GREATECS DX5

DIP Switches
End Stackable DIP Switches
DX5 Series
DX5S SMT Terminals
A
2.80±0.30 [0.1102±0.0118]
1.22 [0.0480]
2.54 [0.1000]
7.62 [0.3000]
6.00 [0.2362]
0.20 [0.0079]
0.40 [0.0157]
B
3.50±0.25 [0.1378±0.0098]
DX5T7 THT Terminals Pitch 7.62mm
TYP
4.50[0.1772]
8.50[0.3346]
DX5T8 THT Terminals Pitch 8.50mm
DX5J SMT Terminals J-Bending
How to order:
1
2
3
4
5
DX5
1
S
T7
T8
J
2
RA
RC
3
01
02
03
TYPE OF TERMINALS:
SMT
THT Pitch 7.62mm
THT Pitch 8.50 mm
SMT J-Bending
(Only 4, 8 & 10 positions)
ACTUATOR TYPE:
Raised Actuator
Recessed Actuator
NO. OF POSITIONS:
1 Positions
2 Positions
3 Positions
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04
05
06
07
08
09
10
12
4
N
T
5
TB
TR
4 Positions
5 Positions
6 Positions
7 Positions
8 Positions
9 Positions
10 Positions
12 Positions
SEAL:
Regular (Standard)
Top Tape Sealed (Only for recessed actuators)
PACKAGE STYLE:
Tube
Tape & Reel (Only for SMT terminals)
All dimensions are in millimeters, bracketed dimensions
are in inches.
General tolerances max. ± 0.20mm.
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DIP Switches
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DX5 Series
SPECIFICATIONS
1.Style:
This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly used
as signal switch of electric devices with the general requirements of mechanical
and electrical characteristics.
1.1 Operating Temperature Range : -20ɗ ~ +85ɗ
1.2 Storage Temperature Range : -40ɗ ~ +85ɗ
2. Current Range :
2.1 Non-Switching : 100mA, 50V DC
2.2 Switching
: 25mA , 24V DC
3. Type of Actuation: Actuated by sliding
4. Test Sequence
:
ELECTRIC PERFORMANCE
ITEM DESCRIPTION
1
2
3
4
MECHANICAL
PERFORMANCE
5
6
TEST CONDITIONS
Visual
By visual examination check without
Examination any out pressure & testing.
REQUIREMENTS
There shall be no
defects that affect the
serviceability of the
product.
1)To be measured between the two
terminals associated with each
Contact
switch pole.
100mŸ max. (initial)
Resistance 2)Measurements shall be made with a
1kHz shall current contact resistance
meter.
Insulation
500V DC, 1 minute ± 5 sec.
100MŸ min.
Resistance
500V AC (50Hz or 60 Hz) shall be
Dielectric
There shall be no
applied between all the adjacent
withstandbreakdown or
terminals and between the terminal
ing Voltage
flashover.
and the frame for 1 minute.
Capacitance 1 MHz ± 10 kHz
5 pF max.
Applied in the direction of operation.
ONĺOFF
1000gf max
Operation OFFĺON
Force
Ȑ9.8N maxȑ
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7
Stop
Strength
DX5 Series
A static load of 1 kgf is applied in the
operating direction and pulling direction
operated for a period of 15 seconds.
There shall be no sign of
damage mechanically.
MECHANICAL PERFORMANCE
1)Soldering Temperature :
Soldering
Heat
8
Resistance
9
10
DURABILITY
11
12
PROD SERIES
TEMP
TIME
THROUGH HOLE
TYPE
260ɗ±5ɗ
5±1 sec.
SMT TYPE
SEE PAGE 4
1)Contact Resistance :
200m͈Max
2)As shown in item 3~6
2)Duration of Solder Immersion:
5±1 sec.
3)Frequency of Soldering Process:
2 times max.
(PCB is 1.6mm in thickness.)
Shall be vibrated in accordance with
Method 201A of MIL-STD-202F
1)Frequency: 10-55-10 Hz 1 min/cycle.
As shown in item 2~6
Vibration
2)Direction: 3 vertical directions including the
direction of operation.
3)Test Time: 2 hours each direction.
Shall be shocked in accordance with Method
213B condition A of MIL-STD-202F
1)Acceleration: 50G.
Shock
As shown in item 2~6
2)Action Time : 11 ± 1 m sec.
3)Testing Direction: 6 sides.
4)Test cycle: 3 times in each direction
THT Soldering Temperature:245±3ɗ
Lead-Free solder烉M705E JIS Z 3282
No anti-soldering and the
Class A
coverage of dipping into
Solderability (Tin 96.5%炻Silver 3%炻Copper 0.5%)
solder must more than 75%
SMT SEE PAGE 4
Flux: 5-10 seconds.
was requested.
Duration of solder Immersion:
5±1 sec.
Measurements shall be made following
1)As show in item 3,4
the test set forth below:
Operation 1)25 mA, 24V DC resistive load
2)Contact Resistance:
)2)Rate of Operation: 15~20 cycles/ minute 500mŸ max.
Life
3)Cycle of Operation: 2000 cycles.
(final-after test)
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WEATHER-PROOF
13
Resistance
Low
Temperature
Resistance
High
14
Temperatur
e
DX5 Series
Following the test set forth below the
sample shall be left in normal temperature
and humidity conditions for an hour
As shown in item 2~6
before measurements are made :
1)Temperature : -40ɗ±3ɗ
2)Time: 96 hours
Following the test set forth below the
sample shall be left in normal temperature
1)As shown in item 3~6
and humidity conditions for an hour
2)Contact Resistance:
before measurements are made :
100mŸ max.
1)Temperature : 85ɗ±2ɗ
2)Time: 96 hours
Following the test set forth below the sample 1)As shown in item 4,6
2)Contact Resistance:
shall be left in normal temperature and
100mŸ max.
humidity conditions for an hour before
Resistance
3)Insulation Resistance:
15 Humidity measurements are made :
1)Temperature : 40ɗ±2ɗ
10MŸ min.
2)Relative Humidity :90~95%
3)Time: 96 hours
5. SOLDERING CONDITIONS:
ˍġ Condition for Soldering – SMT Terminals
MAX 260°
255°
230°
150°
Room
Temperature
120~150sec
5~10sec
60sec
TIME(sec)
Ŷ The condition mentioned above is the temperature on the Cu foil of the P.C.B surface.
There are cases where board’s temperature greatly differs from switch’s surface
temperature depending on board’s material, size, thickness, etc. Care, therefore,
should be used not to allow switch’s surface temperature to exceed 260ɗ.
Ŷ Manual Soldering
(THT Terminals)
Soldering Temperature
Max.350ɗ
Continuous Soldering Time
Max. 5 seconds
Ŷ Precautions in Handling
1. Care should be exercised so that flux from the upper part of the printed
circuit board does not adhere to the switch.
2. Don’t clean the switch body except with top tape sealed type, which can
only spray of cleaning method from top of s/w.
3. Please make sure that there is no flux rose over the surface of the PCB
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ITEM
DESC.
DX5 Series
Q’TY
MATERIALS
TREATMENT
REMARK
MOLDED BLACK
-
1.
COVER
1
HIGH – TEMP.
THERMOPLASTIC
PA-9T UL 94V-0
2.
CONTACT
*
COPPER
GOLD PLATED AT
CONTACT AREA.
-
3.
ACTUATOR
*
THERRMOPLASTIC
LCP UL 94V-0
MOLDED WHITE
-
4.
TERMINAL
1
BRASS
GOLD PLATED
-
5.
BASE
1
HIGH – TEMP.
THERMOPLASTIC
PA9T UL 94V-0
MOLDED BLACK
-
6.
TAPE
1
KAPTON
-
-
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