EVERLIGHT 19-21-G6C-FM1N2B

Technical Data Sheet
0603 Package Chip LED (0.8mm Height)
19-21/G6C-FM1N2B/3T
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow
solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS complaint
version
Descriptions
․The 19-21 SMD LED is much smaller than lead
frame type components, thus enable smaller board
size, higher packing density, reduced storage space
and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in
telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide
Part No.
19-21/G6C-FM1N2B/3T
Chip
Material
AlGaInP
Emitted Color
Resin Color
Brilliant Yellow Green
Water Clear
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 1 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Package Outline Dimensions
Note: The tolerances unless mentioned are ±0.1mm, unit = mm.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 2 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
IFP
60
mA
Power Dissipation
Pd
60
mW
Electrostatic Discharge(HBM)
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Reflow Soldering:260 ℃ for 10 sec
Hand Soldering:350℃ for 3 sec
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
18.0
-----
45.0
mcd
Viewing Angle
2θ1/2
-----
100
-----
deg
Peak Wavelength
Dominant Wavelength
λp
-----
575
------
nm
λd
570
-----
574.5
nm
Spectrum Radiation
Bandwidth
△λ
-----
20
-----
nm
Forward Voltage
VF
1.75
----
2.35
V
Reverse Current
IR
-----
-----
10
μA
Condition
IF =20mA
VR =5V
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1V
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 3 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Bin Range Of Dom. Wavelength
Group
F
Bin
Min
Max
CC2
570.0
571.5
CC3
571.5
573.0
CC4
573.0
574.5
Unit
Condition
nm
IF =20mA
Unit
Condition
mcd
IF =20mA
Unit
Condition
V
IF =20mA
Bin Range Of Luminous Intensity
Bin
Min
Max
M1
18
22.5
M2
22.5
28.5
N1
28.5
36.0
N2
36.0
45.0
Bin Range Of Forward Voltage
Group
B
Bin
Min
Max
0
1.75
1.95
1
1.95
2.15
2
2.15
2.35
Notes:
1.Tolerance of Luminous Intensity ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage ±0.1 V
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 4 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Typical Electro-Optical Characteristics Curves
Ta=25°C
Forward Current
I (mA)
Relative luminous intensity ( % )
Ta=25°C
Wavelength λ(nm)
Forward Voltage VF (V)
Relative luminous intensity ( %)
Relative luminous intensity ( % )
Ta=25°C
Ambient Temperature Ta(°C )
Forward Current I (mA)
Forward Current
I (mA)
Ta=25°C
Ambient Temperature Ta (°C )
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 5 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Label explanation
EVERLIGHT
Pb
CAT: Luminous Intensity Rank
CPN :
P N : XXXXXXXXXXXXX
HUE: Dom. Wavelength Rank
RoHS
XXXXXXXXXXXXX
REF: Forward Voltage Rank
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned are ±0.1mm, unit = mm.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 6 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned are ±0.1mm, unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Desiccant
Rev.1
Label
Page: 7 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
Test
Sample
Hours/Cycles
Size
No.
Items
Test Condition
1
Reflow Soldering
Temp. : 260℃±5℃
Min. 5sec.
6 Min.
22 PCS.
0/1
Temperature Cycle
H : +100℃ 15min
∫ 5 min
L : -40℃ 15min
300 Cycles
22 PCS.
0/1
Thermal Shock
H : +100℃ 5min
∫ 10 sec
L : -10℃ 5min
300 Cycles
22 PCS.
0/1
Temp. : 100℃
1000 Hrs.
22 PCS.
0/1
Temp. : -40℃
1000 Hrs.
22 PCS.
0/1
2
3
High Temperature
Storage
Low Temperature
Storage
4
5
Ac/Re
6
DC Operating Life
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
7
High Temperature /
High Humidity
85℃/ 85%RH
1000 Hrs.
22 PCS.
0/1
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 8 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection , otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 9 of 10
Prepared by: Chen Zheng
19-21/G6C-FM1N2B/3T
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds
within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do
soldering of each terminal. Be careful because the damage of the product is often started at the time of the
hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a
double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether
the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD.
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936
Fax: 886-2267-6244, 2267-6189, 2267-6306
http://www.everlight.com
Everlight Electronics Co., Ltd.
http://www.everlight.com
Device No:
Prepared date:3-Jul-2011
Rev.1
Page: 10 of 10
Prepared by: Chen Zheng