ICS ICS83905AGILF

ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS83905I is a low skew, 1-to-6 LVCMOS /
LVTTL Fanout Buffer and a member of the
HiPerClockS™ HiPerClockS™ family of High Performance Clock
Solutions from ICS. The low impedance
LVCMOS/LVTTL outputs are designed to drive
50W series or parallel terminated transmission lines. The effective fanout can be increased from 6 to 12 by utilizing the
ability of the outputs to drive two series terminated lines.
• 6 LVCMOS / LVTTL outputs
ICS
• Outputs able to drive 12 series terminated lines
• Crystal oscillator interface
• Crystal input frequency range: 10MHz to 40MHz
• Output skew: 80ps (maximum)
• RMS phase jitter @ 25MHz, (100Hz - 1MHz):
0.26ps (typical) (VDD = VDDO = 2.5V)
The ICS83905I is characterized at full 3.3V, 2.5V, and 1.8V,
mixed 3.3V/2.5V, 3.3V/1.8V and 2.5V/1.8V output operating
supply mode. Guaranteed output and part-to-part skew
characteristics along with the 1.8V output capabilities makes
the ICS83905I ideal for high performance, single ended applications that also require a limited output voltage.
Phase noise:
Offset
Noise Power
100Hz .............. -129.7 dBc/Hz
1kHz .............. -144.4 dBc/Hz
10kHz .............. -147.3 dBc/Hz
100kHz .............. -157.3 dBc/Hz
• 5V tolerant enable inputs
• Synchronous output enables
• Operating power supply modes:
Full 3.3V, 2.5V and 1.8V,
mixed 3.3V core/2.5V output operating supply,
mixed 3.3V core/1.8V output operating supply,
mixed 2.5V core/1.8V output operating supply
• -40°C to 85°C ambient operating temperature
• Lead-Free package fully RoHS compliant
BLOCK DIAGRAM
PIN ASSIGNMENT
BCLK0
BCLK1
XTAL_IN
BCLK2
XTAL_OUT
XTAL_OUT
ENABLE 2
GND
BCLK0
VDD o
BCLK1
GND
BCLK2
1
2
3
4
5
6
7
8
XTAL_IN
ENABLE 1
BCLK5
VDDO
BCLK4
GND
BCLK3
VDD
16
15
14
13
12
11
10
9
ICS83905I
BCLK3
16-Lead TSSOP
4.4mm x 5.0mm x 0.92mm body package
G Pacakge
Top View
BCLK4
ENABLE 1
SYNCHRONIZE
BCLK5
ENABLE 2
83905AGI
SYNCHRONIZE
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1
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
XTAL_OUT
Type
Description
Output
Crystal oscillator interface. XTAL_OUT is the output.
2, 15
ENABLE 2, ENABLE 1
Input
Clock enable. LVCMOS / LVTTL interface levels. See Table 3.
3, 7 , 1 1
4, 6, 8,
10, 12, 14
5, 13
GND
BCLK0, BCLK1, BCLK2,
BCLK3, BCLK4, BCLK5
VDDO
Power
Power supply ground.
Output
Clock outputs. LVCMOS / LVTTL interface levels.
Power
Output supply pin.
9
VDD
Power
Core supply pin.
16
XTAL_IN
Input
Crystal oscillator interface. XTAL_IN is the input.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
Test Conditions
CPD
Power Dissipation Capacitance
(per output)
TABLE 3. OUTPUT ENABLE
AND
VDDO = 3.465V
ENABLE 2
Maximum
Units
pF
19
pF
VDDO = 2.625V
18
pF
VDDO = 2V
16
pF
VDDO = 3.3V ± 5%
7
Ω
VDDO = 2.5V ± 5%
7
Ω
VDDO = 1.8V ± 0.2V
10
Ω
CLOCK ENABLE FUNCTION TABLE
Control Inputs
ENABLE 1
Typical
4
Output Impedance
ROUT
Minimum
Outputs
BCLK0:BCLK4
BCLK5
0
0
LOW
LOW
0
1
LOW
Toggling
1
0
Toggling
LOW
1
1
Toggling
Toggling
BCLK5
BCLK0:4
ENABLE2
ENABLE1
FIGURE 1. ENABLE TIMING DIAGRAM
83905AGI
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REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
NOTE: Stresses beyond those listed under Absolute
Inputs, VI
-0.5V to VDD + 0.5 V
Maximum Ratings may cause permanent damage to the
Outputs, VO
-0.5V to VDDO + 0.5V
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions be-
Package Thermal Impedance, θJA
16 Lead TSSOP package
89°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
yond those listed in the DC Characteristics or AC Character-
istics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
3.135
3.3
VDDO
Output Supply Voltage
3.465
V
IDD
Power Supply Current
ENABLE 1:2 = 00
10
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
5
mA
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
2.375
2. 5
2.625
V
2.375
2.5
VDDO
Output Supply Voltage
2.625
V
IDD
Power Supply Current
ENABLE 1:2 = 00
8
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
4
mA
TABLE 4C. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
1.6
1.8
2.0
V
1.6
1.8
VDDO
Output Supply Voltage
2.0
V
IDD
Power Supply Current
ENABLE 1:2 = 00
5
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
3
mA
TABLE 4D. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
2.375
2.5
VDDO
Output Supply Voltage
2.625
V
IDD
Power Supply Current
ENABLE 1:2 = 00
10
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
4
mA
83905AGI
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3
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 4E. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
1.6
1.8
VDDO
Output Supply Voltage
2.0
V
IDD
Power Supply Current
ENABLE 1:2 = 00
10
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
3
mA
TABLE 4F. POWER SUPPLY DC CHARACTERISTICS, VDD = 2.5V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
2.375
2.5
2.625
V
1.6
1.8
VDDO
Output Supply Voltage
2.0
V
IDD
Power Supply Current
ENABLE 1:2 = 00
8
mA
IDDO
Output Supply Current
ENABLE 1:2 = 00
3
mA
Maximum
Units
VDD + 0.3
V
TABLE 4G. LVCMOS/LVTTL DC CHARACTERISTICS, TA = -40°C TO 85°C
Symbol
VIH
VIL
Parameter
Input High Voltage
Input Low Voltage
VOH
ENABLE 1,
ENABLE 2
ENABLE 1,
ENABLE 2
Output High Voltage
Test Conditions
Minimum
VDD = 3.3V ± 5%
2
Typical
VDD = 2.5V ± 5%
1.7
VDD + 0.3
V
VDD = 1.8V ± 0.2V
0.65*VDD
VDD + 0.3
V
VDD = 3.3V ± 5%
-0.3
0. 8
V
VDD = 2.5V ± 5%
-0.3
0. 7
V
VDD = 1.8V ± 0.2V
-0.3
0.35*VDD
V
VDDO = 3.3V ± 5%; NOTE 1
2.6
V
VDDO = 2.5V ± 5%; IOH = -1mA
2
V
VDDO = 2.5V ± 5%; NOTE 1
1.8
V
VDDO = 1.8V ± 0.2V; NOTE 1
VDDO - 0.3
V
VDDO = 3.3V ± 5%; NOTE 1
VOL
Output Low Voltage
0.5
V
VDDO = 2.5V ± 5%; IOL = 1mA
0.4
V
VDDO = 2.5V ± 5%; NOTE 1
0.45
V
VDDO = 1.8V ± 0.2V; NOTE 1
0.35
V
NOTE 1: Outputs terminated with 50Ω to VDDO/2. See Parameter Measurement section, "Load Test Circuit" diagrams.
TABLE 5. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Maximum
Units
Fundamental
40
MHz
Equivalent Series Resistance (ESR)
Frequency
50
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
83905AGI
10
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4
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 6A. AC CHARACTERISTICS, VDD = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MH z
Using External Clock
Source; NOTE 1
DC
100
MH z
48
52
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 4
tjit(Ø)
RMS Phase Jitter (Random)
tR/tF
Output Rise/Fall Time
tEN
Output Enable Time;
NOTE 3
tDIS
25MHz @ (Integration
Range: 100Hz-1MHz)
20% to 80%
0.13
200
ps
800
ps
ENABLE 1
4
cycles
ENABLE 2
4
cycles
Output Disable Time; ENABLE 1
NOTE 3
ENABLE 2
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
TABLE 6B. AC CHARACTERISTICS, VDD = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MH z
Using External Clock
Source; NOTE 1
DC
100
MH z
47
53
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 5
tjit(Ø)
RMS Phase Jitter (Random); NOTE 3
tR/tF
Output Rise/Fall Time
25MHz @ (Integration
Range: 100Hz-1MHz)
20% to 80%
0.26
200
ps
800
ps
ENABLE 1
4
cycles
tEN
Output Enable Time;
NOTE 4
ENABLE 2
4
cycles
tDIS
Output Disable Time; ENABLE 1
NOTE 4
ENABLE 2
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: Please refer to phase noise plot.
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
83905AGI
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5
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 6C. AC CHARACTERISTICS, VDD = VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MH z
Using External Clock
Source; NOTE 1
DC
100
MH z
47
53
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 4
tjit(Ø)
RMS Phase Jitter (Random)
tR/tF
Output Rise/Fall Time
tEN
Output Enable Time;
NOTE 3
tDIS
25MHz @ (Integration
Range: 100Hz-1MHz)
0.27
20% to 80%
200
ps
900
ps
ENABLE 1
4
cycles
ENABLE 2
4
cycles
Output Disable Time; ENABLE 1
NOTE 3
ENABLE 2
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
TABLE 6D. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MH z
Using External Clock
Source; NOTE 1
DC
100
MH z
48
52
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 4
tjit(Ø)
RMS Phase Jitter (Random)
tR/tF
Output Rise/Fall Time
tEN
Output Enable Time;
NOTE 3
tDIS
25MHz @ (Integration
Range: 100Hz-1MHz)
20% to 80%
0.14
200
ps
800
ps
ENABLE 1
4
cycles
ENABLE 2
4
cycles
Output Disable Time; ENABLE 1
NOTE 3
ENABLE 2
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83905AGI
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6
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 6E. AC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MHz
Using External Clock
Source; NOTE 1
DC
100
MHz
48
52
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 4
tjit(Ø)
RMS Phase Jitter (Random)
tR/tF
Output Rise/Fall Time
tEN
Output Enable Time;
NOTE 3
tDIS
Output Disable Time; ENABLE 1
NOTE 3
ENABLE 2
25MHz @ (Integration
Range: 100Hz-1MHz)
0.18
20% to 80%
200
ps
900
ps
ENABLE 1
4
cycles
ENABLE 2
4
cycles
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
TABLE 6F. AC CHARACTERISTICS, VDD = 2.5V±5%, VDDO = 1.8V±0.2V, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum Typical Maximum Units
Using External Crystal
10
40
MH z
Using External Clock
Source; NOTE 1
DC
100
MH z
47
53
%
80
ps
fMAX
Output Frequency
odc
Output Duty Cycle
tsk(o)
Output Skew; NOTE 2, 4
tjit(Ø)
RMS Phase Jitter (Random)
tR/tF
Output Rise/Fall Time
25MHz @ (Integration
Range: 100Hz-1MHz)
20% to 80%
0.19
200
ps
900
ps
ENABLE 1
4
cycles
tEN
Output Enable Time;
NOTE 3
ENABLE 2
4
cycles
tDIS
Output Disable Time; ENABLE 1
NOTE 3
ENABLE 2
4
cycles
4
cycles
All parameters measured at ƒ ≤ fMAX using a crystal input unless noted otherwise.
Terminated at 50Ω to VDDO/2.
NOTE 1: XTAL_IN can be overdriven relative to a signal a crystal would provide.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.
NOTE 3: These parameters are guaranteed by characterization. Not tested in production.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83905AGI
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7
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TYPICAL PHASE NOISE AT 25MHZ (2.5V CORE/ 2.5V OUTPUT)
0
-10
25MHz
-20
RMS Phase Jitter (Random)
100Hz to 1MHz = 0.26ps (typical)
-30
-40
NOISE POWER dBc
Hz
-50
-60
-70
-80
-90
-100
Raw Phase Noise Data
-110
➤
-120
-130
-140
-150
-160
-170
-180
-190
10
100
1k
10k
100k
1M
OFFSET FREQUENCY (HZ)
TYPICAL PHASE NOISE AT 25MHZ (3.3V CORE/ 3.3V OUTPUT)
0
-10
25MHz
-20
RMS Phase Jitter (Random)
100Hz to 1MHz = 0.13ps (typical)
-30
-40
NOISE POWER dBc
Hz
-50
-60
-70
-80
-90
-100
Raw Phase Noise Data
-110
➤
-120
-130
-140
-150
-160
-170
-180
-190
10
100
1k
10k
100k
1M
OFFSET FREQUENCY (HZ)
83905AGI
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8
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
1.25V±5%
1.65V±5%
SCOPE
VDD,
VDDO
Qx
LVCMOS
LVCMOS
GND
Qx
GND
-1.165V±5%
3.3V
SCOPE
VDD,
VDDO
CORE/3.3V
-1.25V±5%
OUTPUT LOAD AC TEST CIRCUIT
2.5V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
2.05V±5%
0.9V±0.1V
SCOPE
VDD ,
VDDO
1.25V±5%
SCOPE
V DD
VDDO
LVCMOS
Qx
LVCMOS
Qx
GND
GND
-0.9V ± 0.1V
-1.25V±5%
1.8V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
2.4±0.9V
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
1.6V±0.025% 0.9V±0.1V
0.9V±0.1V
SCOPE
VDD
VDDO
LVCMOS
VDDO
Qx
LVCMOS
Qx
GND
GND
-0.9V±0.1V
-0.9V±0.1V
3.3V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
83905AGI
SCOPE
V DD
2.5 CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
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9
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
V
DD
V
DDO
Qx
2
BCLKx
2
t PW
t
V
PERIOD
DDO
Qy
2
tsk(o)
odc =
t PW
x 100%
t PERIOD
OUTPUT SKEW
Clock
Outputs
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
80%
80%
tR
tF
20%
20%
OUTPUT RISE/FALL TIME
83905AGI
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10
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
APPLICATION INFORMATION
CRYSTAL INPUT INTERFACE
outs. Slightly increasing the C1 and C2 values will slightly reduce
the frequency. Slightly decreasing the C1 and C2 values will slightly
increase the frequency. For the oscillator circuit below, R1 can
be used, but is not required. For new designs, it is recommended
that R1 not be used.
Figure 1A shows an example of ICS83905I crystal interface with
a parallel resonant crystal. The frequency accuracy can be fine
tuned by adjusting the C1 and C2 values. For a parallel crystal
with loading capacitance CL = 18pF, we suggest C1 = 15pF and
C2 = 15pF to start with. These values may be slightly fine tuned
further to optimize the frequency accuracy for different board lay-
XTAL_IN
C1
15p
X1
18pF Parallel Cry stal
0
XTAL_OUT
C2
15p
R1 (optional)
FIGURE 1. CRYSTAL OSCILLATOR INTERFACE
83905AGI
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11
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
LAYOUT GUIDELINE
Figure 2 shows an example of ICS83905I application schematic.
In this example, the device is operated at VDD = 3.3V and VDDO =
3.3V. The decoupling capacitors should be located as close as
possible to the power pins. The input is driven by an 18pF load
resonant quartz crystal. The tuning capacitors (C1, C2) are fairly
accurate, but minor adjustments might be required. For the
LVCMOS output drivers, two termination examples are shown
in the schematic. For additional termination, examples are shown
in the LVCMOS Termination Application Note.
VDDO = 3.3V
VDD = 3.3V
R2
31
Zo = 50 Ohm
CL = 18 pf
C2
15pf
C1
15pF
LVCMOS
U1
ENABLE 2
VDDO
1
2
3
4
5
6
7
8
XTAL_OUT
ENABLE 2
GND
BCLK0
VDDO
BCLK1
GND
BCLK2
XTAL_IN
ENABLE 1
BCLK5
VDDO
BCLK4
GND
BCLK3
VDD
16
15
14
13
12
11
10
9
ENABLE 1
VDD
R3
100
Zo = 50 Ohm
R4
100
ICS83905I
LVCMOS
VDD
C3
10uF
VDDO
C4
.1uF
C5
.1uF
Optional Termination
C6
.1uF
Unused outputs can be left floating. There should be
no trace attached to unused outputs. Device
characterized and specification limits set with all
outputs terminated.
FIGURE 2. Schematic of Recommended Layout
83905AGI
http://www.icst.com/products/hiperclocks.html
12
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
RELIABILITY INFORMATION
TABLE 7.
θJAVS. AIR FLOW TABLE FOR 16 LEAD TSSOP
θ JA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
137.1°C/W
89.0°C/W
118.2°C/W
81.8°C/W
106.8°C/W
78.1°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS83905I is: 339
Pin compatible to MPC905
83905AGI
http://www.icst.com/products/hiperclocks.html
13
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX
FOR
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
16 LEAD TSSOP
TABLE 8. PACKAGE DIMENSIONS
SYMBOL
TSSOP
Minimum
N
A
FOR
Millimeters
Maximum
16
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
4.90
5.10
E
E1
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
83905AGI
http://www.icst.com/products/hiperclocks.html
14
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS83905AGI
TBD
16 Lead TSSOP
tube
-40°C to 85°C
ICS83905AGIT
TBD
16 Lead TSSOP
2500 tape & reel
-40°C to 85°C
ICS83905AGILF
83905AIL
16 Lead "Lead-Free" TSSOP
tube
-40°C to 85°C
ICS83905AGILFT
83905AIL
16 Lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
NOTE: Parts that are ordered with an “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
83905AGI
http://www.icst.com/products/hiperclocks.html
15
REV. B MAY 16, 2005
ICS83905I
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
REVISION HISTORY SHEET
Rev
Table
Page
6A - 6F
2
1
5-7
A
B
B
83905AGI
8
11
12
Description of Change
Added Enable Timing Diagram.
Features Section - added RMS Phase Jitter bullet.
AC Characteristics Tables - added RMS Phase Jitter spec.
Corrected ambient operating temperature.
Added Phase Noise Plot.
Added Crystal Input Interface in Application Section.
Added schematic layout.
http://www.icst.com/products/hiperclocks.html
16
Date
3/28/05
4/8/05
5/16/05
REV. B MAY 16, 2005