TI UC1845AJ883B

PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
CDIP
JG
8
1
TBD
Call TI
Call TI
5962-8670405XA
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
5962-8670406PA
ACTIVE
CDIP
JG
8
1
TBD
Call TI
Call TI
5962-8670406XA
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
5962-8670407PA
ACTIVE
CDIP
JG
8
1
TBD
Call TI
Call TI
5962-8670407XA
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
5962-8670408PA
ACTIVE
CDIP
JG
8
1
TBD
Call TI
Call TI
5962-8670408XA
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
UC1842AJ
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
UC1842AJ883B
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
UC1842AL883B
ACTIVE
LCCC
FK
20
1
TBD
UC1843AJ
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
UC1843AJ883B
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
UC1843AL883B
ACTIVE
LCCC
FK
20
1
TBD
UC1844AJ
ACTIVE
CDIP
JG
8
1
TBD
UC1844AJ883B
ACTIVE
CDIP
JG
8
1
TBD
ACTIVE
LCCC
FK
20
1
TBD
UC1845AJ
ACTIVE
CDIP
JG
8
1
TBD
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
A42
N / A for Pkg Type
UC1845AJ883B
ACTIVE
CDIP
JG
8
1
TBD
UC1845AL883B
ACTIVE
LCCC
FK
20
1
TBD
UC2842AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
Samples
(Requires Login)
5962-8670405PA
UC1844AL883B
(3)
POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UC2842ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2842ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TBD
UC2842AJ
OBSOLETE
CDIP
JG
8
UC2842AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2842ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2843AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2843AJ
OBSOLETE
CDIP
JG
8
TBD
Addendum-Page 2
Call TI
Call TI
Samples
(Requires Login)
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UC2843AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2843ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2843AQ
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2843AQG3
ACTIVE
PLCC
FN
20
46
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
UC2844AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2844ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2844AQD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AQD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AQD8R
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2844AQDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 3
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UC2845AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC2845ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2845ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2845AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2845ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3842AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 4
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UC3842ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3842ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3842ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3842AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3842ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3842J
ACTIVE
CDIP
JG
8
1
TBD
UC3843AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3843AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3843ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3844AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 5
A42
Samples
(Requires Login)
N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
UC3844AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3844AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3844ANG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3845AD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845AD8
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845AD8G4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845AD8TR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845AD8TRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845ADTR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845ADTRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
UC3845AN
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Addendum-Page 6
(3)
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
UC3845ANG4
5-Sep-2011
Status
(1)
ACTIVE
Package Type Package
Drawing
PDIP
Pins
P
8
Package Qty
50
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A, UC3845A :
• Catalog: UC3842A, UC3843A, UC3844A, UC3845A, UC3842, UC3845AM
• Automotive: UC2843A-Q1
• Enhanced Product: UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP, UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP
• Military: UC1842A, UC1843A, UC1844A, UC1845A
Addendum-Page 7
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
• Space: UC1842A-SP, UC1843A-SP, UC1844A-SP, UC1845A-SP, UC1842A-SP, UC1843A-SP, UC1844A-SP, UC1845A-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 8
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
UC2842AD8TR
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
D
8
2500
330.0
12.4
6.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.2
2.1
8.0
12.0
Q1
UC2842ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC2842ADWTR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
UC2843AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC2843ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC2844AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC2844ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC2844AQD8R
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
4.0
12.0
Q1
UC2845AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC2845ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC3842AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC3842ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC3843AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC3843ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC3844AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC3844ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
UC3845AD8TR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
UC3845ADTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC2842AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC2842ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC2842ADWTR
SOIC
DW
16
2000
367.0
367.0
38.0
UC2843AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC2843ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC2844AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC2844ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC2844AQD8R
SOIC
D
8
2500
367.0
367.0
35.0
UC2845AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC2845ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC3842AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC3842ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC3843AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC3843ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC3844AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC3844ADTR
SOIC
D
14
2500
333.2
345.9
28.6
UC3845AD8TR
SOIC
D
8
2500
340.5
338.1
20.6
UC3845ADTR
SOIC
D
14
2500
333.2
345.9
28.6
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
E
18
D2 / E2
E1
D2 / E2
8
14
0.021 (0,53)
0.013 (0,33)
0.007 (0,18) M
0.050 (1,27)
9
13
0.008 (0,20) NOM
D/E
D2 / E2
D1 / E1
NO. OF
PINS
**
MIN
MAX
MIN
MAX
MIN
MAX
20
0.385 (9,78)
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.169 (4,29)
28
0.485 (12,32)
0.495 (12,57)
0.450 (11,43)
0.456 (11,58)
0.191 (4,85)
0.219 (5,56)
44
0.685 (17,40)
0.695 (17,65)
0.650 (16,51)
0.656 (16,66)
0.291 (7,39)
0.319 (8,10)
52
0.785 (19,94)
0.795 (20,19)
0.750 (19,05)
0.756 (19,20)
0.341 (8,66)
0.369 (9,37)
68
0.985 (25,02)
0.995 (25,27)
0.950 (24,13)
0.958 (24,33)
0.441 (11,20)
0.469 (11,91)
84
1.185 (30,10)
1.195 (30,35)
1.150 (29,21)
1.158 (29,41)
0.541 (13,74)
0.569 (14,45)
4040005 / B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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