ICS ICS844002I-01

ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
FEATURES
The ICS844002I-01 is a 2 output LVDS
Synthesizer optimized to generate Ethernet
HiPerClockS™ reference clock frequencies and is a member of the HiPerClocks T M family of high
performance clock solutions from ICS. Using a
25MHz, 18pF parallel resonant crystal, the following
frequencies can be generated based on the 2 frequency
select pins (F_SEL[1:0]): 156.25MHz, 125MHz and
62.5MHz. The ICS844002I-01 uses ICS’ 3 rd generation
low phase noise VCO technology and can achieve <1ps
typical rms phase jitter, easily meeting Ethernet jitter
requirements. The ICS844002I-01 is packaged in a small
20-pin TSSOP package.
• Two LVDS outputs
ICS
• Selectable crystal oscillator interface
or LVCMOS/LVTTL single-ended input
• Supports the following output frequencies: 156.25MHz,
125MHz, 62.5MHz
• VCO range: 560MHz - 680MHz
• RMS phase jitter @ 156.25MHz, using a 25MHz crystal
(1.875MHz - 20MHz): 0.41ps (typical)
• Full 2.5V supply mode
• -40°C to 85°C ambient operating temperature
• Available in both, standard and RoHS/Lead-Free compliant
packages
PIN ASSIGNMENT
FREQUENCY SELECT FUNCTION TABLE
0
0
M Divider
Value
25
0
1
25
5
125
1
0
25
10
62.5
1
1
F_SEL1 F_SEL0
N Divider
Value
4
nc
VDDO
Q0
Output Frequency (MHz)
(25MHz Reference)
nQ0
MR
nPLL_SEL
nc
VDDA
F_SEL0
VDD
156.25
Not Used
Not Used
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VDDO
Q1
nQ1
GND
VDD
nXTAL_SEL
REF_CLK
XTAL_IN
XTAL_OUT
F_SEL1
ICS844002I-01
20-Lead TSSOP
6.5mm x 4.4mm x 0.92mm
package body
G Package
Top View
BLOCK DIAGRAM
2
F_SEL[1:0] Pulldown
nPLL_SEL Pulldown
REF_CLK Pulldown
Q0
1
1
25MHz
XTAL_IN
OSC
XTAL_OUT
nXTAL_SEL
0
Phase
Detector
F_SEL[1:0]
0 0 ÷4
0 1 ÷5
10
11
VCO
625MHz
÷10
not used
0
(w/25MHz
Reference)
nQ0
Q1
nQ1
Pulldown
M = 25 (fixed)
MR
844002AGI-01
Pulldown
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1
REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1, 7
nc
Unused
2, 20
VDDO
Power
3, 4
Q0, nQ0
Ouput
5
MR
Input
6
nPLL_SEL
Input
8
Power
Input
Pulldown Frequency select pins. LVCMOS/LVTTL interface levels.
Power
14
VDDA
F_SEL0,
F_SEL1
VDD
XTAL_OUT,
XTAL_IN
REF_CLK
Differential output pair. LVDS interface levels.
Active HIGH Master Reset. When logic HIGH, the internal dividers are
reset causing the true outputs Qx to go low and the inver ted outputs nQx
Pulldown
to go high. When logic LOW, the internal dividers and the outputs are
enabled. LVCMOS/LVTTL interface levels.
Selects between the PLL and REF_CLK as input to the dividers.
Pulldown When LOW, selects PLL (PLL Enable). When HIGH, deselects the
reference clock (PLL Bypass). LVCMOS/LVTTL interface levels.
Analog supply pin.
15
nXTAL_SEL
Input
Core supply pin.
Parallel resonant cr ystal interface. XTAL_OUT is the output,
XTAL_IN is the input.
Pulldown LVCMOS/LVTTL clock input.
Selects between cr ystal or REF_CLK inputs as the the PLL Reference
Pulldown source. Selects XTAL inputs when LOW. Selects REF_CLK when HIGH.
LVCMOS/LVTTL interface levels.
Power supply ground.
9, 11
10, 16
12, 13
Type
Input
Input
17
GND
Power
18, 19
nQ1, Q1
Output
Description
No connect.
Output supply pins.
Differential output pair. LVDS interface levels.
NOTE: Pulldown refers to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLDOWN
Input Pulldown Resistor
51
kΩ
844002AGI-01
Test Conditions
Minimum
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2
Typical
Maximum
Units
REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5V
Outputs, IO
Continuous Current
Surge Current
10mA
15mA
Package Thermal Impedance, θJA
73.2°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 3A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
2.375
2.5
2.625
V
VDDA
Analog Supply Voltage
2.375
2.5
2.625
V
VDDO
Output Supply Voltage
2.375
2.5
2.625
V
IDD
Power Supply Current
85
mA
IDDA
Analog Supply Current
9
mA
IDDO
Output Supply Current
70
mA
TABLE 3B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
VIH
Parameter
Input High Voltage
VIL
Input Low Voltage
REF_CLK, MR,
Input
F_SEL0, F_SEL1,
High Current
nPLL_SEL, nXTAL_SEL
REF_CLK, MR,
Input
F_SEL0, F_SEL1,
Low Current
nPLL_SEL, nXTAL_SEL
IIH
IIL
Test Conditions
VDD = 2.5V
Minimum Typical
1.7
VDD = 2.5V
-0.3
VDD = VIN = 2.625V
VDD = 2.625V, VIN = 0V
Maximum
VDD + 0.3
Units
V
0.7
V
150
µA
-150
µA
TABLE 3C. LVDS DC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VOD
Differential Output Voltage
Δ VOD
VOD Magnitude Change
VOS
Offset Voltage
Δ VOS
VOS Magnitude Change
844002AGI-01
Test Conditions
Minimum
Typical
240
Maximum
Units
550
mV
40
0.7
1.1
50
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3
mV
1.5
V
mV
REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 4. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical
Maximum
Units
27.2
MHz
Fundamental
Frequency
22.4
25
Equivalent Series Resistance (ESR)
50
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
Maximum
Units
NOTE: Characterized using an 18pF parallel resonant crystal.
TABLE 5. AC CHARACTERISTICS, VDD = VDDA = VDDO = 2.5V±5%, TA = -40°C TO 85°C
Symbol
Parameter
fOUT
Output Frequency
t sk(o)
Output Skew; NOTE 1, 2
t jit(Ø)
RMS Phase Jitter (Random);
NOTE 3
tR / tF
Output Rise/Fall Time
Test Conditions
Minimum
Typical
F_SEL[1:0] = 00
140
170
MHz
F_SEL[1:0] = 01
112
136
MHz
F_SEL[1:0] = 10
56
68
MHz
20
ps
5
156.25MHz, (1.875MHz - 20MHz)
0.41
ps
125MHz, (1.875MHz - 20MHz)
0.44
ps
62.5MHz,(1.875MHz - 20MHz)
0.47
ps
20% to 80%
250
odc
Output Duty Cycle
48
NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions.
Measured at VDDO/2.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 3: Please refer to the Phase Noise Plot.
844002AGI-01
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4
550
ps
52
%
REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TYPICAL PHASE NOISE
AT
156.25MHZ
➤
0
-10
-20
Ethernet Filter
-40
156.25MHz
-50
-60
RMS Phase Jitter (Random)
1.875Mhz to 20MHz = 0.41ps (typical)
-70
-80
-90
-100
Raw Phase Noise Data
-110
➤
NOISE POWER dBc
Hz
-30
-120
-130
-140
➤
-150
-160
-170
Phase Noise Result by adding
Ethernet Filter to raw data
-180
-190
1k
10k
100k
1M
10M
100M
OFFSET FREQUENCY (HZ)
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
VDD,
VDDO VDDA
Qx
Noise Power
2.5V±5%
POWER SUPPLY
Float GND
+
–
Phase Noise Plot
SCOPE
LVDS
Phase Noise Mask
nQx
Offset Frequency
f1
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
2.5V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
RMS PHASE JITTER
nQx
80%
80%
Qx
VSW I N G
Clock
Outputs
nQy
20%
20%
tR
tF
Qy
tsk(o)
OUTPUT SKEW
PROPAGATION DELAY
VDD
nQ0, nQ1
Q0, Q1
out
t PW
odc =
DC Input
PERIOD
t PW
LVDS
➤
t
➤
out
x 100%
t PERIOD
VOS/Δ VOS
➤
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
OFFSET VOLTAGE SETUP
VDD
➤
out
➤
LVDS
100
VOD/Δ VOD
out
➤
DC Input
DIFFERENTIAL OUTPUT VOLTAGE SETUP
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS844002I-01 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VDD, VDDA, and VDDO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 1 illustrates how
a 10Ω resistor along with a 10µF and a .01μF bypass
capacitor should be connected to each VDDA.
2.5V
VDD
.01μF
10Ω
VDDA
.01μF
10μF
FIGURE 1. POWER SUPPLY FILTERING
CRYSTAL INPUT INTERFACE
below were determined using a 25MHz, 18pF parallel resonant crystal and were chosen to minimize the ppm error.
The ICS844002I-01 has been characterized with 18pF parallel resonant crystals. The capacitor values shown in Figure 2
XTAL_OUT
C1
22p
X1
18pF Parallel Crystal
XTAL_IN
C2
22p
Figure 2. CRYSTAL INPUt INTERFACE
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS
CRYSTAL INPUT:
For applications not requiring the use of the crystal oscillator
input, both XTAL_IN and XTAL_OUT can be left floating.
Though not required, but for additional protection, a 1kΩ
resistor can be tied from XTAL_IN to ground.
LVDS
All unused LVDS output pairs can be either left floating or
terminated with 100Ω across. If they are left floating, we
recommend that there is no trace attached.
REF_CLK INPUT:
For applications not requiring the use of the reference clock,
it can be left floating. Though not required, but for additional
protection, a 1kΩ resistor can be tied from the REF_CLK to
ground.
LVCMOS CONTROL PINS:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
2.5V LVDS DRIVER TERMINATION
Figure 3 shows a typical termination for LVDS driver in
characteristic impedance of 100Ω differential (50Ω single)
transmission line environment. For buffer with multiple LDVS
driver, it is recommended to terminate the unused outputs.
2.5V
2.5V
LVDS_Driv er
+
R1
100
-
100 Ohm
Line
ΩDifferential
100Ω
Differential Transmission
Transmission Line
FIGURE 3. TYPICAL LVDS DRIVER TERMINATION
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS844002I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS844002I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VDD = 2.5V + 5% = 2.625V, which gives worst case results.
·
·
Power (core)MAX = VDD_MAX * IDD_MAX = 2.625V * 85mA = 223mW
Power (outputs)MAX = VDDO_MAX * IDDO_MAX = 2.625V * 70mA = 184mW
Total Power_MAX = 223mW + 184mW = 407mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
qJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming
a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.407W * 66.6°C/W = 112°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 6. THERMAL RESISTANCE θ JA FOR 20-PIN TSSOP, FORCED CONVECTION
θJA by Velocity (Meters per Second)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
114.5°C/W
73.2°C/W
98.0°C/W
66.6°C/W
88.0°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
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Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE FOR 20 LEAD TSSOP
θJA by Velocity (Meters per Second)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
114.5°C/W
73.2°C/W
98.0°C/W
66.6°C/W
88.0°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS844002I-01 is: 2914
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX
FOR
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
20 LEAD TSSOP
TABLE 8. PACKAGE DIMENSIONS
Millimeters
SYMBOL
MIN
N
MAX
20
A
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
6.40
E
E1
6.60
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
844002AGI-01
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REV. A JANUARY 5, 2006
ICS844002I-01
Integrated
Circuit
Systems, Inc.
FEMTOCLOCKS™ CRYSTAL-TOLVDS FREQUENCY SYNTHESIZER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS844002AGI-01
ICS44002AI01
20 Lead TSSOP
tube
-40°C to 85°C
ICS844002AGI-01T
ICS44002AI01
20 Lead TSSOP
2500 tape & reel
-40°C to 85°C
ICS844002AGI-01LF
ICS4002AI01L
20 Lead "Lead-Free" TSSOP
tube
-40°C to 85°C
ICS844002AGI-01LFT
ICS4002AI01L
20 Lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
The aforementioned trademarks, HiPerClockS and FEMTOCLOCKS are trademarks of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
844002AGI-01
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REV. A JANUARY 5, 2006