IXYS IXFL80N50Q2

IXFL80N50Q2
HiPerFETTM
Power MOSFET
Q2-Class
(Electrically Isolated Tab)
VDSS =
ID25 =
RDS(on) ≤
≤
trr
N-Channel Enhancement Mode
Avalanche Rated, Low Qg, Low Intrinsic RG
High dV/dt, Low trr
ISOPLUS264TM( IXFL)
Symbol
Test Conditions
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
500
500
V
V
VGSS
VGSM
Continuous
Transient
± 30
± 40
V
V
ID25
IDM
TC = 25°C
TC = 25°C, pulse width limited by TJM
55
320
A
A
IA
EAS
TC = 25°C
TC = 25°C
80
5
A
J
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
20
V/ns
PD
TC = 25°C
380
W
TJ
-55 ... +150
°C
TJM
Tstg
150
-55 ... +150
°C
°C
300
260
°C
°C
30..120/6.7..27
N/lbs
2500
3000
V~
V~
10
g
Maximum Ratings
TL
TSOLD
1.6 mm (0.063 in.) from case for 10s
Plastic body for 10s
FC
Mounting force
VISOL
50/60 Hz, RMS
IISOL ≤ 1 mA
t = 1 min
t=1s
Weight
Symbol
500V
55A
Ω
66mΩ
250ns
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min.
Typ. Max.
BVDSS
VGS = 0 V, ID = 1mA
500
VGS(th)
VDS = VGS, ID = 8mA
3.0
IGSS
VGS = ±30 V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
RDS(on)
VGS = 10V, ID = 40A, Note 1
TJ = 125°C
© 2008 IXYS CORPORATION, All rights reserved
V
5.5
V
± 200
nA
100 μA
5 mA
G
D
S
G = Gate
S = Source
Isolated Tab
D = Drain
Features
Electrically isolated mounting tab
Double metal process for low gate
resistance
Unclamped Inductive Switching
(UIS) rated
Low package inductance
- easy to drive and to protect
Fast intrinsic diode
Applications
DC-DC converters
Switched-mode and resonant-mode
power supplies
DC choppers
Pulse generation
Laser drivers
Advantages
2500 V~ Electrical isolation
ISOPLUS 264TM package for clip or
spring mounting
Space savings
High power density
66 mΩ
DS99360B(05/08)
IXFL80N50Q2
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 10V, ID = 40A, Note 1
50
65
S
12.8
nF
1640
pF
440
pF
29
ns
25
ns
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 40A
RG = 1Ω (External)
Qg(on)
Qgs
ISOPLUS264TM (IXFL) Outline
VGS = 10V, VDS = 0.5 • VDSS, ID = 40A
Qgd
60
ns
11
ns
250
nC
80
nC
120
nC
Note: Bottom heatsink meets
0.33 °C/W
RthJC
RthCS
°C/W
0.15
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
IS
VGS = 0V
ISM
Characteristic Values
Min.
Typ.
Max.
80
A
Repetitive, pulse width limited by TJM
320
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IF = 25A, VGS = 0V
-di/dt = 100 A/μs
VR = 100 V
250
ns
QRM
IRM
Ref: IXYS CO 0128
1.4
12
μC
A
Note: 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2 %.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFL80N50Q2
Fig. 1. Output Characteristics
@ 25ºC
Fig. 2. Extended Output Characteristics
@ 25ºC
80
200
VGS = 10V
70
VGS = 10V
180
8V
8V
160
140
7V
I D - Amperes
I D - Amperes
60
50
40
6V
30
120
100
7V
80
60
20
6V
40
10
20
5V
5V
0
0
0
1
2
3
VD
S
4
5
0
6
2
4
6
8
VD
- Volts
Fig. 3. Output Characteristics
@ 125ºC
10
S
12
14
16
18
20
- Volts
Fig. 4. RDS(on) Normalized to I D = 40A Value
vs. Junction Temperature
80
3.2
VGS = 10V
70
7V
R D S ( o n ) - Normalized
I D - Amperes
60
50
6V
40
30
20
10
VGS = 10V
2.8
2.4
2.0
ID = 80A
ID = 40A
1.6
1.2
0.8
5V
0
0.4
0
2
4
6
VD
S
8
10
12
-50
0
25
50
75
100
125
150
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to I D = 40A Value
vs. Drain Current
Fig. 6. Drain Curre nt v s. Case
Te mpe rature
3.0
60
VGS = 10V
2.6
TJ = 125ºC
2.2
50
I D - Amperes
R D S ( o n ) - Normalized
-25
- Volts
1.8
1.4
40
30
20
TJ = 25ºC
1.0
10
0.6
0
0
20
40
60
80
I
D
100 120 140 160 180 200
- Amperes
© 2008 IXYS CORPORATION, All rights reserved
-50
-25
0
25
50
75
100
T C - Degrees Centigrade
125
150
IXFL80N50Q2
Fig. 7. Input Admittance
Fig. 8. Transconductance
140
120
120
100
TJ = - 40ºC
g f s - Siemens
I D - Amperes
100
TJ = 125ºC
25ºC
- 40ºC
80
60
80
25ºC
60
125ºC
40
40
20
20
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
0
20
40
60
V G S - Volts
Fig. 9. Source Current vs. Source-To-Drain
Voltage
D
100
120 140
160
180
- Amperes
Fig. 10. Gate Charge
10
240
VDS = 250V
9
200
ID = 40A
8
TJ = 25ºC
160
IG = 10m A
7
TJ = 125ºC
VG S - Volts
I S - Amperes
80
I
120
80
6
5
4
3
2
40
1
0
0
0.4
0.6
0.8
1.0
1.2
1.4
0
1.6
40
80
Q
V S D - Volts
120
G
160
200
240
280
- nanoCoulombs
Fig. 12. Maximum Transient Thermal
Impedance
Fig. 11. Capacitance
100000
1
Ciss
10000
Z(th) J C - (ºC/W)
Capacitance - pF
f = 1MHz
Coss
1000
0.1
0.01
Crss
100
0
5
10
15
VD
20
S
25
30
35
40
- Volts
0.001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS REF: F_80N50Q2(95) 5-2-08-G