HP W2635A

W2635A and W2636A DDR3 BGA Probe
Adapter for Infiniium Oscilloscopes
Data Sheet
Superior probing for DDR3 compliance test and debug
The Agilent Technologies' W2635A
and W2636A DDR3 BGA probe
adapters provide signal access to
the clock, strobe, data, address
and command signals of the DDR3
BGA package for making electrical
and timing measurements with an
Infiniium oscilloscope. The DDR3
JEDEC1 specification (JESD79-3C) is
defined at the DRAM ballout, and the
ballout is difficult to access. The BGA
probe adapter provides direct signal
access to the BGA package for true
compliance testing.
The W2635A and W2636A DDR3
BGA probe adapters are soldered in
between the DRAM and PC board
or DIMM raw card where the DRAM
would normally be soldered. They
are designed with the PCB or DIMM
footprint on the bottom side and
the DRAM footprint on the top side.
The BGA adapter passes the signals
from the memory controller chip and
DRAM directly to the top side of the
BGA probe adapter where they can be
accessed with oscilloscope probes.
Buried resistors placed at the signals
inside the BGA probe adapter
connect the probed signals to solder
pads designed to work with Agilent
InfiniiMax E2677A, N5381A, N5425A,
and N5426A differential solder-in
probe heads. These resistors isolate
the DDR3 signal and the probe
loading effect. This design minimizes
capacitive loading of the probe heads
and allows high-speed operation
without impact on signal integrity.
Probing at the right location is also
an important consideration for DDR3
measurement. Many designs have
vias or designed-in probe points, but
they do not always produce good
signal integrity. Probing at the wrong
location could cause signal reflection,
resulting in non-monotonic edges.
This will cause error in your tests
such as slew rate, setup and hold time
measurements.
When used with Agilent's U7231A
DDR3 compliance test application, the
BGA adapter provides a fast and easy
way to test, debug and characterize
your DDR3 designs. The tests covered
by the U7231A software are based on
the JEDEC (JESD79-3C) DDR3 SDRAM
Specification. The test application
offers a user-friendly setup wizard and
a comprehensive report that includes
margin analysis.
1
The JEDEC (Joint Electronic Device Engineering
Council) Solid State Technology Association is
a semiconductor engineering standardization
body of the Electronic Industries Alliance (EIA), a
trade association that represents all areas of the
electronic industry.
Superior probing for DDR3 compliance test and debug
Features
• Provides signal access points
for DDR3 DRAM x4, x8 and x16
packages using JEDEC-standard
common BGA footprints to the
oscilloscope
• 10-mm and 11-mm BGA probe
adapter widths for different spacing
requirement between the DRAM
placements on the PCB or DIMM
• Buried resistors provide signal
isolation and minimize capacitive
loading
• Probing compatibility with
InfiniiMax probe, which includes
E2677A, N5381A, and N5425A/
N5426A differential solder-in probe
heads
Installing the DDR3 BGA probe
adapter
The W2635A and W2636A DDR3 BGA
probe adapter is installed by soldering
it to the BGA footprint on the PC
board or DIMM card where the DRAM
normally would be soldered. Then you
can solder the DDR3 DRAM to the top
side of the BGA probe adapter. These
attachment steps may occur in any
order.
The probe is designed to tolerate
lead-free soldering temperature
profiles. However, we recommend
you apply the minimum temperature
required for soldering and you use
the minimum number of heating and
cooling cycles to reduce risk of any
damage to the probe. The probe is
supplied without solder balls attached.
Depending on the exact attachment
order, you may prefer to use either
leaded or lead-free solder to attach the
BGA probe adapter.
We recommend you attach the BGA
probe during the manufacturing
process. For designs that are
manufactured, it will require expertise
to attach the BGA probe adapter. If you
lack the in-house expertise to attach
the BGA probe adapter, you may wish
to work with a contract manufacturer
with this expertise that may be willing
to perform the attachment for a fee.
You can find more information on BGA
soldering and rework techniques that
may be useful in attaching the probe at:
http://www.circuitrework.com/
guides/9-0.shtm
http://www.agilent.com/find/
ddr3bga-scope
Figure 1. The diagram above shows the top (left) and
bottom (right) view of the W2636A DDR3 BGA probe
adapter. The top side shows the footprint for DDR3 DRAM
and the bottom side shows the footprint for a PC board or
DIMM card.
2
Superior probing for DDR3 compliance test and debug
Installing the InfiniiMax probe
You can use the DDR3 BGA probe adapter with various InfiniiMax solder-in
probes. Instructions that come with the InfiniiMax probe provide details on the
proper soldering procedures for the InfiniiMax probe heads.
Figure 2. The picture above shows the InfiniiMax N5425A and N5426A ZIF probe head
connected to the W2636A DDR3 BGA probe adapter.
3
DDR3 BGA probe adapters dimensions, pad numbering and location
W2635A-010 dimensions, pad numbering and location
Size
Height = 13.97 mm (0.550 in)
Width = 11.176 mm (0.440 in)
Thickness = 1.575 mm (0.062 in)
Brings 20 signals to SMT pads for probing
Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter)
75-ohm buried tip resistor
Pin #
Signal
Signal
Pin #
1
GND
GND
17
2
LDQS
DQ1
18
3
LDQS#
DQ3
19
4
GND
GND
20
5
RAS
DQ7
21
6
CAS
DQ5
22
7
GND
GND
23
8
ODT
CK
24
9
CS0
CK#
25
Table 1. W2635A-010 pad numbering
4
10
GND
GND
26
11
CS1
CKE
27
12
WE
A10
28
13
GND
GND
29
14
BA0
BA1
30
15
BA2
A12
31
16
GND
GND
32
DDR3 BGA probe adapters dimensions, pad numbering and location
W2635A-011 dimensions, pad numbering and location
Size
Height = 13.97 mm (0.550 in)
Width = 12.192 mm (0.480 in)
Thickness = 1.575 mm (0.062 in)
Brings 20 signals to SMT pads for probing
Provides 12 GND pads (6 on either side of DDR3 BGA probe adapter)
75-ohm buried tip resistor
Pin #
Signal
Signal
Pin #
1
GND
GND
17
2
LDQS
DQ1
18
3
LDQS#
DQ3
19
4
GND
GND
20
5
RAS
DQ7
21
6
CAS
DQ5
22
7
GND
GND
23
8
ODT
CK
24
9
CS0
CK#
25
10
GND
GND
26
11
CS1
CKE
27
12
WE
A10
28
13
GND
GND
29
14
BA0
BA1
30
15
BA2
A12
31
16
GND
GND
32
Table 2. W2635A-011 pad numbering
5
DDR3 BGA probe adapters dimensions, pad numbering and location
W2636A-010 dimensions, pad numbering and location
Size
Height = 19.05 mm (0.750 in)
Width = 11.176 mm (0.440 in)
Thickness = 1.575 mm (0.062 in)
Brings 26 signals to SMT pads for probing
Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter)
75-ohm buried tip resistor
6
Pin #
Signal
Signal
Pin #
1
GND
GND
21
2
DQ13
DQ12
22
3
DQ19
DQ14
23
4
GND
GND
24
5
DQ0
UDQS#
25
6
LDQS
UDQS
26
7
GND
GND
27
8
LDQS#
DQ3
28
9
RAS
DQ5
29
10
GND
GND
30
11
CAS
CK
31
12
ODT
CK#
32
13
GND
GND
33
14
CS0
CKE
34
15
CS1
A10
35
16
GND
GND
36
17
WE
BA1
37
18
BA0
A12
38
19
GND
GND
39
20
BA2
A11
40
Table 3. W2636A-010 pad numbering
DDR3 BGA probe adapters dimensions, pad numbering and location
W2636A-011 dimensions, pad numbering and location
Size
Height = 19.05 mm (0.750 in)
Width = 12.192 mm (0.480 in)
Thickness = 1.575 mm (0.062 in)
Brings 26 signals to SMT pads for probing
Provides 14 GND pads (7 on either side of DDR3 BGA probe adapter)
75-ohm buried tip resistor
Pin #
Signal
Signal
Pin #
1
GND
GND
21
2
DQ13
DQ12
22
3
DQ9
DQ14
23
4
GND
GND
24
5
DQ0
UDQS#
25
6
LDQS
UDQS
26
7
GND
GND
27
8
LDQS#
DQ3
28
9
RAS
DQ5
29
10
GND
GND
30
11
CAS
CK
31
12
ODT
CK#
32
13
GND
GND
33
14
CS0
CKE
34
15
CS1
A10
35
16
GND
GND
36
17
WE
BA1
37
18
BA0
A12
38
19
GND
GND
39
20
BA2
A11
40
Table 4. W2636A-011 pad numbering
7
Ordering information
DDR3 BGA probe adapter model numbers and options. Each model comes with a kit of 10 BGA probe adapters.
Model number
Description
W2635A-010
x8, 10 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package
W2635A-011
x8, 11 mm width DDR3 BGA probe adapter for x4 and x8 DRAM package
W2636A-010
x16, 10 mm width DDR3 BGA probe adapter for x16 DRAM package
W2636A-011
x16, 11 mm width DDR3 BGA probe adapter for x16 DRAM package
Infiniium oscilloscope and InfiniiMax oscilloscope probe amplifiers and probe heads that are recommended for use with the
DDR3 BGA probe adapters
Product
Description
9000 Series
9404A
4-GHz 4-channels 10 GSa/s Infiniium scope
90000 Series
90404A
4-GHz, 4 channels Infiniium scope
90604A
6-GHz, 4 channels Infiniium scope
90804A
8-GHz, 4 channels Infiniium scope
91204A
12-GHz, 4 channels Infiniium scope
91304A
13-GHz, 4 channels Infiniium scope
8
Ordering information
Probe accessories
InfiniiMax probe amplifiers
Model number
Description
1169A
12-GHz differential probe amplifier
1168A
10-GHz differential probe amplifier
1134A
7-GHz differential probe amplifier
1132A
5-GHz differential probe amplifier
1131A
3.5-GHz differential probe amplifier
InfiniiMax probe heads
Model number
Description
N5381A
InfiniiMax II 12-GHz differential solder-in probe head and accessories
N5382A
InfiniiMax II 12-GHz differential browser
E2677A
InfiniiMax 12-GHz differential solder-in probe head and accessories
N5425A
InfiniiMax 12-GHz ZIF probe head
N5426A
InfiniiMax ZIF tips (x10) (requires both N5425A and N5426A)
N5451A
InfiniiMax differential long wire ZIF tip (x10) (requires both N5425A and N5451A)
Related literature
Publication title
Publication type
Publication number
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Data sheet
5989-7819EN
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(N5414A and 5415A)
Data sheet
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for Infiniium Series Oscilloscopes
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A Time-Saving Method for Analyzing Signal Integrity in DDR Memory Buses
Application note
5989-6664EN
To download copies of these publications go to www.agilent.com/find/ddr3bga-scope
9
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Revised: October 1, 2008
Product specifications and descriptions
in this document subject to change
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© Agilent Technologies, Inc. 2009
Printed in USA, June 1, 2009
5989-7643EN