HOLTIC HI1566PCMF

HI-1565, HI-1566
MIL-STD-1553 / 1760
5V Monolithic Dual Transceivers
July 2009
DESCRIPTION
PIN CONFIGURATIONS
The receiver section of each bus converts the 1553 bus biphase differential data to complementary CMOS / TTL data
suitable for inputting to a Manchester decoder. Each
receiver has a separate enable input which can be used to
force the output of the receiver to a logic 0 (HI-1565) or
logic 1 (HI-1566).
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer.
FEATURES
! Compliant to MIL-STD-1553A & B,
MIL-STD-1760, ARINC 708A
! CMOS technology for low standby power
! Smallest footprint available in 44-pin plastic
N/C 1
RXENA 2
GNDA 3
GNDA 4
GNDA 5
VDDB 6
VDDB 7
BUSB 8
BUSB 9
BUSB 10
BUSB 11
1565PCI
1565PCT
1566PCI
1566PCT
33 N/C
32 N/C
31 TXINHA
30 RXA
29 RXA
28 N/C
27 N/C
26 TXB
25 TXB
24 TXINHB
23 N/C
N/C 12
N/C 13
N/C 14
N/C 15
RXENB 16
GNDB 17
GNDB 18
GNDB 19
RXB 20
RXB 21
N/C 22
The transmitter section of each bus takes complementary
CMOS / TTL Manchester II bi-phase data and converts it to
differential voltages suitable for driving the bus isolation
transformer. Separate transmitter inhibit control signals
are provided for each transmitter.
44 N/C
43 BUSA
42 BUSA
41 BUSA
40 BUSA
39 VDDA
38 VDDA
37 TXA
36 TXA
35 N/C
34 N/C
The HI-1565 and HI-1566 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 /1760 specifications.
44 Pin Plastic 7mm x 7mm
Chip-scale package
VDDA 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1565PSI
1565PST
1565PSM
1566PSI
1566PST
1566PSM
20
19
18
17
16
15
14
13
12
11
TXA
TXA
TXINHA
RXA
RXA
TXB
TXB
TXINHB
RXB
RXB
20 Pin Plastic ESOIC - WB package
chip-scale package with integral heatsink
VDDA 1
20 TXA
! Less than 1.0W maximum power dissipation
! BUS pins ESD protected to greater than 8KV
! Also available in DIP and small outline
BUSA 2
19 TXA
(ESOIC) package options
! Industrial and extended temperature ranges
! Industry standard pin configurations
BUSA 3
RXENA 4
1565CDI
1565CDT
1565CDM
BUSB 7
BUSB 8
17 RXA
16 RXA
GNDA 5
VDDB 6
18 TXINHA
1566CDI
1566CDT
1566CDM
15 TXB
14 TXB
13 TXINHB
RXENB 9
12 RXB
GNDB 10
11 RXB
20 Pin Ceramic DIP package
(DS1565 Rev. F)
HOLT INTEGRATED CIRCUITS
www.holtic.com
07/09
HI-1565, HI-1566
PIN DESCRIPTIONS
PIN
(DIP/ESOIC)
SYMBOL
FUNCTION
DESCRIPTION
1
VDDA
power supply
+5 volt power for bus A
2
BUSA
analog output
MIL-STD-1533 bus driver A, positive signal
3
BUSA
analog output
MIL-STD-1553 bus driver A, negative signal
4
RXENA
digital input
5
GNDA
power supply
Ground for bus A
6
VDDB
power supply
+5 volt power for bus B
Receiver A enable. If low, forces RXA and RXA low (HI-1565) or High (HI-1566)
7
BUSB
analog output
MIL-STD-1533 bus driver B, positive signal
8
BUSB
analog output
MIL-STD-1553 bus driver B, negative signal
9
RXENB
digital input
10
GNDB
power supply
Ground for bus B
11
RXB
digital output
Receiver B output, inverted
12
RXB
digital output
Receiver B output, non-inverted
13
TXINHB
digital input
Transmit inhibit, bus B. If high BUSB, BUSB disabled
14
TXB
digital input
Transmitter B digital data input, non-inverted
15
TXB
digital input
Transmitter B digital data input, inverted
Receiver B enable. If low, forces RXB and RXB low (HI-1565) or High (HI-1566)
16
RXA
digital output
Receiver A output, inverted
17
RXA
digital output
Receiver A output, non-inverted
18
TXINHA
digital input
Transmit inhibit, bus A. If high BUSA, BUSA disabled
19
TXA
digital input
Transmitter A digital data input, non-inverted
20
TXA
digital input
Transmitter A digital data input, inverted
FUNCTIONAL DESCRIPTION
The HI-1565 family of data bus transceivers contain differential voltage source drivers and differential receivers.
They are intended for applications using a MIL-STD-1553
A/B data bus. The device produces a trapezoidal output
waveform during transmission.
TRANSMITTER
Data input to the device’s transmitter section is from the
complementary CMOS /TTL inputs TXA/B and TXA/B.
The transmitter accepts Manchester II bi-phase data and
converts it to differential voltages on BUSA/B and BUSA/B.
The transceiver outputs are either direct or transformer
coupled to the MIL-STD-1553 data bus. Both coupling
methods produce a nominal voltage on the bus of 7.5 volts
peak to peak.
The transmitter is automatically inhibited and placed in the
high impedance state when both TXA/B and TXA/B are either at a logic “1” or logic “0” simultaneously. A logic “1” applied to the TXINHA/B input will force the transmitter to the
high impedance state, regardless of the state of TXA/B and
TXA/B.
RECEIVER
The receiver accepts bi-phase differential data from the
MIL-STD-1553 bus through the same direct or transformer
coupled interface as the transmitter. The receiver’s differential input stage drives a filter and threshold comparator
that produces CMOS/TTL data at the RXA/B and RXA/B
output pins.
Each set of receiver outputs can be independently forced
to a logic "0" (HI-1565) or logic “1” (HI-1566) by setting
RXENA or RXENB low.
MIL-STD-1553 BUS INTERFACE
A direct coupled interface (see Figure 2) uses a 1:2.5 ratio
isolation transformer and two 55 ohm isolation resistors
between the transformer and the bus.
In a transformer coupled interface (see Figure 3), the
transceiver is connected to a 1:1.79 isolation transformer
which in turn is connected to a 1:1.4 coupling transformer.
The transformer coupled method also requires two
coupling resistors equal to 75% of the bus characteristic
impedence (Zo) between the coupling transformer and the
bus.
HOLT INTEGRATED CIRCUITS
2
HI-1565, HI-1566
Data Bus
Each Bus
TRANSMITTER
Isolation
Transformer
Coupler
Network
BUSA/B
TXA/B
Transmit
Logic
Direct
or
Transformer
Slope
Control
TXA/B
BUSA/B
TXINHA/B
RECEIVER
RXA/B
Input
Filter
Receive
Logic
RXA/B
Comparator
RXENA/B
Figure 1. Block Diagram
TRANSMIT WAVEFORM - EXAMPLE PATTERN
TXA/B
TXA/B
BUSA/B - BUSA/B
RECEIVE WAVEFORMS - EXAMPLE PATTERN
Vin
(Line to Line)
tDR
tDR
tDR
RXA/B
tRG
tRG
RXA/B
HOLT INTEGRATED CIRCUITS
3
tDR
HI-1565, HI-1566
RECOMMENDED OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Supply voltage (VDD)
Logic input voltage range
Supply Voltage
-0.3 V to +7 V
VDD....................................... 5V... ±5%
-0.3 V dc to +5.5 V
Receiver differential voltage
10 Vp-p
Temperature Range
Driver peak output current
+1.0 A
Power dissipation at 25°C
ceramic DIL, derate
1.0 W
7mW/°C
Solder Temperature
Industrial Screening.........-40°C to +85°C
Hi-Temp Screening........-55°C to +125°C
NOTE:
Stresses above absolute maximum
ratings or outside recommended operating
conditions may cause permanent damage to the
device. These are stress ratings only. Operation
at the limits is not recommended.
275°C for 10 sec.
Junction Temperature
175°C
Storage Temperature
-65°C to +150°C
DC ELECTRICAL CHARACTERISTICS
VDD = 5.0V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
4.75
5
5.25
V
Operating Voltage
VDD
Total Supply Current
ICC1
Not Transmitting
14
22
mA
ICC2
Transmit one bus @
50% duty cycle
200
340
mA
ICC3
Transmit one bus @
100% duty cycle
400
550
mA
0.11
W
0.95
W
Power Dissipation
PD1
Not Transmitting
PD2
Transmit one bus @
100% duty cycle
0.70
Min. Input Voltage
(HI)
VIH
Digital inputs
Max. Input Voltage
(LO)
VIL
Digital inputs
Min. Input Current
(HI)
IIH
VIH = 4.9V, Digital inputs
Max. Input Current
(LO)
IIL
VIL = 0.1V, Digital inputs
-20
µA
Min. Output Voltage
(HI)
VOH
IOUT = -0.4mA, Digital outputs
2.7
V
(LO)
VIH
IOUT = 4.0mA, Digital outputs
Max. Output Voltage
RECEIVER
2.0
1.4
1.4
V
0.8
V
20
µA
0.4
V
(Measured at Point “AD“ in Figure 2 unless otherwise specified)
Input resistance
RIN
Differential
Input capacitance
CIN
Differential
Common mode rejection ratio
CMRR
Input Level
VIN
Input common mode voltage
Threshold Voltage - Direct-coupled
Detect
VTHD
VTHND
Threshold Voltage - Transformer-coupled Detect
VTHD
No Detect
VTHND
Kohm
5
40
Differential
pF
dB
9
Vp-p
-5.0
5.0
V-pk
1 Mhz Sine Wave
(Measured at Point “AD“ in Figure 2)
1.15
20.0
Vp-p
0.28
Vp-p
1 MHz Sine Wave
(Measured at Point “AT“ in Figure 3)
0.86
14.0
Vp-p
0.20
Vp-p
VICM
No Detect
20
HOLT INTEGRATED CIRCUITS
4
HI-1565, HI-1566
DC ELECTRICAL CHARACTERISTICS (cont.)
VDD = 5.0V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
TRANSMITTER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
7.0
9.0
Vp-p
20.0
27.0
Vp-p
10.0
mVp-p
-90
90
mV
-250
250
mV
(Measured at Point “AD” in Figure 2 unless otherwise specified)
Output Voltage
Direct coupled
VOUT
Transformer coupled
VOUT
Output Noise
35 ohm load
(Measured at Point “AD“ in Figure 2)
70 ohm load
(Measured at Point “AT“ in Figure 3)
VON
Output Dynamic Offset Voltage
Direct coupled
VDYN
Transformer coupled
VDYN
Differential, inhibited
35 ohm load
(Measured at Point “AD“ in Figure 2)
70 ohm load
(Measured at Point “AT“ in Figure 3)
Output resistance
ROUT
Differential, not transmitting
Output Capacitance
COUT
1 MHz sine wave
10
Kohm
15
pF
AC ELECTRICAL CHARACTERISTICS
VDD = 5.0V, GND = 0V, TA =Operating Temperature Range (unless otherwise specified).
PARAMETER
RECEIVER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
450
ns
365
ns
40
ns
(Measured at Point “AD” in Figure 2)
Receiver Delay
tDR
From input zero crossing to RXA/B or RXA/B
Receiver gap time
tRG
Spacing between RXA/B and RXA/B pulses
Receiver Enable Delay
90
From RXENA/B rising or falling edge to
tREN
RXA/B or RXA/B
TRANSMITTER
(Measured at Point “AD” in Figure 2)
Driver Delay
tDT
TXA/B, TXA/B to BUSA/B, BUSA/B
150
ns
Rise time
tr
35 ohm load
100
300
ns
Fall Time
tf
35 ohm load
100
300
ns
tDI-H
Inhibited output
100
ns
tDI-L
Active output
150
ns
Inhibit Delay
TRANSMITTER
1:2.5
55 W
BUSA/B
TXA/B
35 W
TXA/B
BUSA/B
TXINHA/B
55 W
Isolation
Transformer
Point “AD“
55 W
RECEIVER
2.5:1
RXA/B
Point “AD“
35 W
55 W
RXA/B
Isolation
Transformer
RXENA/B
Figure 2. Direct Coupled Test Circuits
HOLT INTEGRATED CIRCUITS
5
HI-1565, HI-1566
TRANSMITTER
Point
“AT”
1:1.79
52.5 W
(.75 Zo)
1:1.4
BUSA/B
TXA/B
35 W (.5 Zo)
TXA/B
BUSA/B
TXINHA/B
52.5 W
(.75 Zo)
Isolation
Transformer
1.4:1
52.5 W
(.75 Zo)
Coupling
Transformer
Point
“AT” 1.79:1
RECEIVER
RXA/B
35 W (.5 Zo)
52.5 W
(.75 Zo)
RXA/B
Coupling
Transformer
Isolation
Transformer
RXENA/B
Figure 3. Transformer Coupled Test Circuits
HEAT SINK - ESOIC & CHIP-SCALE PACKAGE
Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a
20-pin thermally enhanced SOIC package. The
HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale
package. These packages include a metal heat sink
located on the bottom surface of the device. This heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation. The heat sink is
electrically isolated and may be soldered to any
convenient power or ground plane..
THERMAL CHARACTERISTICS
PART NUMBER
PACKAGE STYLE
HI-1565PSI / T / M
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
HI-1566PSI / T / M
HI-1565CDI / T / M
HI-1566CDI / T / M
HI-1565PCI / T
HI-1566PCI / T
JUNCTION TEMPERATURE
CONDITION
ØJA
Heat sink
unsoldered
54°C/W
62°C
122°C
162°C
Heat sink
soldered
47°C/W
57°C
117°C
157°C
20-pin Ceramic
side-brazed DIP
Socketed
62°C/W
69°C
129°C
169°C
44-pin Plastic chipscale package
Heat sink
unsoldered
49°C/W
59°C
119°C
159°C
TA=25°C
TA=85°C TA=125°C
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
HOLT INTEGRATED CIRCUITS
6
HI-1565, HI-1566
ORDERING INFORMATION
HI - 156x xx x x (Plastic)
PART
NUMBER
Blank
F
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
T
-55°C TO +125°C
T
NO
M
-55°C TO +125°C
M
YES
PART
NUMBER
PACKAGE
DESCRIPTION
PC
44 PIN PLASTIC CHIP-SCALE LPCC (44PCS) not available with ‘M’ flow
PS
20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC w/Heat Sink (20HWE)
PART
NUMBER
RXENA = 0 RXENB = 0
RXA RXA RXB RXB
1565
0
0
0
0
1566
1
1
1
1
HI - 156xCD x (Ceramic)
PART
NUMBER
TEMPERATURE
RANGE
FLOW
BURN
IN
I
-40°C TO +85°C
I
NO
Gold (Pb-free, RoHS compliant)
T
-55°C TO +125°C
T
NO
Gold (Pb-free, RoHS compliant)
M
-55°C TO +125°C
M
YES
PART
NUMBER
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
RXENA = 0 RXENB = 0 PACKAGE
RXA RXA RXB RXB DESCRIPTION
1565CD
0
0
0
0
20 PIN CERAMIC SIDE BRAZED DIP (20C)
1566CD
1
1
1
1
20 PIN CERAMIC SIDE BRAZED DIP (20C)
RECOMMENDED TRANSFORMERS
The HI-1565 and HI-1566 transceivers have been
characterized for compliance with the electrical requirements of MIL-STD-1553 when used with the following
MANUFACTURER
Premier Magnetics
Technotrol
Premier Magnetics
Technotrol
transformers. Holt recommends the Premier Magnetics
parts as offering the best combination of electrical
performance, low cost and small footprint.
PART NUMBER
APPLICATION
TURNS RATIO(S)
DIMENSIONS
PM-DB2725EX
Isolation
Dual tapped 1:1.79, 1:2.5
.500 x .500 x .375 inches
TL1553-45
Isolation
Dual tapped 1:1.79, 1:2.5
.630 x 630 x .155 inches
PM-DB2702
Stub coupling
1:1.4
.625 x .625 x .250 inches
TQ1553-2
Stub coupling
1:1.4
.625 x .625 x .250 inches
HOLT INTEGRATED CIRCUITS
7
HI-1565, HI-1566
REVISION HISTORY
Document
DS1565
Rev. Date
E
09/26/08
F
07/24/09
Description of Change
Clarification of transmitter and receiver functions in Description, clarified available
temperature ranges, and corrected a dimension in Recommended Transformers table.
Corrected typographical errors in package dimensions.
HOLT INTEGRATED CIRCUITS
8
PACKAGE DIMENSIONS
20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
Package Type: 20HWE
.0105 ± .0015
(.267 ± .038)
.504 ± .008
(12.79 ± .19)
.407 ± .013
(10.325 ± .32)
inches (millimeters)
.290 typ
(7.37)
Bottom
View
.205 typ
(5.21)
.295 ± .002
(7.493 ± .05)
Top View
See Detail A
.0165 ± .0035
(.419 ± .089)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.090 ± .01
(2.29 ± .25)
.050
BSC
(1.27)
0° to 8°
.0075 ± .004
(.191 ± .089)
.033 ± .017
(.838 ± .432)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Detail A
20-PIN CERAMIC SIDE-BRAZED DIP
inches (millimeters)
Package Type: 20C
1.000 ±.010
(25.400 ±.254)
.310 ±.010
(7.874 ±.254)
.050 TYP.
(1.270 TYP.)
.125 min
(3.175)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.300 ± .010
(7.620 ± .254)
.085 ±.009
(2.159 ± .229)
.200
max
(5.080)
.100
BSC
(2.54)
.017 ±.002
(.432 ±.051)
HOLT INTEGRATED CIRCUITS
9
.010 + 0. 02/-.001
(.254 ±.051/-.025)
PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE
inches (millimeters)
Package Type: 44PCS
.276
BSC
(7.00)
.203 ± .006
(5.15 ± .15)
.020 BSC
(0.50)
.276
BSC
(7.00)
.203 ± .006
(5.15 ± .15)
Top View
Bottom
View
.010
(0.25) typ
.039
max
(1.00)
.008 typ
(0.2)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
10
.016 ± .002
(0.40 ± .05)