TI SN54153

SDLS055A – DECEMBER 1972 – REVISED MAY 2007
(1)
(1)
(1) SN54S153, SN74153, and SN74S153 are obsolete.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
76011012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
76011012A
SNJ54LS
153FK
7601101EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601101EA
SNJ54LS153J
7601101FA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601101FA
SNJ54LS153W
JM38510/07902BEA
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
-55 to 125
JM38510/07902BFA
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
-55 to 125
JM38510/30902B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30902B2A
JM38510/30902BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30902BEA
M38510/30902B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30902B2A
M38510/30902BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30902BEA
SN54153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54153J
SN54LS153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS153J
SN54S153J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
-55 to 125
SN74153N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS153D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS153
SN74LS153DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS153
SN74LS153DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS153
SN74LS153DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS153
SN74LS153DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS153
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SN74LS153DRG4
ACTIVE
SOIC
D
16
SN74LS153J
OBSOLETE
CDIP
J
16
SN74LS153N
ACTIVE
PDIP
N
16
Eco Plan
Lead/Ball Finish
(2)
2500
Green (RoHS
& no Sb/Br)
TBD
25
Pb-Free
(RoHS)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
CU NIPDAU
(4/5)
Level-1-260C-UNLIM
0 to 70
Call TI
Call TI
0 to 70
CU NIPDAU
N / A for Pkg Type
0 to 70
LS153
SN74LS153N
SN74LS153N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS153NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS153N
SN74LS153NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS153
SN74LS153NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS153
SN74LS153NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS153
SN74S153D
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
SN74S153N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74S153N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SNJ54153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54153J
SNJ54153W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54153W
SNJ54LS153FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
76011012A
SNJ54LS
153FK
SNJ54LS153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601101EA
SNJ54LS153J
SNJ54LS153W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
7601101FA
SNJ54LS153W
SNJ54S153FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
SNJ54S153J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
-55 to 125
SNJ54S153W
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54153, SN54LS153, SN54S153, SN74153, SN74LS153, SN74S153 :
• Catalog: SN74153, SN74LS153, SN74S153
• Military: SN54153, SN54LS153, SN54S153
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS153DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LS153NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS153DR
SN74LS153NSR
SOIC
D
16
2500
333.2
345.9
28.6
SO
NS
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
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