TPD4E1B06 www.ti.com SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 Quad Channel High Speed ESD Protection Device Check for Samples: TPD4E1B06 FEATURES APPLICATIONS • • • • • • 1 • • • • • • • Provides System Level ESD Protection for Low-Voltage IO Interfaces IEC 61000-4-2 Level 4 – ±12kV (Contact discharge) – ±15kV (Air-gap discharge) IO Capacitance 1.0pF (Typ) DC Breakdown Voltage 7V (Min) Ultra low Leakage Current 10nA (Max) Low ESD Clamping Voltage Industrial Temperature Range: –40°C to 125°C Small, Easy-to-Route DCK package USB2.0 HDMI control lines MIPI Bus LVDS SATA DCK PACKAGE 2 mm x 2.1 mm x 0.95 mm (0.65 mm pitch) IO1 1 6 NC IO2 2 5 IO4 GND 3 4 IO3 DESCRIPTION The TPD4E1B06 is a quad channel ultra low cap ESD protection device. It offers ±12KV IEC air-gap and ±15KV contact ESD protection. Its 1.0pF line capacitance makes it suitable for a wide range of applications. Typical application areas are HDMI, USB2.0, Ethernet, and 1394 interfaces. ORDERING INFORMATION PACKAGE (1) (2) TA –40°C to 125°C (1) (2) 3000 Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TPD4E1B06DCKR BYI Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated TPD4E1B06 SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. FUNCTIONAL BLOCK DIAGRAM IO1 IO2 IO4 IO3 GND GND Figure 1. Circuit Schematic Diagram TERMINAL FUNCTIONS PIN 2 NAME NUMBER TYPE IO1 1 I/O IO2 2 I/O IO3 4 I/O IO4 5 I/O NC 6 NC GND 3 GND DESCRIPTION USAGE ESD protected channel Connect to data line as close to the connector as possible No connect Can be left floating, grounded, or connected to Vcc Ground Connect to ground Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD4E1B06 TPD4E1B06 www.ti.com SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating temperature range –40 125 °C Storage temperature –65 155 °C IEC 61000-4-2 contact ESD ±12 kV IEC 61000-4-2 air-gap ESD ±15 kV IPP, peak pulse current (tp = 8/20 μs), IO pin to GND 3.5 A PPP, peak pulse power (tp = 8/20 μs) 45 W ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VRWM VCLAMP TEST CONDITION MIN TYP MAX Reverse stand-off voltage Clamp voltage with ESD strike, IO to GND 5.5 UNIT V IPP = 1 A, tp = 8/20 μSec, from I/O to GND or GND to I/O 10.5 V IPP = 3A, tp = 8/20 μSec, from I/O to GND or GND to I/O 14.5 V ITLP = 10A to 20 A, I/O to GND 1 ITLP = 10A to 20 A, GND to I/O 0.8 RDYN Dynamic resistance CL Line capacitance f = 1 MHz, VBIAS = 2.5 V VBR Break-down voltage IIO = 1 mA, from I/O to GND or GND to I/O ILEAK Leakage current VIO = 5.0 V Ω 1 7 1 pF 9.5 V 10 nA Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD4E1B06 3 TPD4E1B06 SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com TYPICAL CHARACTERISTICS CURRENT vs VOLTAGE CURRENT and POWER vs TIME 3.5 1.0 0.8 50 Current Power 3.0 45 40 0.6 2.5 0.2 0.0 ±0.2 25 1.5 20 15 10 ±0.6 0.5 ±0.8 5 0.0 ±1.0 ±10 ±8 ±6 ±4 ±2 0 2 4 6 8 Voltage (V) 0 0 ±5 10 10 15 20 25 30 35 40 45 50 Time ( s) C002 Figure 2. DC Voltage Sweep I-V Curve Figure 3. Surge Curve (tp = 8/20μs), Pin IO to GND CURRENT vs VOLTAGE CURRENT vs TEMPERATURE 10 1.2 8 1.1 1.0 0.9 Current (nA) 4 2 0 ±2 ±4 0.8 0.7 0.6 0.5 0.4 0.3 ±6 0.2 ±8 0.1 0.0 ±10 ±24 ±20 ±16 ±12 ±8 ±4 0 4 8 12 16 20 Voltage (V) ±40 24 ±20 0 20 40 60 80 100 Temperature (ƒC) C003 120 C004 Figure 4. TLP Plot IO to GND Figure 5. Leakage vs Temperature VOLTAGE vs TIME VOLTAGE vs TIME 110 10 0 90 ±10 80 ±20 70 ±30 Voltage (V) 100 60 50 40 ±40 ±50 ±60 30 ±70 20 ±80 10 ±90 0 ±100 ±10 ±110 0 25 50 75 100 125 150 Time ( s) 175 200 0 C005 Figure 6. +8kV IEC Waveform 4 5 C001 6 Current (A) 30 2.0 1.0 ±0.4 Voltage (V) 35 Power (W) Current (A) Current (mA) 0.4 Submit Documentation Feedback 25 50 75 100 125 150 Time ( s) 175 200 C006 Figure 7. –8kV IEC Waveform Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD4E1B06 TPD4E1B06 www.ti.com SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 APPLICATION INFORMATION The TPD4E1B06DCK offers a unique pinout that allows straight through routing with no stubs. Figure 8 shows an example layout. Pins 1 & 2 and pins 4 & 5 are routed differentially. Pin 3 is routed to the ground plane. Pin 6 is not bonded internally in the device and does not need to be routed anywhere on the board. It is also okay if pin 6 is connected to power plane or a capacitor. Figure 8. TPD4E1B06 Layout Example Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD4E1B06 5 TPD4E1B06 SLVSBQ8A – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com REVISION HISTORY Changes from Original (December 2012) to Revision A • 6 Page Fixed "f" units typo from GHz to MHz for CL parameter in ELECTRICAL CHARACTERISTICS table. ............................... 3 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: TPD4E1B06 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) TPD4E1B06DCKR ACTIVE Package Type Package Pins Package Qty Drawing SC70 DCK 6 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-1-260C-UNLIM (4) -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD4E1B06DCKR Package Package Pins Type Drawing SC70 DCK 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 178.0 9.0 Pack Materials-Page 1 2.4 B0 (mm) K0 (mm) P1 (mm) 2.5 1.2 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4E1B06DCKR SC70 DCK 6 3000 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated