MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-1206A4 Features ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV IEC61000-4-2 ESD air discharge typical 15KV, max 25KV Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications Application High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface Electrical Diagram Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line. Electrical Characteristics Electrical Characteristics Parameter Symbol Conditions Min Typ Max Units Continuous operating voltage VDC --- --- --- 12 V Trigger voltage VT IEC61000-4-2 8KV contact discharge --- 300 --- V Clamping voltage VC IEC61000-4-2 8KV contact discharge --- 20 --- V Leakage current IL 12V VDC --- 0.10 10 nA Capacitance CP VR = 0V, f = 1MHz --- 0.15 0.3 pF Operating Temperature --- --- -40 --- 90 ℃ Storage Temperature --- --- -55 --- 150 ℃ ESD pulse withstand Pulses IEC61000-4-2 8KV contact discharge 2000 --- --- --- Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV direct discharge method Polymer ESD Suppressor 1 www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-1206A4 Typical PESD clamping for +8KV pulse per IEC61000-4-2 Design Recommendations for Dual USB2.0 Design Recommendations for I/O Port Polymer ESD Suppressor 2 www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-1206A4 Environmental Specifications Operation temperature: -40~90℃ Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85℃,1000hrs Thermal Shock: MIL-STD-202,Method 107G,-55℃to150℃,30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40℃, 3 solutions (H2O, detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Part Numbering Product Dimensions (mm) A B D C E Width A Min Max 1.50 1.70 Length B Min Max 3.52 3.72 Height C Min Max 0.33 0.43 Pad distance D Min Max 0.83 1.03 Terminal width E Min Max 0.52 0.62 Unit mm Recommended PAD Layout A Polymer ESD Suppressor B C D E F Unit Min Max Min Max Min Max Min Max Min Max Min Max 0.55 0.65 0.25 0.35 2.10 2.30 3.20 3.40 0.65 0.75 0.70 0.80 3 mm www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP12A-1206A4 Solder Reflow Recommendation Item A B C D E F Process Soak Start Soak time Soak end Peak Temp. Time above Cooling Description From ambient to soak temperature and soak start Soak time Soak end From soak temperature to Peak temperature Main heating time From main heating temperature to 100℃ Reach Temp. 150℃ - 180℃ --180℃ - 200℃ 260℃ 230℃ - 260℃ 100℃ Time or Rate 2℃ - 4℃ / sec 60s - 120s --2℃ - 3℃ / sec 40s - 60s Max. 4℃ / sec Notes: 1* Peak temperature can be high to 260℃, and the recommendation time is as below at 230℃ 40s ~ 60s at 240℃ 30s ~ 40s at 260℃ 5s ~ 10s 2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. 3* Devices can be cleaned using standard industry methods and solvents. 4* Component can withstand 270℃ 10 sec. 5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 3000pcs per reel. Polymer ESD Suppressor 4 www.goodark.com