W www.ti.com SLLS639 − JANUARY 2005 Description The MAX4594 is a single-pole single-throw (SPST) analog switch that is designed to operate from 2 V to 5.5 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. Applications D Sample-and-Hold Circuits Features D Low ON-State Resistance (10 W) D ON-State Resistance Flatness (1.5 W) D Control Inputs Are 5.5-V Tolerant D Low Charge Injection (5 pC Max) D 300-MHz −3-dB Bandwidth at 255C D Low Total Harmonic Distortion (THD) (0.05%) D 2-V to 5.5-V Single-Supply Operation D Specified at 5-V and 3.3-V Nodes D −80-dB OFF Isolation at 1 MHz D Latch-Up Performance Exceeds 100 mA Per D D D Battery-Powered Equipment (Cellular Phones, PDAs) D Audio and Video Signal Routing D Communication Circuits D D PCMCIA Cards JESD 78, Class II 0.5-nA Max OFF Leakage ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) TTL/CMOS-Logic Compatible Summary of Characteristics V+ = 5 V, TA = 25°C SOT-23 OR SC-70 PACKAGE (TOP VIEW) COM 1 NO 2 GND 3 Single Pole Single Throw (SPST) Configuration 5 V+ 4 IN Number of channels 1 ON-state resistance (ron) 10 Ω ON-state resistance flatness (ron(flat)) 1.5 Ω Turn-on/turn-off time (tON/tOFF) 35 ns/40 ns Charge injection (QC) 5 pC Bandwidth (BW) OFF isolation (OISO) FUNCTION TABLE NO TO COM, COM TO NO IN 300 MHz −80 dB at 1 MHz Total harmonic distortion (THD) 0.05% ±0.05 nA Leakage current(ICOM(OFF)/INO(OFF)) L OFF Power-supply current (I+) H ON Package option 1 µA 5-pin SOT-23 or SC-70 ORDERING INFORMATION TA −40°C to 85°C PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) SOT (SOT-23) − DBV Tape and reel MAX4594DBVR 6SA_ SOT (SC−70) − DCK Tape and reel MAX4594DCKR SA_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* Copyright 2005, Texas Instruments Incorporated W www.ti.com SLLS639 − JANUARY 2005 Pin Configurations Available in Other Pin Configurations COM 1 NO 2 GND 3 5 V+ 4 IN MAX4594 COM 1 NC 2 GND 3 5 V+ 4 IN MAX4595 IN 1 5 V+ COM 2 IN 1 5 V+ 4 NC COM 2 4 GND 3 NO MAX4596 GND 3 MAX4597 Absolute Minimum and Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) V+ VNO VCOM IK INO ICOM INO ICOM MIN MAX Supply voltage range(3) −0.3 6 UNIT V Analog voltage range(3)(4) −0.3 V+ + 0.3 V Analog port diode current VNO, VCOM < 0 −50 On-state switch current VNO, VCOM = 0 to V+ −20 20 mA On-state switch current (pulsed at 1 ms, 10% duty cycle) VNO, VCOM = 0 to V+ −40 40 mA −0.3 6 V VI IIK Digital input voltage range(3)(4) I+ IGND Continuous current through V+ θJA Package thermal impedance(5) Digital input clamp current VI < 0 mA −50 mA 100 Continuous current through GND −100 mA mA DBV package 206 DCK package 252 °C/W Tstg Storage temperature range −65 150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum (3) All voltages are with respect to ground, unless otherwise specified. (4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (5) The package thermal impedance is calculated in accordance with JESD 51-7. 2 W www.ti.com SLLS639 − JANUARY 2005 Electrical Characteristics for 5-V Supply(1) V+ = 4.5 V to 5.5 V, VIH = 2.4 V, VIL = 0.8 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX UNIT Analog Switch Analog signal range VCOM, VNO 0 VNO = 3.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C VNO = 1.5 V, 2.5 V, 3.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C ron(flat) NO OFF leakage current VNO = 1 V, VCOM = 4.5 V, or VNO = 4.5 V, VCOM = 1 V, Switch OFF, See Figure 14 25°C INO(OFF) COM OFF leakage current VCOM = 1 V, VNO = 4.5 V, or VCOM = 4.5 V, VNO = 1 V, Switch OFF, See Figure 14 25°C ICOM(OFF) INO(ON) VNO = 1 V, VCOM = 1 V, or Switch ON, VNO = 4.5 V, VCOM = 4.5 V, See Figure 15 or VNO = 1 V, 4.5 V, VCOM = Open, ON-state resistance ron ON-state resistance flatness NO ON leakage current COM ON leakage current ICOM(ON) VCOM = 1 V, VNO = 1 V, or Switch ON, VCOM = 4.5 V, VNO = 4.5 V, See Figure 15 or VCOM = 1 V, 4.5 V, VNO = Open, Full V+ 6.5 4.5 V 10 12 0.5 2 −0.5 0.01 Ω 0.5 5.5 V Full Ω 1.5 4.5 V Full V nA −5 −0.5 5 0.01 0.5 5.5 V nA Full −5 25°C −1 5 0.01 1 5.5 V nA Full −10 25°C −1 10 0.01 1 5.5 V nA Full −10 10 Full 2.4 5.5 V Full 0 0.8 V 25°C −1 Digital Control Input (IN) Input logic high Input logic low Input leakage current VIH VIL IIH, IIL VI = V+ or 0 Full 5V −1 0.03 1 1 µA A (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 3 W www.ti.com SLLS639 − JANUARY 2005 Electrical Characteristics for 5-V Supply(1) (continued) V+ = 4.5 V to 5.5 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX 20 35 UNIT Dynamic Turn-on time VNO = 3 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 5V tON Full 4.5 V to 5.5 V Turn-off time VCOM = 3 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 5V tOFF Full 4.5 V to 5.5 V CL = 1 nF, See Figure 20 25°C 5V 2 Switch OFF, See Figure 16 25°C 5V 8 pF 45 25 ns 40 50 ns Charge injection QC NO OFF capacitance CNO(OFF) VGEN = 0, RGEN = 0, VNO = 0 V, f = 1 MHz, COM OFF capacitance CCOM(OFF) VCOM = 0 V, f = 1 MHz, Switch OFF, See Figure 16 25°C 5V 8 pF NO ON capacitance CNO(ON)) VNO = 0 V, f = 1 MHz, Switch ON, See Figure 16 25°C 5V 20 pF COM ON capacitance CCOM(ON) VCOM = 0 V, f = 1 MHz, Switch ON, See Figure 16 25°C 5V 20 pF VI = 0 V, See Figure 16 25°C 5V 3 pF RL = 50 Ω, Signal = 0 dBm, Switch ON, See Figure 18 25°C 5V 300 MHz Digital input capacitance Bandwidth CI BW 5 pC OFF isolation OISO RL = 50 Ω, VNO = 1 VRMS, f = 1 MHz, CL = 5 pF, Switch OFF, See Figure 19 25°C 5V −80 dB Total harmonic distortion THD RL = 600 Ω, CL = 50 pF, VSOURCE = 5 Vp-p, f = 20 Hz to 20 kHz, See Figure 21 25°C 5V 0.05 % Supply Positive supply I+ VI = V+ or GND, Switch ON or OFF Full 5.5 V current (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 4 1 µA W www.ti.com SLLS639 − JANUARY 2005 Electrical Characteristics for 3-V Supply(1) V+ = 2.7 V to 3.6 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX UNIT Analog Switch Analog signal range ON-state resistance VCOM, VNO ron 0 VNO = 1.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C Full V+ 10 2.7 V 20 25 V Ω Digital Control Input (IN) Input logic high Input logic low VIH VIL Full 2 5.5 V Full 0 0.8 V Input leakage current IIH, IIL VI = V+ or 0 Turn-on time VNO = 2 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 3V tON Full 2.7 V to 3.6 V Turn-off time VCOM = 2 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 3V tOFF Full 2.7 V to 3.6 V VGEN = 0, RGEN = 0, CL = 1 nF, See Figure 20 25°C 3V 25°C Full −1 3.6 V 0.03 −1 1 1 µA A Dynamic Charge injection QC 25 45 55 30 50 60 2 ns ns 4 pC 1 µA Supply Positive supply I+ VI = V+ or GND, Switch ON or OFF Full 3.6 V current (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 5 W www.ti.com SLLS639 − JANUARY 2005 TYPICAL PERFORMANCE 10 8 TA = 25_C 8 6 855C 255C 6 ron (W) ron (Ω) V+ = 3 V 4 4 –405C V+ = 5 V 2 2 0 0 0 1 2 3 4 5 0 1 2 VCOM (V) 1.0 0.8 Leakage Current (nA) ron (W) ICOM(ON)/INO(ON) –405C 8 6 4 255C 855C 2 0.6 INO(OFF)/ICOM(OFF) 0.4 0.2 0.0 0 0 1 2 3 VCOM (V) .5 0.5 20 0.0 18 V+ = 3 V −0.5 −1.0 −1.5 V+ = 5 V −2.0 −2.5 tOFF 14 12 10 6 0 1 2 3 4 Bias Voltage (V) Figure 5. Charge-Injection (QC) vs VCOM 6 85°C 8 −3.0 1 25°C TA (°C) tON 16 tON/tOFF (ns) 0 Charge Injection (pC) .5 −40°C Figure 4. Leakage Current vs Temperature (V+ = 5 V) Figure 3. ron vs VCOM (V+ = 3 V) 1 5 Figure 2. ron vs VCOM (V+ = 5 V) 10 .5 4 VCOM (V) Figure 1. ron vs VCOM 2 3 5 0 1 2 3 V+ (V) 4 5 6 Figure 6. tON and tOFF vs Supply Voltage W www.ti.com SLLS639 − JANUARY 2005 TYPICAL PERFORMANCE 12 Logic Level Threshold (nA) 3 tON/tOFF (ns) 11 10 9 tON 8 7 tOFF 6 −40°C 25°C VIH 2 1 VIL 0 0 85°C 1 2 TA (5C) Figure 7. tON and tOFF vs Temperature (V+ = 5 V) 4 5 6 Figure 8. Logic-Level Threshold vs V+ 0.0 0 −0.5 −10 −20 Attenuation (dB) −1.0 Gain (dB) 3 V+ (V) −1.5 −2.0 −2.5 −3.0 −3.5 −30 −40 −50 −60 −70 −80 −90 −4.0 0.1 1 10 Frequency (MHz) 100 −100 0.1 1000 Figure 9. Bandwidth (Gain vs Frequency) (V+ = 5 V) 1 10 Frequency (MHz) 100 1000 Figure 10. Off Isolation vs Frequency 10 0.20 V+ = 5 V 9 8 0.15 7 5 V+ = 3 V 4 3 2 THD (%) I+ (µA) 6 0.10 V+ = 3 V 0.05 V+ = 5 V 1 0 −40°C 25°C 85°C TA (5C) Figure 11. Power-Supply Current vs Temperature 0.00 0.1 1 10 100 1000 Frequency (MHz) Figure 12. Total Harmonic Distortion vs Frequency 7 W www.ti.com SLLS639 − JANUARY 2005 PIN DESCRIPTION PIN NUMBER NAME 1 COM DESCRIPTION Common 2 NO Normally open 3 GND Digital ground 4 IN Digital control pin to connect COM to NO 5 V+ Power supply PARAMETER DESCRIPTION SYMBOL 8 DESCRIPTION VCOM Voltage at COM VNO Voltage at NO ron Resistance between COM and NO ports when the channel is ON ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions INO(OFF) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state INO(ON) Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output (COM) open ICOM(OFF) Leakage current measured at the COM port, with the corresponding channel (COM to NO) in the OFF state ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NO) in the ON state and the output (NO) open VIH Minimum input voltage for logic high for the control input (IN) VIL Maximum input voltage for logic low for the control input (IN) VI Voltage at the control input (IN) IIH, IIL Leakage current measured at the control input (IN) tON Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NO) signal when the switch is turning ON. tOFF Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NO) signal when the switch is turning OFF. QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NO or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL × ∆VCOM, CL is the load capacitance, and ∆VCOM is the change in analog output voltage. CNO(OFF) CNO(ON) Capacitance at the NO port when the corresponding channel (NO to COM) is OFF CCOM(OFF) CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NO) is OFF CI Capacitance of control input (IN) OISO OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NO to COM) in the OFF state. BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is −3 dB below the DC gain. THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic. I+ Static power-supply current with the control (IN) pin at V+ or GND Capacitance at the NO port when the corresponding channel (NO to COM) is ON Capacitance at the COM port when the corresponding channel (COM to NO) is ON W www.ti.com SLLS639 − JANUARY 2005 PARAMETER MEASUREMENT INFORMATION V+ VNO NO COM + VCOM Channel ON r on + VI ICOM IN VCOM * VNO W I COM VI = VIH or VIL + GND Figure 13. ON-State Resistance (ron) V+ VNO NO COM + VI VCOM + OFF-State Leakage Current Channel OFF VI = VIH or VIL IN + GND Figure 14. OFF-State Leakage Current (ICOM(OFF), INO(OFF)) V+ VNO NO COM + VI VCOM ON-State Leakage Current Channel ON VI = VIH or VIL IN + GND Figure 15. ON-State Leakage Current (ICOM(ON), INO(ON)) 9 W www.ti.com SLLS639 − JANUARY 2005 V+ VNO NO Capacitance Meter VBIAS = 0 V VI = VIH or VIL VCOM COM VBIAS Capacitance is measured at NO, COM, and IN inputs during ON and OFF conditions. IN VI GND Figure 16. Capacitance (CI, CCOM(OFF), CCOM(ON), CNO(OFF), CNO(ON)) V+ NO VCOM(3) VI VNO TEST RL CL tON 300 Ω 35 pF tOFF 300 Ω 35 pF COM CL(2) RL IN Logic Input(1) V+ Logic Input (VI) GND 50% 50% 0 tON tOFF Switch Output (VCOM) 90% 90% (1) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. (2) CL includes probe and jig capacitance. (3) See Electrical Characteristics for VCOM. Figure 17. Turn-On (tON) and Turn-Off Time (tOFF) V+ Network Analyzer 50 W VNO NO Channel ON: NO to COM COM VCOM Source Signal VI = V+ or GND Network Analyzer Setup 50 W VI + IN Source Power = 0 dBm (632-mV P-P at 50-W load) GND Figure 18. Bandwidth (BW) 10 DC Bias = 350 mV W www.ti.com SLLS639 − JANUARY 2005 V+ Network Analyzer Channel OFF: NO to COM 50 W VNO NO VI = V+ or GND VCOM COM Source Signal Network Analyzer Setup VI 50 W Source Voltage = 1 VRMS DC Bias = 350 mV IN + GND Figure 19. OFF Isolation (OISO) V+ RGEN Logic Input (VI) VIH OFF ON OFF V IL NO COM + VCOM ∆VCOM VCOM VGEN CL(1) VI VGEN = 0 to V+ RGEN = 0 CL = 1 nF QC = CL × ∆VCOM VI = VIH or VIL IN Logic Input(2) GND (1) CL includes probe and jig capacitance. (2) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. Figure 20. Charge Injection (QC) VI = V+/2 or −V+/2 RL = 600 Ω fSOURCE = 20 Hz to 20 kHz CL = 50 pF Channel ON: COM to NO VSOURCE = V+ P-P V+/2 Audio Analyzer NO Source Signal COM CL(1) 600 W VI 600 W IN GND −V+/2 (1) CL includes probe and jig capacitance. Figure 21. Total Harmonic Distortion (THD) 11 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) MAX4594DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 6SAR MAX4594DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 6SAR MAX4594DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 6SAR MAX4594DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SAR MAX4594DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SAR MAX4594DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) MAX4594DBVR SOT-23 DBV 5 3000 180.0 8.4 MAX4594DCKR SC70 DCK 5 3000 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 2.25 2.4 1.22 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX4594DBVR MAX4594DCKR SOT-23 DBV 5 3000 202.0 201.0 28.0 SC70 DCK 5 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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