IXYS IXGX120N120B3

Advance Technical Information
IXGK120N120B3
IXGX120N120B3
GenX3TM 1200V IGBTs
VCES = 1200V
IC90
= 120A
VCE(sat) ≤ 3.0V
High Speed Low Vsat PT IGBTs
for 3-20 kHz Switching
TO-264 (IXGK)
Symbol
Test Conditions
Maximum Ratings
VCES
TJ = 25°C to 150°C
1200
V
VCGR
TJ = 25°C to 150°C, RGE = 1MΩ
1200
V
VGES
Continuous
±20
V
VGEM
Transient
±30
V
IC25
IC90
ILRMS
ICM
TC = 25°C ( Chip Capability )
TC = 90°C
Terminal Current Limit
TC = 25°C, 1ms
200
120
120
370
A
A
A
A
SSOA
(RBSOA)
VGE = 15V, TVJ = 125°C, RG = 2Ω
Clamped Inductive Load
ICM = 240
VCES < 1200
A
V
PC
TC = 25°C
830
W
-55 ... +150
°C
TJ
TJM
150
°C
Tstg
-55 ... +150
°C
300
260
°C
°C
1.13/10
20..120/4.5..27
Nm/lb.in.
N/lb.
10
6
g
g
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062 in.) from Case for 10
Md
FC
Mounting Torque ( IXGK )
Mounting Force ( IXGX )
Weight
TO-264
PLUS247
G
G
BVCES
IC
= 250μA, VCE = 0V
VGE(th)
IC
= 1mA, VCE = VGE
ICES
VCE = VCES, VGE = 0V
IGES
VCE = 0V, VGE = ±20V
VCE(sat)
IC
1200
5.0
TJ = 125°C
= 100A, VGE = 15V, Note 1
2.4
z
z
z
(TAB)
E
= Emitter
TAB = Collector
Optimized for Low Conduction and
Switching Losses
Square RBSOA
International Standard Packages
Advantages
V
z
z
z
±400 nA
z
V
z
z
z
z
© 2009 IXYS CORPORATION, All Rights Reserved
E
Features
50 μA
5 mA
3.0
(TAB)
High Power Density
Low Gate Drive Requirement
Applications
V
3.0
C
G = Gate
C = Collector
z
Characteristic Values
Min.
Typ.
Max.
E
E
PLUS 247TM (IXGX)
z
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
C
Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
DS100152(05/09)
IXGK120N120B3
IXGX120N120B3
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
IC = 60A, VCE = 10V, Note 1
40
Cies
Coes
TO-264 (IXGK) Outline
70
S
9700
pF
670
pF
VCE = 25V, VGE = 0V, f = 1 MHz
Cres
255
pF
Qg(on)
470
nC
Qge
IC = IC90, VGE = 15V, VCE = 0.5 • VCES
Qgc
td(on)
tri
67
nC
190
nC
36
ns
Inductive load, TJ = 25°C
88
ns
5.5
mJ
VCE = 600V, RG = 2Ω
275
ns
Note 2
145
ns
Eoff
5.8
mJ
td(on)
34
ns
Eon
IC
td(off)
tfi
= 100A, VGE = 15V
Inductive load, TJ = 125°C
88
ns
Eon
IC = 100A, VGE = 15V
6.1
mJ
td(off)
VCE = 600V, RG = 2Ω
315
ns
Note 2
570
ns
10.3
mJ
tri
tfi
Eoff
0.15 °C/W
RthJC
RthCK
0.15
°C/W
PLUS 247TM (IXGX) Outline
Note
1. Pulse Test, t ≤ 300μs, Duty Cycle, d ≤ 2%.
2. Switching Times may Increase for VCE (Clamp) > 0.8 VCES,
Higher TJ or Increased RG.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
ADVANCE TECHNICAL INFORMATION
Dim.
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
A
A1
A2
b
b1
b2
C
D
E
e
L
L1
Q
R
Millimeter
Min. Max.
4.83
5.21
2.29
2.54
1.91
2.16
1.14
1.40
1.91
2.13
2.92
3.12
0.61
0.80
20.80 21.34
15.75 16.13
5.45 BSC
19.81 20.32
3.81
4.32
5.59
6.20
4.32
4.83
Inches
Min. Max.
.190 .205
.090 .100
.075 .085
.045 .055
.075 .084
.115 .123
.024 .031
.819 .840
.620 .635
.215 BSC
.780 .800
.150 .170
.220 0.244
.170 .190
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2