EN71PL032A0A EN71PL032A Base MCP Stacked Multi-Chip Product (MCP) Flash Memory and RAM 32 Megabit (2M x 16-bit) CMOS 3.0 Volt-only Simultaneous Operation Page Mode Flash Memory and 16 Megabit (1M x 16-bit) Pseudo Static RAM Distinctive Characteristics MCP Features ■ Power supply voltage of 2.7 V to 3.3V ■ High performance - 70 ns ■ Package - 7 x 9 x 1.2mm 56 ball FBGA ■ Operating Temperature - 25°C to +85°C General Description The EN71PL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: ■ ■ EN29PL032A (Simultaneous Read/Write) Flash memory die. Pseudo SRAM. For detailed specifications, please refer to the individual datasheets listed in the following table. Device Document NOR Flash EN29PL032A Pseudo SRAM ENPSL16 Product Selector Guide 32Mb Flash Memory Device-Model# EN71PL032A0A pSRAM density Flash Access time 70ns Page read Access time 25ns Package 16M pSRAM pSRAM Access time 70ns pSRAM Page read Access time 25ns 56 FBGA This Data Sheet may be revised by subsequent versions 1 or modifications due to changes in technical specifications. ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A MCP Block Diagram This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 2 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A Connection Diagram MCP Flash-only Addresses Shared Addresses EN71PL032A0A A20 A19 – A0 Note: A9 = VID for HV Autoselect mode is not available for MCP product. This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 3 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A Pin Description Signal Description A20–A0 21 Address Inputs (Common) DQ15–DQ0 16 Data Inputs/Outputs (Common) CE1#f Chip Enable 1 (Flash) CE1#ps Chip Enable 1 (pSRAM) CE2ps Chip Enable 2 (pSRAM) OE# Output Enable (Common) WE# Write Enable (Common) RY/BY# Ready/Busy Output (Flash) UB# Upper Byte Control (pSRAM) LB# Lower Byte Control (pSRAM) RESET# Hardware Reset Pin, Active Low (Flash) WP#/ACC Hardware Write Protect/Acceleration Pin (Flash) VCCf Flash 3.0 volt-only single power supply VCCps pSRAM Power Supply VSS Device Ground (Common) NC Pin Not Connected Internally Note: A9 = VID for HV Autoselect mode is not available for MCP product. Logic Symbol This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 4 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A Purpose Eon Silicon Solution Inc. (hereinafter called “Eon”) is going to provide its products’ top marking on ICs with < cFeon > from January 1st, 2009, and without any change of the part number and the compositions of the ICs. Eon is still keeping the promise of quality for all the products with the same as that of Eon delivered before. Please be advised with the change and appreciate your kindly cooperation and fully support Eon’s product family. Eon products’ Top Marking cFeon Top Marking Example: cFeon Part Number: XXXX-XXX Lot Number: XXXXX Date Code: XXXXX For More Information Please contact your local sales office for additional information about Eon memory solutions. This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 5 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A ORDERING INFORMATION EN71PL032 A0 A ― 70 C W P PACKAGING CONTENT P = RoHS compliant TEMPERATURE RANGE W = Wireless (-25°C to +85°C) PACKAGE C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED 70 = 70ns A = version identifier pSRAM density A0 = 16M pSRAM BASE PART NUMBER EN = Eon Silicon Solution Inc. 71PL = Multi-chip Product (MCP) 3.0V Simultaneous Read/Write, Page Mode Flash Memory and RAM 032 = 32 Megabit (2M x 16) This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 6 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A PACKAGE MECHANICAL 56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package, pitch: 0.8mm, ball: 0.4mm SYMBOL DIMENSION IN MM MIN. NOR MAX A --- - -- 1.20 A1 0.25 0.30 0.35 A2 0.80 - -- 0.95 D E 8.95 6.95 9.00 7.00 9.05 7.05 D1 --- 5.60 - -- E1 --- 5.60 - -- e --- 0.80 - -- b 0.35 0.40 0.45 Note : Controlling dimensions are in millimeters (mm). This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 7 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com EN71PL032A0A Revisions List Revision No Description Date A Initial Release 2010/11/15 This Data Sheet may be revised by subsequent versions or modifications due to changes in technical specifications. 8 ©2004 Eon Silicon Solution, Inc., Rev. A, Issue Date: 2010/11/15 www.eonssi.com