X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator July 2011 Rev. 1.0.0 GENERAL DESCRIPTION APPLICATIONS The XRP2997 is a Double Data Rate (DDR) termination voltage regulator supporting all power requirements of DDR I, II and III memories and is capable of sinking or sourcing 2A continuously. Tightly regulating its output voltage within ±20mV, the XRP2997 converts input voltages as low as 1.1V while the output voltage is adjustable through an external resistor divider or by forcing the VREF pin voltage. It maintains a fast line and load transient response and only requires an output capacitance of 22µF to operate. An enable function via an external MOSFET and a soft start feature allow for a controlled implementation of power-up sequencing. Built-in source/sink overcurrent, overtemperature and under-voltage lockout protections insure safe operation under abnormal operating conditions. DDR I/II/III Memory Termination Active Termination Buses Audio-Video Equipments Video-Graphics Cards FEATURES DDR1, DDR2 and DDR3 Support 0.75VTT Generation ±20mV Output Voltage Offset 2 Amps Continuous Current Sourcing & Sinking 1.1V to 5.5V Wide Input Voltage Range Adjustable Output Voltage Suspend to RAM(STR), Enable & Soft Start Functions Stable with 22µF Ceramic Capacitor The XRP2997 meets JEDEC SSTL-2, SSTL-18, HSTL, SCSI-1 and SCSI-3 specifications for DDR SDRAM memories. UVLO, Over Temperature and Over Current Protections The XRP2997 is offered in a RoHS compliant, “green”/halogen free 8-pin Exposed Pad SOIC package. Pin/Function Compatible with SP2996B Minimal External Components RoHS Compliant “Green”/Halogen Free 8-Pin SOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: XRP2997 DDRIII VTT Application Diagram Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 – Fax. +1 510 668-7001 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Operating Temperature Range ................. -40°C to +85°C Thermal Resistance θJA ...................................... 60°C/W Thermal Resistance θJC ...................................... 16°C/W VIN, VREF, VCNTL .......................................... -0.3V to 6.0V Junction Temperature Range.................. -40°C to +150°C Storage Temperature ............................ -65°C to +150°C Lead Temperature (Soldering, 10 sec) ................... 260°C ELECTRICAL SPECIFICATIONS Specifications are for an Operating Ambient Temperature of TA = 25°C only; limits applying over the full Operating Junction Temperature range are denoted by a “•”. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for reference purposes only. Unless otherwise indicated, VIN = 1.8V/1.5V, VCNTL = 3.3V, VREF = 0.5xVIN, COUT = 22µF (ceramic), TA= 25°C. Parameter VIN, Input Voltage Range VCNTL, Input Voltage Range Min. ∆VLOR, Load Regulation Max. Units Conditions 1.1 1.8/1.5 5.5 V Keep VCNTL≥VIN during power on and power off sequences (note 4) 2.375 3.3 5.5 V Keep VCNTL≥VIN during power on and power off sequences (note 4) V IOUT = 0mA -20 +20 mV -20 +20 mV IOUT = 0.1mA to +2A -20 +20 mV IOUT = 0.1mA to -2A VOUT, Output Voltage VOS, Output Voltage Offset Typ. VREF IOUT = 0mA (note 1) IQ, Quiescent Current 2 90 µA VREF < 0.2V, VOUT = OFF ICNTL, Operating Current of VCNTL 1 2.5 mA IOUT = 0mA 1 µA IREF, Bias Current of VREF IIL, Current Limit 0 2.4 RDSCHG, Output Discharge Resistance VREF = 1.25V A Source: VOUT=0.33xVREF Sink: VOUT=0.95xVIN (note 3) Ω VREF=0V, VOUT=0.3V 160 °C 3.3V ≤ VCNTL ≤ 5V, guaranteed by design (note 4) 30 °C Guaranteed by design 3 18 25 Thermal Protection TSD, Thermal Shutdown Temperature Thermal Shutdown Hysteresis Shutdown Specifications 0.8 VTRIGGER, Shutdown Threshold V 0.2 Note Note Note Note 1: 2: 3: 4: Output ON VREF = 0V 1.25V Output OFF VREF = 1.25V 0V VOS offset is the voltage measurement defined as VOUT subtracted from VREF. Load regulation is measured at constant junction temperature, using pulse testing with a short ON time. Current limit is measured by applying a short duration current pulse. In order to safely operate your system, VCNTL must be > VIN. © 2011 Exar Corporation 2/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator BLOCK DIAGRAM Fig. 2: XRP2997 Block Diagram PIN ASSIGNMENT Fig. 3: XRP2997 Pin Assignment PIN DESCRIPTION Name Pin Number VIN 1 2 Exposed Pad GND Description Power Input Voltage Ground Signal 3 Reference Input Voltage. This input can also be used as an enable signal; pulling this pin low shuts down the XRP2997. Refer to typical application circuit. VOUT 4 Output Voltage NC 5, 7, 8 VCNTL 6 VREF NC Voltage for the driver circuit and all analog blocks ORDERING INFORMATION Part Number Temperature Range Marking XRP2997IDB-F/TR -40°C≤TA≤+85°C XRP2997I YYWWF XXXXXX Package Packing Quantity Note 1 Note 2 Exposed pad 2.5K/Tape & Reel RoHS Compliant SOIC-8 Halogen Free “YY” = Year – “WW” = Work Week – “L” = Lead Free Indicator - “X” = Lot Number; when applicable. © 2011 Exar Corporation 3/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 1.8V/1.5V, VCNTL = 3.3V, VREF = 0.5xVIN, COUT = 22µF (ceramic), TA= 25°C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Turn on and turn off vs. Temperature Fig. 5: Output Voltage vs. Temperature Fig. 6: Current limit (sourcing) vs. Temperature Fig. 7: Current limit (sinking) vs. Temperature Fig. 8: VIN=1.5V, VREF=0.75V source response Fig. 9: VIN=1.8V, VREF=0.9V source response © 2011 Exar Corporation 4/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator Fig. 10: VIN=2.5V, VREF=1.25V source response Fig. 11: VIN=1.5V, VREF=0.75V sink response Fig. 9: VIN=1.8V, VREF=0.9V sink response Fig. 10: VIN=2.5V, VREF=1.25V sink response Fig. 14: VIN=1.5V, VREF=0.75V source short circuit Fig. 15: VIN=1.8V, VREF=0.9V source short circuit © 2011 Exar Corporation 5/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator Fig. 11: VIN=2.5V, VREF=1.25V source short circuit Fig. 12: VIN=1.5V, VREF=0.75V sink short circuit Fig. 13: VIN=1.8V, VREF=0.9V sink short circuit Fig. 14: VIN=2.5V, VREF=1.25V sink short circuit exposed pad to a large land area on top layer of PCB and by using vias to connect the exposed pad to an interlayer(s) or bottom layer. All capacitors should be placed as close as possible to the respective pins. APPLICATION INFORMATION LAYOUT CONSIDERATIONS The XRP2997 is offered in the 8-pin exposedpad SOIC package in order to facilitate power dissipation (heat dissipation). Power dissipation can be maximized by soldering the © 2011 Exar Corporation 6/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator PACKAGE SPECIFICATION 8-PIN SOIC EXPOSED PAD Unit: mm (inch) Eject hole, oriented hole and mold mark are optional. © 2011 Exar Corporation 7/8 Rev. 1.0.0 X RP 2 9 9 7 2A DDR I/II/III Bus Termination Regulator REVISION HISTORY Revision Date 1.0.0 07/22/2011 Description Initial release of datasheet FOR FURTHER ASSISTANCE Email: [email protected] Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 – USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. or its in all Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. © 2011 Exar Corporation 8/8 Rev. 1.0.0