LIGITEK LA294B-1-5H-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA294B-1/5H-PF
DATA SHEET
DOC. NO :
QW0905- LA294B-1/5H-PF
REV.
:
A
DATE
:
26 - Feb. - 2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LA294B-1/5H-PF
Package Dimensions
17.3
2.4±0.5
4.5
ψ3.15x5
1st
H
2nd H
5.0
3rd H
25.6
4th H
5th H
2.5
0.5
TYP
3.5±0.5
2.54TYP
+ -
5±0.5
7.54±0.5
10.08±0.5
12.62±0.5
15.16±0.5
1st and 2nd are LH2340/S45/H-PF
3rd and 4fd and 5th are LH2340-1/F181/H-PF
LH2340-1/F181/H-PF
LH2340/S45/H-PF
3.0
3.0
5.0
5.0
1.5MAX
1.5MAX
0.7MAX
28.5MIN
□0.5
TYP
45.0MIN
□0.5
TYP
1.0MIN
1.0MIN
2.54TYP
+
-
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA294B-1/5H-PF
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
H
Forward Current
IF
20
mA
Peak Forward Current
Duty 1/[email protected]
IFP
60
mA
Power Dissipation
PD
50
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @20mA(V)
λPnm
Luminous
intensity
@10mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Emitted
Lens
GaP
Red
Red Diffused
697
90
1.7
2.6
1.2
4.5
80
GaP
Red
Red Diffused
697
90
1.7
2.6
1.2
4.5
80
LA294B-1/5H-PF
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA294B-1/5H-PF
Page 3/5
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
1.2
1.1
1.0
0.9
0.8
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
600
700
800
900
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative [email protected]
Fig.4 Relative Intensity vs. Temperature
Relative [email protected]
Normalize @25℃
Forward [email protected]
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
-20
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
1000
80
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA294B-1/5H-PF
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 120seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
100
200
120 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
250
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA294B-1/5H-PF
Page 5/5
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11