LIGITEK LHRF42741-PF

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT TOWER TYPE LED LAMPS
Pb
Lead-Free Parts
LHRF42741-PF
DATA SHEET
DOC. NO :
QW0905-LHRF42741-PF
REV.
:
A
DATE
: 24 - Nov. -2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LHRF42741-PF
Package Dimensions
3.86
3.62
2.92
2.35
2.95
1.5MAX
□0.5
TYP
25.0MIN
1.0MIN
2.54TYP
+ Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF42741-PF
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HRF
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/[email protected]
IFP
90
mA
Power Dissipation
PD
75
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LHRF42741-PF AlGaInP
Red
Lens
Red Transparent
Dominant Spectral Forward
Luminous
intensity
voltage
wave halfwidth
length △λ nm @20mA(V) @20mA(mcd)
λDnm
Min. Max. Min. Typ.
630
20
1.5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.4
700 1100
Viewing
angle
2θ1/2
(deg)
44
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF42741-PF
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HRF
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/[email protected]
IFP
90
mA
Power Dissipation
PD
75
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Reverse Current @5V
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
LHRF42741-PF AlGaInP
Red
Lens
Red Transparent
Dominant Spectral Forward
Luminous
intensity
voltage
wave halfwidth
length △λ nm @20mA(V) @20mA(mcd)
λDnm
Min. Max. Min. Typ.
630
20
1.5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.4
700 1100
Viewing
angle
2θ1/2
(deg)
44
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO.LHRF42741-PF
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0
0.1
1.0
2.0
1.5
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative [email protected]
Normali[email protected]℃
1.2
Forward [email protected]
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
100
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative [email protected]
100
1.0
0.5
0
550
600
650
Wavelength (nm)
700
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
Ambient Temperature( ℃)
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHRF42741-PF
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO.LHRF42741-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11