HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE Features High Speed Logic - SMT Typical Applications The HMC850LC3 is ideal for: Inputs Terminated Internally to 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement Propagation Delay: 75 ps • Serial Data Transmission up to 28 Gbps Fast Rise and Fall Times: 16 / 15 ps • Clock Buffering up to 20 GHz Programmable Differential Output Voltage Swing: 600 - 1100 mV Power Dissipation: 315 mW 16 Lead Ceramic 3x3 mm SMT Package: 9 mm 2 Functional Diagram General Description The HMC850LC3 is a 1:2 Fanout Buffer designed to support data transmission rates up to 28 Gbps, and clock frequencies as high as 20 GHz. All differential inputs and outputs are DC coupled and terminated on chip with 50 Ohm resistors to the positive supply, ground. The outputs may be used in either singleended or differential modes, and should be AC or DC coupled into 50 Ohm resistors connected to ground. The HMC850LC3 also features an output level control pin, VR which allows for loss compensation or for signal level optimization. The HMC850LC3 operates from a single -3.3V DC supply and is available in a ceramic RoHS compliant 3x3 mm SMT package. Electrical Specifications, TA = +25 °C, Vee = -3.3 V, VR = 0 V Parameter Conditions Power Supply Voltage Min. Typ. Max -3.6 -3.3 -3.0 Power Supply Current V 95 mA Maximum Data Rate 28 Gbps Maximum Clock Rate 20 GHz Input Voltage Range -1.5 0.5 V Input Voltage Differential 100 2000 mV Input Return Loss 10 dB Single-Ended, peak-to-peak 550 mVp-p Differential, peak-to-peak 1100 mVp-p Output High Voltage -10 mV Output Low Voltage -550 mV 16 / 15 ps Output Amplitude Output Rise / Fall Time 1 Units Frequency <20 GHz Single-Ended, 20% - 80% For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE Electrical Specifications (continued) Conditions Min. Typ. 28 dB rms 0.2 ps rms δ - δ, 215 -1 PRBS input [1] 2 Small Signal Gain Propagation Delay, td 75 D1 to D2 Data Skew, tSKEW 1 15 -1 [1] Deterministic jitter measured at 13 Gbps with a 300 mVpp, 2 DC Current vs. Supply Voltage DIFFERENTIAL VOLTAGE (mV) DC CURRENT (mA) ps ps 3 ps 1500 +25C +85C -40C Vr = +0.4 Vr = -0.4 110 100 90 80 -3.6 -3.5 -3.4 -3.3 -3.2 -3.1 -3 1400 1300 1200 1100 1000 900 800 600 500 -3.7 -2.9 +25C +85C -40C Vr = +0.4 Vr = -0.4 700 -3.6 -3.5 Output Differential vs. VR [2][4] 40 1400 35 -3.2 30 AMPLITUDE (dB) +25C +85C -40C 1200 -3.3 -3.1 -3 -2.9 Amplitude vs. Input Power [1][3][4] 1500 1300 -3.4 3 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) DIFFERENTIAL VOLTAGE (mV) 6 Output Differential vs. Supply Voltage [1][2] [1][2] 120 1100 1000 900 800 0 dBm -10 dBm -20 dBm -30 dBm 25 20 15 10 5 700 0 600 -5 500 -1.2 dB PRBS input sequence. 130 70 -3.7 Units 10 Random Jitter JR Deterministic Jitter, JD Max Frequency <20 GHz HIGH SPEED High Speed LOGIC -Logic SMT - SMT Parameter Output Return Loss -10 -1 -0.8 -0.6 -0.4 -0.2 VR (V) [1] VR = 0.0 V [2] Frequency = 13 Gbps 0 0.2 0.4 0 5 10 15 20 25 FREQUENCY (GHz) [3] Device measured on evaluation board with port extensions [4] Vee = -3.3 V For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3 2- 2 HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE 20 20 18 18 16 14 tr tf 12 10 -3.7 -3.6 -3.5 -3.4 -3.3 -3.2 tr tf 16 14 12 -3.1 -3 10 -1.2 -2.9 -1 -0.8 -0.6 SUPPLY VOLTAGE (V) -0.4 -0.2 0 0.2 0.4 VR (V) Input Return Loss vs. Frequency [1][3][4] Output Return Loss vs. Frequency [1][3][4] -5 5 0 RETURN LOSS (dB) -10 -15 -20 -25 -30 -35 -5 -10 -15 -20 -25 -30 -35 -40 0 5 10 15 FREQUENCY (GHz) [1] VR = 0.0 V 3 3- 3 Rise / Fall Time vs. VR [2][4] RISE/FALL TIME (ps) RISE/FALL TIME (ps) 3 RETURN LOSS (dB) High Speed HIGH SPEED LOGIC -Logic SMT - SMT Rise / Fall Time vs. Supply Voltage [2][4] [2] Frequency = 13 Gbps 20 25 0 5 10 15 20 25 FREQUENCY (GHz) [3] Device measured on evaluation board with port extensions [4] Vee = -3.3 V For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE Eye Diagram @ 30 Gbps Single-ended 550 mV data input. Pattern generated with four 215 -1 PN patterns applied to the inputs resulting in a Quasi-Periodiic PRBS pattern at 30 Gbps. Measured using Tektronix CSA 8000. Eye Diagram @ 34 Gbps Test Conditions: Single-ended 550 mV data input. Pattern generated with four 215 -1 PN patterns applied to the inputs resulting in a Quasi-Periodiic PRBS pattern at 34 Gbps. Measured using Tektronix CSA 8000. HIGH SPEED High Speed LOGIC -Logic SMT - SMT Test Conditions: 3 Timing Diagram For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3 4- 4 HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE High Speed HIGH SPEED LOGIC -Logic SMT - SMT Absolute Maximum Ratings 3 Power Supply Voltage (Vee) -3.75 V to +0.5 V Input Signals -2 V to +0.5 V Output Signals -1.5 V to +0.5 V Junction Temperature 125 °C Continuous Pdiss (T = 85 °C) (derate 17 mW/°C above 85 °C ) 0.68 W Thermal Resistance (Rth j-p) Worse case device to package paddle 59 °C/W Storage Temperature -65 °C to +150 °C Operating Temperature -40 °C to +85 °C ESD Sensitivity (HBM) Class 1C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 5. PACKAGE WARP SHALL NOT EXCEED 0.05 mm DATUM -C6. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. 7. PADDLE MUST BE SOLDERED TO Vee. 3 5- 5 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE Pin Descriptions Function Description 1, 4, 5, 8, 9, 12, 13, 16 GND These pins must be connected to a high quality RF/DC ground. 2, 3, 10, 11 D1P, D1N, D2N, D2P Differential Data Outputs: Current Mode Logic (CML) referenced to positive supply. 6, 7 DINP, DINN Differential Data Inputs: Current Mode Logic (CML) referenced to positive supply 14 VR Output level control. Output level may be increased or decreased by applying a voltage to VR per “Output Differential vs. VR” plot. 15 Package Base Vee These pins and the exposed paddle must be connected to the negative voltage supply. Interface Schematic For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HIGH SPEED High Speed LOGIC -Logic SMT - SMT Pin Number 3 3 6- 6 HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE High Speed HIGH SPEED LOGIC -Logic SMT - SMT Evaluation PCB 3 List of Materials for Evaluation PCB 125614 [1] Item Description J1 - J6 PCB Mount K RF Connectors J7 - J9 DC Pin C1, C2 100 pF Capacitor, 0402 Pkg. C3, C4 4.7 µF Capacitor, Tantalum R1 10 Ohm Resistor, 0603 Pkg. U1 HMC850LC3 Fanout Buffer PCB [2] 125612 Evaluation Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Arlon 25FR 3 7- 7 The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown. The exposed metal package base must be connected to Vee. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. Install jumper on JP1 to short VR to GND for normal operation. For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC850LC3 v02.0312 28 Gbps, 1:2 FANOUT BUFFER WITH PROGRAMMABLE OUTPUT VOLTAGE HIGH SPEED High Speed LOGIC -Logic SMT - SMT Application Circuit 3 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 3 8- 8