EVERLIGHT 17-21-Y2C-A0L1M2V0B-3T-AM

Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Lead (Pb) Free Product - RoHS Compliant
Feature
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‧
‧
‧
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RoHS compliant.
Chip LED package.
Colorless clear resin
Wide viewing angle 140o.
Brightness:11.2 to 28.0 mcd at 5 mA.
Qualification according to AEC-Q101.
Precondition: Bases on JEDEC J-STD 020 Level 3.
Automotive reflow profile (IR reflow or wave soldering))
This is a preliminary specification
intended for design purposes and
subject to change without prior
notice.
Applications
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‧
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Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc.
Backlight: LCD, switches, symbol, mobile phone and illuminated advertising.
Display for indoor and outdoor application.
Ideal for coupling into light guides.
Substitution of traditional light.
Optical indicator.
General applications.
Device Selection Guide
Chip
Emitted Color
Resin Color
Brilliant Yellow
Water Clear
Material
AlGaInP
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Absolute Maximum Ratings (Ta=25℃)
Unit
Parameter
Symbol
Rating
Reverse Voltage
VR
12
V
Forward Current
IF
30
mA
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
60
mA
Power Dissipation
Pd
60
mW
Junction Temperature
Tj
125
℃
Operating Temperature
Topr
-40 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +110
℃
Rth J-A
800
K/W
Rth J-S
450
K/W
Thermal resistance
Soldering Temperature
ESD
(Classification acc. AEC Q101)
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
Reflow Soldering : 260 ℃ for 30 sec.
Hand Soldering : 350 ℃ for 3 sec.
Tsol
ESDHBM
2000
V
ESDMM
200
V
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditio
n
Luminous Intensity
Iv
11.2
-----
28.0
mcd
IF=5mA
Viewing Angle
2θ1/2
-----
140
-----
deg
IF=5mA
Peak Wavelength
λp
-----
591
-----
nm
IF=5mA
Dominant Wavelength
λd
585.5
----
594.5
nm
IF=5mA
Spectrum Radiation Bandwidth
∆λ
-----
15
-----
nm
IF=5mA
Forward Voltage
VF
1.70
----
2.20
V
IF=5mA
Reverse Current
IR
-----
-----
10
µA
VR=12V
Temperature coefficient of λp
TCλp
-----
0.06
-----
nm/K
IF=5mA
Temperature coefficient of λd
TCλd
-----
0.4
-----
nm/K
IF=5mA
Temperature coefficient of VF
TCV
-----
-2.3
-----
mV/K
IF=5mA
Note:
Tolerance of Luminous Intensity: ±11%
Tolerance of Dominant Wavelength: ±1nm
Tolerance of Forward Voltage: ±0.05V
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
L1
11.20
14.00
L2
14.00
18.00
M1
18.00
22.40
M2
22.40
28.00
Unit
Condition
mcd
IF=5mA
Unit
Condition
nm
IF=5mA
Note
Tolerance of Luminous Intensity:±11%
Bin Range of Dominant Wavelength
Bin Code
Min.
Max.
D3
585.5
588.5
D4
588.5
591.5
D5
591.5
594.5
Note:
Tolerance of Dominant Wavelength: ±1nm
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Typical Electro-Optical Characteristics Curves
Relative Intensity (%)
Typical curve of spectral distribution:
λp(nm)
Note: V(λ)=Standard eye response curve
View Angle
Diagram characteristics of radiation
Relative Intensity
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Dominant Wavelength vs. Forward Current
(Ta=25℃)
Forward Current (mA)
Dominant Wavelength (nm)
Forward Current vs. Forward Voltage
(Ta=25℃)
Forward Voltage (V)
Max. Permissible Forwarded Current
(Ta=25℃)
Forward Current (mA)
Relative Luminous Intensity
Relative Luminous Intensity vs.Forward
Current (Ta=25℃)
Forward Current (mA)
Forward Current (mA)
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Temperature (℃)
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Relative Luminous Intensity vs.
Relative Luminous Intensity
Junction Temperature
Relative Luminous Intensity
Junction Temperature
Relative Forward Voltage vs.
Junction Temperature (℃)
Note: f(Tj) = Iv - Iv(25℃); IF =20mA
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
http://www.everlight.com
Junction Temperature (℃)
Note: △VF = VF / VF(25 ℃) = f(Tj); IF =20mA
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Package Dimension
+
1.05
-
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Carrier Tape Dimensions: Loaded Quantity3000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Label Explanation
․CPN: Customer’s Product Number
․P/N: Product Number
․QTY: Packing Quantity
․CAT: Luminous Intensity Rank
․HUE: Dom. Wavelength Rank
․REF: Forward Voltage Rank
․LOT No: Lot Number
Pb
EVERLIGHT
CPN :
P N : XXXXXXXXXXXXX
RoHS
XXXXXXXXXXXXX
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Reel Dimensions
Label
Note: Unit = mm
Moisture Resistant Packaging Process and Materials
Label
Aluminum moisture-proof bag
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
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Desiccant
Label
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Precautions for Use
1. Soldering Condition (Reference: IPC/JEDEC J-STD-020D)
a. IR reflow
300
Temperature(℃)
max. 260℃
245℃
255℃
240℃
217℃
250
200
max. 30s
150
max. 100s
max. 120s
100
50
max. Ramp Up 3 ℃ /s
max. Ramp Down 6 ℃ /s
0
0
50
100
150
200
250
300
Times(s)
b. Wave soldering reflow
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
1.05
(B) Recommend soldering pad
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
2. Current limiting
A resistor should be used to limit current spikes that can be caused by voltage fluctuations.
Otherwise damage could occur.
3. Storage
3.1 Moisture proof bag should only be opened immediately prior to usage.
3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened.
3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be
exceeded.
3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component
should be baked at min. 60deg +/-5deg for 24 hours.
4. Iron Soldering
Hand soldering is not recommended for regular production. These guidelines are for rework only.
Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron
with nominal power less than 25W. Allow min. 2 sec. between soldering intervals.
5. Usage
Do not exceed the values given in this specification.
Application Restrictions
1. High reliability applications such as military/aerospace, automotive safety/security systems, and
medical equipment may require different product. If you have any concerns, please contact
Everlight before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
Everlight Electronics Co., Ltd.
Device No:DSE-0002823
http://www.everlight.com
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Technical Data Sheet
0805 Package Chip LED
Preliminary
17-21-Y2C-A0L1M2V0B-3T-AM
Revision History:
Rev.
Modified date
File modified contents
1
2009/11/30
新規制作
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Device No:DSE-0002823
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