IKSEMICON IN74HC151AD

TECHNICAL DATA
IN74HC151A
8-Input Data Selector/Multiplexer
High-Performance Silicon-Gate CMOS
The IN74HC151A is identical in pinout to the LS/ALS151. The
device inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LS/ALSTTL outputs.
The device selects one of the eight binary Data Inputs, as determined
by the Address Inputs. The Strobe pin must be at a low level for the
selected data to appear at the outputs. If Strobe is high, the Y output is
forced to a low level and the Y output is forced to a high level.
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
ORDERING INFORMATION
IN74HC151AN Plastic
IN74HC151AD SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
FUNCTION TABLE
Inputs
PIN 16 =VCC
PIN 8 = GND
Outputs
A2
A1
A0
Strobe
Y
Y
X
X
X
H
L
H
L
L
L
L
D0
D0
L
L
H
L
D1
D1
L
H
L
L
D2
D2
L
H
H
L
D3
D3
H
L
L
L
D4
D4
H
L
H
L
D5
D5
H
H
L
L
D6
D6
H
H
H
L
D7
D7
D0,D1...D7=the level of the respective D
input
X = don’t care
Rev. 00
IN74HC151A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
-0.5 to +7.0
V
VCC
DC Supply Voltage (Referenced to GND)
VIN
DC Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
-0.5 to VCC +0.5
V
DC Input Current, per Pin
±20
mA
IOUT
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±50
mA
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
-65 to +150
°C
260
°C
VOUT
IIN
Tstg
TL
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
VIN, VOUT
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
Min
Max
Unit
2.0
6.0
V
0
VCC
V
-55
+125
°C
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
Rev. 00
IN74HC151A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
VCC
Symbol
Parameter
Test Conditions
Guaranteed Limit
V
25 °C
to
-55°C
≤85
°C
≤125
°C
Unit
VIH
Minimum HighLevel Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢≤ 20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low Level Input Voltage
VOUT=0.1 V or VCC-0.1 V
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
VOH
Minimum HighLevel Output Voltage
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
4.5
6.0
3.98
5.48
3.84
5.34
3.7
5.2
VIN=VIH or VIL
⎢IOUT⎢ ≤ 20 µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIN=VIH or VIL
⎢IOUT⎢ ≤ 4.0 mA
⎢IOUT⎢ ≤ 5.2 mA
4.5
6.0
0.26
0.26
0.33
0.33
0.4
0.4
VOL
Maximum LowLevel Output Voltage
V
IIN
Maximum Input
Leakage Current
VIN=VCC or GND
6.0
±0.1
±1.0
±1.0
µA
ICC
Maximum Quiescent
Supply Current
(per Package)
VIN=VCC or GND
IOUT=0µA
6.0
8.0
80
160
µA
Rev. 00
IN74HC151A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
Guaranteed Limit
VCC
Symbol
Parameter
V
25 °C
to
-55°C
≤85°C
≤125°C
Unit
tPLH, tPHL
Maximum Propagation Delay, Input D to
Output Y or Y (Figures 1,3 and 6)
2.0
4.5
6.0
185
37
31
230
46
39
280
56
48
ns
tPLH, tPHL
Maximum Propagation Delay , Input A to
Output Y or Y (Figures 2 and 6)
2.0
4.5
6.0
205
41
35
255
51
43
310
62
53
ns
tPLH, tPHL
Maximum Propagation Delay , Strobe to
Output Y or Y (Figures 4,5 and 6)
2.0
4.5
6.0
125
25
21
155
31
26
190
38
32
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 6)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
-
10
10
10
pF
CIN
CPD
Maximum Input Capacitance
Power Dissipation Capacitance (Per Package)
Typical @25°C,VCC=5.0 V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
36
Figure 1. Switching Waveforms
Figure 2. Switching Waveforms
Figure 3. Switching Waveforms
Figure 4. Switching Waveforms
pF
Rev. 00
IN74HC151A
Figure 5. Switching waveforms
Figure 6.Test Circuit
EXPANDED LOGIC DIAGRAM
Rev. 00
IN74HC151A
N SUFFIX PLASTIC DIP
(MS - 001BB)
A
Dimension, mm
9
16
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
B
1
8
5.33
C
F
L
C
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
-T- SEATING
PLANE
N
G
K
M
H
D
J
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AC)
Dimension, mm
A
16
9
H
B
1
G
P
8
R x 45
C
-TK
D
SEATING
PLANE
J
0.25 (0.010) M T C M
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
F
M
Symbol
MIN
MAX
A
9.8
10
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.72
J
0°
8°
K
0.1
0.25
M
0.19
0.25
P
5.8
6.2
R
0.25
0.5
Rev. 00