iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 1/11 FEATURES APPLICATIONS ° ° ° ° ° ° ° ° ° ° ° 6 current-limited and short-circuit-proof push-pull driver stages in complementary configuration Guaranteed driver current can be set to 30mA or 100mA Outputs compatible to TTL at low load current Integrated free-wheeling diodes Short switching times and high slew rate Schmitt trigger inputs with integrated pull-up current sources and clamping diodes Inputs compatible to TTL and CMOS levels Operating points can be shifted by separate feed of inputs On-chip thermal shutdown with hysteresis Extended temperature range of -25..85EC Line driver for 24V control engineering PACKAGES SO16W TSSOP20 thermal pad BLOCK DIAGRAM 1 3 6 16 VCC VT VB1 A1 15 NA1 14 A2 13 NA2 11 A3 10 E1 CHAN1 2 E2 CHAN2 7 E3 NA3 9 CHAN3 iC-VX THERMAL SHUTDOWN BIAS SO16W © 2001 iC-Haus GmbH Integrated Circuits Am Kuemmerling 18, D-55294 Bodenheim VEE PROG 4 5 VSUB 12 VB2 8 Tel +49-6135-9292-0 Fax +49-6135-9292-192 http://www.ichaus.com iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 2/11 DESCRIPTION The device iC-VX is a monolithic, 3-channel line driver with complementary outputs for 24V applications. The Schmitt trigger inputs contain pull-up current sources and run on separate operating voltages. Their reference potential can be adjusted in the range of the output stage supply voltage to adapt the input threshold voltage for various applications. The guaranteed driver current can be set to 30mA (PROG pin open) or 100mA (PROG pin at VSUB). At low load the drivers are TTL-compatible due to reduced saturation voltages. The output stages are current-limited and, due to the shutdown at overtemperature, they are also protected against thermal destruction. Due to the hysteresis of the overtemperature shutdown, the driver outputs switch on and off as a function of the iC power loss until the overload ceases. For 30mA driver current the short-circuit strength is guaranteed directly by the iC. For 100mA driver current in 24V applications this is guaranteed by 30S series resistors. Free-wheeling diodes at the outputs protect the iC against echoes of mismatched lines. The inputs and outputs of the channels have diodes for protection against destruction by ESD. PACKAGES SO16W, TSSOP20 to JEDEC Standard PIN CONFIGURATION SO16W (top view) PIN FUNCTIONS Name Function E1 E2 VCC VEE PROG PIN CONFIGURATION TSSOP20tp 4.4mm (top view) 1 20 2 19 3 18 n.c. n.c. VB E1 A1 E2 4 17 NA1 VCC 5 16 6 15 7 14 8 13 9 12 10 11 A2 VEE PROG VSUB NA2 VT E3 A3 NA3 VB2 n.c. VT E3 VB2 NA3 A3 NA2 VSUB A2 NA1 A1 VB1 Input Channel 1 Input Channel 2 Inputs Supply Voltage (+5V) Reference Voltage for Inputs (0V) Programming Input for Driver Current (open 30mA, PROG to VSUB 100mA) +4.5..+30V Bias Supply Voltage Input Channel 3 +4.5..+30V Drivers Supply Voltage Inverting Output Channel 3 Output Channel 3 Inverting Output Channel 2 Ground, Substrate Output Channel 2 Inverting Output Channel 1 Output Channel 1 +4.5..+30V Drivers Supply Voltage n.c. Pins VB1 and VB2 must both be connected when the 100mA driver current is set. To enhance heat removal, the TSSOP20 package offers a large area pad to be soldered (a connection is only permitted to VSUB). iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 3/11 ABSOLUTE MAXIMUM RATINGS Values beyond which damage may occur; device operation is not guaranteed. Item Symbol Parameter Conditions Fig. Unit Min. Max. G001 VCC-VEE Supply Voltage for Schmitt Trigger Inputs 0 12 V G002 VB1, VB2 Positive Supply Voltage for Output Drivers 0 32 V G003 VT 0 30 V 0 2 V -300 300 mA -8 8 mA 1 kV Bias Supply Voltage G004 V(PROG) Voltage at PROG G005 I(A,NA) Output Current in A1..3, NA1..3 G006 I(E) Current in E1..3 E001 Vd() ESD Susceptibility, all Inputs and Outputs MIL-STD-883, Method 3015, HBM 100pF discharged through 1.5kS TG1 Tj Junction Temperature -40 155 °C TG2 Ts Storage Temperature -40 150 °C THERMAL DATA Operating Conditions: VB= 4.5..30V, VT= VCC= 5V ±10% Item Symbol Parameter Conditions Fig. Unit Min. T1 Ta Operating Ambient Temperature Range Typ. -25 Max. 85 °C (extended range to -40°C on request) T2 Rthja SO16W Thermal Resistance Junction to Ambient surface mounted with ca. 2cm² heat sink at leads (see Demo Board) 55 75 K/W T3 Rthja TSSOP20 Thermal Resistance Junction to Ambient surface mounted, thermal pad soldered to ca. 2cm² heat sink 30 40 K/W All voltages are referenced to ground unless otherwise noted. All currents into the device pins are positive; all currents out of the device pins are negative. iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 4/11 ELECTRICAL CHARACTERISTICS Operating Conditions: VEE= VSUB= 0V, VB= 4.5..30V, VT= VCC= 5V ±10%, Tj= -25..125°C, unless otherwise noted Item Symbol Parameter Conditions Tj °C Fig. Unit Min. Typ. Max. Total Device 001 VCCVEE Permissible Supply Voltage Range for Inputs 4.5 11 V 002 VCC Permis. Supply Voltage VCC 4.5 VB V 003 VEE Permis. Supply Voltage VEE 0 VB -4.5V V 004 I(VCC) Supply Current in VCC 2.4 mA mA mA 0.5 1.35 0.89 27 125 005 VT Permis. Bias Supply Voltage VT 006 I(VT) Supply Current in VT 4.5 VB V 3 12 mA mA mA 5 mA mA mA 30 V 4.8 mA mA mA 1.2 mA mA mA PROG to VSUB, VB1 and VB2 connected, Vs(A)hi= VB-V(A,NA); I(A,NA)= -10mA I(A,NA)= -30mA I(A,NA)= -100mA 1.0 1.2 2.0 V V V PROG to VSUB, VB1 and VB2 connected; I(A,NA)= 10mA I(A,NA)= 30mA I(A,NA)= 100mA 0.9 1.0 1.5 V V V PROG at VSUB 6.4 5.1 27 125 007 I(VT) Supply Current in VT 1.3 PROG open 2.6 2.2 27 125 008 VB1, VB2 Permis. Drivers Supply Voltage at VB1 and VB2 009 I(VB) Supply Current in VB 010 I(VB) Supply Current in VB 4.5 PROG at VSUB, I(A1..3, NA1..3)= 0 PROG open, I(A1..3, NA1..3)= 0 0.6 2.1 1.5 27 125 0.15 0.42 0.31 27 125 Driver Outputs A1..3, NA1..3 101 Vs()hi 102 Vs()lo Saturation Voltage hi (driver capability 100mA) Saturation Voltage lo (driver capability 100mA) 103 Isc()hi Short-Circuit Current hi (driver capability 100mA) PROG to VSUB, VB1 and VB2 connected, V(A,NA)= 0V -350 -100 mA 104 Isc()lo Short-Circuit Current lo (driver capability 100mA) PROG to VSUB, VB1 and VB2 connected, V(A,NA)= VB 100 350 mA 105 Slew-Rate hi:lo (driver capability 100mA) PROG to VSUB, VB1 and VB2 connected, RL(A,NA)= 750S, CL(A,NA)= 100pF 100 SR() è è V/µs iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 5/11 ELECTRICAL CHARACTERISTICS Operating Conditions: VEE= VSUB= 0V, VB= 4.5..30V, VT= VCC= 5V ±10%, Tj= -25..125°C, unless otherwise noted Item Symbol Parameter Conditions Tj °C Fig. Unit Min. Typ. Max. Driver Outputs A1..3, NA1..3 (continued) 106 Vs()hi Saturation Voltage hi (driver capability 30mA) PROG open, Vs()hi= VB-V(A,NA); I(A,NA)= -3mA I(A,NA)= -10mA I(A,NA)= -30mA 0.9 1.0 1.4 V V V Saturation Voltage lo (driver capability 30mA) PROG open; I(A,NA)= 3mA I(A,NA)= 10mA I(A,NA)= 25mA, VB= 4.5..10V I(A,NA)= 30mA, VB= 10..30V 0.9 1.0 1.2 1.2 V V V V 108 Isc()hi Short-Circuit Current hi (driver capability 30mA) PROG open, V(A,NA)= 0V -100 -30 mA 109 Isc()lo Short-Circuit Current lo (driver capability 30mA) PROG open, V(A,NA)= VB 30 100 mA 110 Slew-Rate hi:lo (driver capability 30mA) PROG open, RL(A/NA)= 750S, CL(A/NA)= 100pF 30 Saturation Voltage lo for TTL-Levels I(A,NA)= 1.6mA 107 Vs()lo SR() è è 111 Vs()lo V/µs 0.4 V 112 I0(A,NA) Tri-state Leakage Current Tj> Toff, V(A,NA)= 0..VB -100 100 µA 113 Vc()hi Clamp Voltage hi Vc(A,NA)hi= V(A)-VB; I(A,NA)= 100mA 0.4 1.7 V 114 Vc()lo Clamp Voltage lo I(A,NA)= -100mA -1.7 -0.4 V 45 % Inputs E1..3 201 Vt(E)hi Threshold Voltage hi referred to VCC-VEE 202 Vt(E)lo Threshold Voltage lo referred to VCC-VEE 35 203 Vt(E)hys Hysteresis 3 204 I(E) Input Current V(E)= VEE..VCC-1V -81 205 Vc(E)hi Clamp Voltage hi Vc(E)hi= V(E)-VCC; I(E)= 4mA 0.4 206 Vc(E)lo Clamp Voltage lo I(E)= -4mA -1.6 207 tp() Propagation Delay E6A, E6NA (driver capability 100mA) 50%V(E) : 50%I(A,NA); PROG to VSUB, RL(A/NA)= 750S Delay Skew A vs. NA (driver capability 100mA) )tp()= tp(E-A) -tp(E-NA) ; PROG to VSUB, RL(A/NA)= 750S Propagation Delay E6A, E6NA (driver capability 30mA) 50%V(E) : 50%I(A,NA); PROG open, RL(A/NA)= 750S Delay Skew A vs. NA (driver capability 30mA) )tp()= tp(E-A) -tp(E-NA) ; PROG open, RL(A/NA)= 750S 208 )tp (A-NA) 209 tp() 210 )tp (A-NA) % è è è è -55 6 % -30 µA 1.6 V -0.4 V 0.4 1 µs 0.15 0.5 µs 0.8 2 µs 0.35 1 µs Thermal Shutdown, Bias 301 Toff Thermal Shutdown Threshold 125 135 155 °C 303 Thys Thermal Shutdown Hysteresis 15 22 30 °C iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 6/11 APPLICATIONS INFORMATION Line drivers for control engineering couple digital signals with TTL or CMOS levels via lines to 24V systems. Due to possible line short circuits, the drivers are current-limited and shut down in the event of overtemperature. The device iC-VX permits the operating points of the Schmitt trigger inputs to be shifted with the supply voltages VCC and VEE, thus within the range of the output stage supply voltage VB. The programming of the driver current to 30mA or 100mA permits optimum matching on the basis of line length and required transmission rate. External series resistors must be provided for higher driver current to ensure short-circuit strength in 24V applications. Furthermore, these series resistors improve the ability of the driver to adapt to the line surge impedance. iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 7/11 EXAMPLE 1: Short lines Short lines of 5m, for example, are approximations of capacitive load for the iC; no adjustment of characteristic impedance is required. With each switching slope changeover losses of Pc= 1/2 VB × I(A) per channel occur in the iC. The load capacity is reloaded with the guaranteed driver current I(A)$ 30mA. These changeover losses determine the possible cut-off frequency, since the high chip power loss without cooling results in shutdown of the iC. At high capacitive load the transmission rate can also be limited by the fall and rise times wich reduce the signal strength. 24V C2 1µF 5V C1 1µF 3 VCC 6 16 VT VB1 PLC L=5m, CL=500pF A1 15 1 E1 A 2k NA1 14 CHAN1 A2 13 2 E2 B 2k NA2 11 CHAN2 A3 10 7 Z E3 2k NA3 9 CHAN3 THERMAL SHUTDOWN BIAS VEE PROG 4 5 iC-VX VSUB VB2 12 8 Fig. 1: Balanced data transmission at low capacitive load, PROG pin open: I(A)$ 30mA As a typical application, Fig. 1 shows the transmission of the output signals of an incremental rotary encoder (track A, track B, index pulse Z) to a programmable control (PLC). The maximum signal frequency which is limited by the power loss can be estimated by standardizing the limiting values of the example for short lines: fmax . 200kHz × 500pF × CL 24V VB 2 × 413K&Ta 70K × 75K/W 2 × channels Rthja (1.1) If the slew-rate is the limiting factor, the following applies for the maximum signal frequency (saturation voltages neglected): fmax . CL VB Ta Rthja 30mA 4×VB×(CL%1nF) = Capacitive load at output A to output NA = Supply voltage = Ambient temperature = Thermal resistance chip/board/ambient (R thja = Rthjb + Rthba) (1.2) iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 8/11 EXAMPLE 2: Long lines Lines which are relatively long, for example 100m, require a higher driver current and an adapter. An appropriate 30S series resistor at the driver output ensures short-circuit strength and a suitable division of the power loss to resistor and iC. The PROG pin at VSUB selects the high driver current of 100mA. In this case the driver supply must be channeled via VB1 and VB2. 24V C2 1µF 5V C1 1µF 3 VCC 6 16 VT VB1 PLC A1 15 30 NA1 14 30 A2 13 30 NA2 11 30 A3 10 30 1 E1 A 2k CHAN1 L=100m, CB=100pF/m 2 E2 B 2k CHAN2 7 Z E3 2k NA3 9 30 CHAN3 THERMAL SHUTDOW N BIAS VEE PROG 4 5 iC-VX VSUB VB2 12 8 Fig. 2: Balanced data transmission at high capacitive load, PROG to VSUB: I(A)$ 100mA The maximum signal frequency which is restricted by the power loss can be estimated by standardizing to the limiting values of the example for long lines: fmax . 20kHz × 100pF/m 100m × × CB L 24V VB 2 × 413K&Ta 70K × 75K/W 2 × channels Rthja (2.1) If the slew rate is the limiting factor, the following applies for the maximum signal frequency (saturation voltages neglected): fmax . CB L CL VB Ta Rthja 100mA 4×VB×(CL%1nF) (2.2) = Line capacitance per meter = Length of the line = Effective capacitance at output A to NA = Supply voltage = Ambient temperature = Thermal resistance chip/board/ambient (R thja = Rthjb + Rthba) The current limitation of the driver stages extends to about 300mA in the 100mA setting. By that, until the activation of the thermal shutdown, the maximum power dissipation for each 30S series resistance and for the iC at 24V can be estimated. Max. power loss in the resistor: PmaxR= I² × R = (300mA)² × 30S = 2.7W Max. power loss in the iC pro channel: PmaxIC= (VB - I(A) × R) × I(A) = 4.5W iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 9/11 The average power loss in the iC and the resistors declines when the thermal shutdown interrupts the driver outputs due to abnormal rising chip temperature. The installed series resistances should suit for the estimated power dissipation to avoid overload due to permanent line short-circuits. If the drivers are operated at low power supply, e.g. VB= 12V instead of VB= 24V, the power loss account for the iC declines and the thermal shutdown is initially delayed or is not activated at all. If VB is under 20V, lower resistors are permitted (>10S) without endangering the short-circuit strength of the iC. Consequently, the iC’s temperature monitoring is reactivated and even 1/3W resistors are not overloaded. EXAMPLE 3: Data transmission in the case of activation with TTL/CMOS signals In the case of activation with TTL/CMOS logic, the device can be operated with the 5V logic supply to VCC and VT. The pins VEE and VSUB must be connected to the logic ground. The 24V supply voltage must be applied to VB1 or VB2 (Fig. 3). Figure 4 shows an alternative application with common positive supplies for logic and driver. Ground, respectively the reference potential VEE for the inputs, is generated by using a negative voltage regulator. This wiring increases the iC power dissipation due to the higher bias supply voltage at VT. Fig. 3: VEE = VSUB Fig. 4: VEE > VSUB In both examples the operating points of the Schmitt trigger inputs E1..3 are compatible with TTL and CMOS levels. Depending on the line length, the driver current may be selected to 30mA with PROG= open or to 100mA with PROG= VSUB. In case of the 100mA driver current the final stages must be supplied via VB1 and VB2. iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 10/11 DEMO BOARD The device iC-VX with SO16W package is equipped with a Demo Board for test purposes. The following figures show the wiring as well as the top and bottom layout of the test PCB. VT Bridge Bridge B03 B01 VCC C01 1µF/40V 3 VCC 6 16 VT C02 1µF/40V A1 15 1 R01 A1 E1 E1 NA1 14 CHAN1 NA1 2 E2 NA2 11 CHAN2 A3 10 E3 NA3 9 CHAN3 VEE PROG 4 5 VSUB 12 30 L2 30 NL2 30 L3 R06 NA3 THERMAL-SHUTDOWN BIAS VEE NL1 R05 A3 E3 30 R04 NA2 7 L1 R03 A2 E2 30 R02 A2 13 PROG VB VB1 30 NL3 iC-VX VB2 8 Bridge B02 GND Fig. 6: Schematic diagram of the Demo Board Fig. 7: Demo Board (components side) Fig. 8: Demo Board (solder dip side) iC-VX 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev C1, Page 11/11 ORDERING INFORMATION Type Package Order designation iC-VX SO16W TSSOP20tp 4.4mm iC-VX SO16W iC-VX TSSOP20 VX Demo Board VX DEMO For information about prices, terms of delivery, options for other case types, etc., please contact: iC-Haus GmbH Am Kuemmerling 18 D-55294 Bodenheim GERMANY Tel +49-6135-9292-0 Fax +49-6135-9292-192 http://www.ichaus.com This specification is for a newly developed product. iC-Haus therefore reserves the right to modify data without further notice. Please contact us to ascertain the current data. The data specified is intended solely for the purpose of product description and is not to be deemed guaranteed in a legal sense. Any claims for damage against us - regardless of the legal basis - are excluded unless we are guilty of premeditation or gross negligence. We do not assume any guarantee that the specified circuits or procedures are free of copyrights of third parties. Copying - even as an excerpt - is only permitted with the approval of the publisher and precise reference to source.