CYSTEKEC MTP2305N3

Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 1/6
CYStech Electronics Corp.
P-CHANNEL Enhancement Mode MOSFET
MTP2305N3
Features
• VDS=-20V
RDS(ON)[email protected]=-4.5V, IDS=-4.2A
RDS(ON)[email protected]=-2.5V, IDS=-2A
• Advanced trench process technology
• Super high density cell design for extremely low on resistance
• Reliable and rugged
• Compact and low profile SOT-23 package
• Pb-free package
Equivalent Circuit
Outline
MTP2305N3
SOT-23
D
G:Gate
S:Source
D:Drain
G
S
Absolute Maximum Ratings (Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @TA=25°C (Note 1)
Continuous Drain Current @TA=70°C (Note 1)
Pulsed Drain Current
(Note 2)
Maximum Power Dissipation
Linear Derating Factor
Operating Junction and Storage Temperature
Symbol
Limits
Unit
VDS
VGS
ID
ID
IDM
PD
-20
±12
-4.2
-3.4
-10
1.38
0.01
-55~+150
V
V
A
A
A
W
W/°C
°C
Tj, Tstg
Note : 1. Surface mounted on 1 in² copper pad of FR-4 board, 270°C/W when mounted on minimum copper pad.
2. Pulse width limited by maximum junction temperature.
MTP2305N3
CYStek Product Specification
Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 2/6
CYStech Electronics Corp.
Thermal Performance
Parameter
Thermal Resistance, Junction-to-Ambient
Symbol
Rth,ja
Limit
90
Unit
°C/W
Note : Surface mounted on 1 in² copper pad of FR-4 board, 270°C/W when mounted on minimum copper pad.
Electrical Characteristics (Tj=25°C, unless otherwise specified)
Symbol
Static
BVDSS
ΔBVDSS/ΔTj
VGS(th)
IGSS
IDSS
*RDS(ON)
Min.
Typ.
Max.
Unit
-20
-0.5
-
-0.1
9
±100
-1
-10
53
65
100
250
-
V
V/°C
V
nA
µA
µA
740
167
126
5.9
3.6
32.4
2.6
10.6
2.32
3.68
-
27.7
22
-1.2
-
*GFS
Dynamic
Ciss
Coss
Crss
*td(ON)
*tr
*td(OFF)
*tf
*Qg
*Qgs
*Qgd
Source-Drain Diode
*VSD
*trr
*Qrr
-
Test Conditions
S
VGS=0, ID=-250µA
Reference to 25°C, ID=-1mA
VDS=VGS, ID=-250µA
VGS=±12V, VDS=0
VDS=-20V, VGS=0
VDS=-16V, VGS=0, Tj=70°C
ID=-4.5A, VGS=-10V
ID=-4.2A, VGS=-4.5V
ID=-2.0A, VGS=-2.5V
ID=-1.0A, VGS=-1.8V
VDS=-5V, ID=-2.8A
pF
VDS=-15V, VGS=0, f=1MHz
ns
VDS=-15V, ID=-4.2A, VGS=-10V, RD=3.6Ω,
RG=6Ω
nC
VDS=-16V, ID=-4.2A, VGS=-4.5V,
V
ns
nC
VGS=0V, ISD=-1.2A
mΩ
IS=-4.2A, VGS=0V, dI/dt=100A/µs
*Pulse Test : Pulse Width ≤300µs, Duty Cycle≤2%
Ordering Information
Device
MTP2305N3
MTP2305N3
Package
SOT-23
(Pb-free)
Shipping
Marking
3000 pcs / Tape & Reel
2305
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 3/6
Characteristic Curves
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 4/6
Characteristic Curves(Cont.)
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 5/6
Characteristic Curves(Cont.)
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C417N3
Issued Date : 2007.07.27
Revised Date :
Page No. : 6/6
SOT-23 Dimension
Marking:
A
L
3
TE
2305
B
S
2
1
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
G
V
Style: Pin 1.Gate 2.Source 3.Drain
C
D
H
K
J
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP2305N3
CYStek Product Specification