advisory Claim WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the Cree LED Eye Safety Application Note (http://www.cree.com/products/pdf/XLamp_EyeSafety.pdf). Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 A Initial Release 10/16/07 RC B Change height due to new lens 10/23/2007 RC C Change recommended solder pad footprint 11/26/2007 RC D Height change due to new lens (was 3.86) 12/26/2007 RC E - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 5/12/2008 .80 TYP. 3 6 5 4 NOTICE RC CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. D xlamp MC-e leds 4 4.48±.20 D Mechanical Dimensions 1.45 All measurements are ±.1mm unless otherwise indicated. .05±.05 D3 6 D4 5 4 6 6 REV Bottom View C Top View 5 4 3 .05±.05 .05±.05 B 1 2.60 .25 +.2 1.16 9.0 .0 B 5.40 A 2 3 +.2 9.0 .0 DRAWN BY UNLESS OTHERWISE SPECIFIED R.Chaloupecky DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHECK Ban Loh TOLERANCE UNLESS SPECIFIED: APPROVED .X ± 0.3 .XX ± .13 ± 1° 1.16 FOR SHEET B METAL PARTS ONLY .X ± .25 .XX ± .10 X° 5.60 8 7 MATERIAL DATE 10/16/07 TITLE SIZE C FINAL PROTECTIVE FINISH SCALE 3.85 DRAWING NO. 20:1 2 1.00 TYP. 2610-00005 2.00 A 1.50 BSC PITCH REV. NEGATIVE (-) 1 7.70 10.02 8 8 NEGATIVE (-) 1 A 2.75 1.30 NEGATIVE (-) 2 NEGATIVE (-) 2 2.84 7.70 10.02 1 NEGATIVE (-) 3 D1 1.30 1. Tolerances: .10 Recommended PCB Solder Pad 2. Solder mask windows must be .05 mm bigger than 1.30PCB Solder Pad. NEGATIVE (-) 4 D1 1 6 2 NEGATIVE (-) 4 D2 D6 2 5 POSITIVE (+) 2 3 D3 D3 D7 POSITIVE (+) 1 D2 D6 6 6 NEGATIVE (-) 4 D5 D5 7 7 NEGATIVE (-) 3 2.84 7.70 10.02 RECOMMENDED PCB SOLDERNEGATIVE PAD (-) 3 C 6 5 1.50 BSC PITCH 2.84 7.00 7.70 10.02 NEGATIVE (-) 3 D7 3 5 NEGATIVE (-) 4 1 D1 4 D4 D8 4 olerances: .10 NDED PCBwindows SOLDER PAD older mask must be .05 mm bigger han PCB Solder Pad. 5 D5 D2 2 6 POSITIVE (+) 1 D3 3 D7 5 POSITIVE (+) 2 POSITIVE (+) 2 POSITIVE (+) 3 5 D4 4 4 POSITIVE (+) 4 D8 DRA UNLESS OTHERWISE SPECIFIED R.C DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHE Ba TOLERANCE UNLESS SPECIFIED: APPR .X ± 0.3 .XX ± .13 POSITIVE (+) 3 POSITIVE (+) 4 THIRD ANGLE PROJECTION POSITIVE (+) 4 Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to marks of Cree, Inc. 6 5 ECOMMENDED PCB SOLDER PAD 6 SOLDER PAD DRAWN BY D8 7 POSITIVE (+) 1 POSITIVE (+) 3 D4 8 .10 .10 8 7090MC PARALLEL / INDEPENDENTPCB RECOMMENDED CONFIGURATION 7 NEGATIVE (-) 1 2.00 1.50 BSC PITCH 6 NEGATIVE (-) 2 1. Tolerances: .10 1 7090MC PARALLEL / INDEPENDENT 2. Solder mask windows must be .05 mm bigger D6 CONFIGURATION than PCB Solder Pad. 2.84 2.75 2.00 5 2.00 7 7.00 E SHEET 1 OF 1 0 TYP. 7090 5 7090MC PARALLEL / INDEPENDENT CONFIGURATION 1.30 2.75 OUTLINE DRAWING, 7090MC PACKAGE 1.00 TYP. 6 A DATE ± 2° 5.60 4600 Silicon Drive Durham, N.C 27703 5.60 DATE 5/12/2 1.50 BSC 8 1.50 BSC PITCH .25 5.40 X° R3.18 .25 5.40 3.85 4 PITCH Dynamic White NEGATIVE (-) 1 D1: Cool White 7.00 .10 D2: Warm White D3: Cool White NEGATIVE (-) 2 D4: Warm White D1 D4 R3.18 7 Top View D1 D4 D2 D3 1.00 TYP. 7.50 8 D2 D3 7.50 3 .25 Color D2 D3 D1: Red D1 D4 D2: Green D3: Blue D4: White 7.50 4 3 2 R3.18 - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 4 R3.18 5.60 A 2.60 Side View .80 +.2 9.0 TYP. 1 2.0 +.13 .75 -.03 B C 1 D .80 TYP. +.13 .75 -.03 A 2.60 COMMENTS Initial Release REVISIONS .80 Change height due to new lens TYP. - Change height FROM 1.5 TO 1.45 Change recommended solderpackage pad footprint 11/26/ - Add LED reference designators E Series Configuration schematic Height change due -toDelete new lens (was 3.86) 12/26/ - Add tabs to recommended PCB footprint C E .05±.05 INK COMMENTS A 4.48±.20 A B DAT C Change recommended solder pad footprint Initial Release 10/16 D Height change due to new lens (was 3.86) Change height due to new lens 10/23/ REV 5.40 1.45 REV 2 +.13 .75 -.03 1.454.48±.20 E 2 1.45 HEATSINK D REVISIO 4.48±.20 C B C 3 4 N ARE THE PROPRIETARY AND FORMATION OF CREE, INC. THIS PLOT PIED, REPRODUCED OR DISCLOSED TO ANY OT AND THE INFORMATION .00 .10 ERSON WITHOUT THE WRITTEN CONSENT PROPRIETARY AND OF CREE, INC. THIS PLOT ODUCED OR DISCLOSED TO ANY HOUT THE WRITTEN CONSENT A A 2.60 5 1.50 BSC NOTICE AL. THIS D PLOT AND THE INFORMATION PITCH 5 75 3 HEATSINK NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. X° ± 1° FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 DATE UNLESS OTHERWISE SPECIFIED 10/16/07 R.Chaloupecky DIMENSIONS IN XLamp are registered X° trade± 2° change without notice. Cree, the Cree logoARE and DATE MILLIMETERS & BEFORE FINISH. CHECK DRAWN BY DATE Ban Loh 4 UNLESS OTHERWISETOLERANCE SPECIFIED UNLESS SPECIFIED: 3 10/16/07 R.Chaloupecky APPROVED DATE DIMENSIONS ARE IN .X ± 0.3 DATE TITLE MILLIMETERS & BEFORE FINISH. .XX ± CHECK .13 Ban Loh TOLERANCE UNLESS SPECIFIED: THIRD ANGLE PROJECTION MATERIAL X° ± 1° APPROVED DATE .X ± 0.3 TITLE .XX ± .13 FOR SHEET METAL PARTS ONLY 11 MATE FINAL O 7 xlamp MC-e leds Tape and Reel All measurements in mm. 4.0±.1 1.5±.1 12.0±.1 1.75±.10 5.5±.1 Cathode Side +.3 16.0 .0 Anode Side (denoted by chamfer) User Feed Direction END START Loaded Pockets (200 Lamps) Trailer 160mm (min) of empty pockets sealed with tape (13 pockets min.) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (34 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12 xlamp MC-e leds Dry Packaging and Packaging Dessicant Desiccant Dessicant Desiccant (inside bag) (inside bag) (inside bag) (inside bag) Humidity Indicator Humidity Indicator Humidity Indicator Card (inside bag)bag) Humidity Indicator (inside Card (inside bag)bag) (inside Vacuum-Sealed Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Vacuum-Sealed MoistureBarrier Barrier Bag Moisture Bag Moisture Barrier Bag Label Bin with Cree Bin CREE Code Label with Cree Bin CREE Bin Code & Barcode Label Code, Qty, Lot # & Barcode Label Code, Qty, Lot # Label with Cree Bin Label with Customer Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO Code, Qty, Lot ## P/N, Qty, Lot #, PO## Code, Qty, Lot Patent Label Patent Label Label with Customer Order Label withQty, Customer Code, Reel ID,Order PO # Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 13