PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9203101M2A OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 5962-9203101MEA OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 5962-9203102MEA OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 5962-9203103Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629203103Q2A UC1863L/ 883B 5962-9203103QEA ACTIVE CDIP J 16 1 TBD Call TI Call TI -55 to 125 5962-9203103QE A UC1863J/883B UC1861J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1861J883B OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1863J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1863J UC1863J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9203103QE A UC1863J/883B UC1863L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1863L UC1863L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 59629203103Q2A UC1863L/ 883B UC1864J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1864J883B OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1864L OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC1864L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC1865J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1865J883B OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1867J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 UC1867L OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 UC2861DW ACTIVE SOIC DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 40 Addendum-Page 1 UC2861DW Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) UC2861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2861DW UC2861Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2861Q UC2861QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 UC2861Q UC2863DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2863DW UC2863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2863DW UC2863N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2863N UC2863NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2863N UC2864DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2864DW UC2864DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2864DW UC2865N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2865N UC2865NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2865N UC2866N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2866N UC2866NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 UC2866N UC3861DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3861DW UC3861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3861DW UC3861N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3861N UC3861NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3861N UC3862N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3862N Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) UC3862NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3862N UC3863DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3863DW UC3863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3863DW UC3863N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3863N UC3863NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3863N UC3864N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3864N UC3864NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3864N UC3865DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3865DW UC3865DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3865DW UC3865N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3865N UC3865NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3865N UC3865Q ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3865Q UC3865QG3 ACTIVE PLCC FN 20 46 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 70 UC3865Q UC3867DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3867DW UC3867DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3867DW UC3867DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3867DW UC3867DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3867DW UC3867N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3867N Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) Op Temp (°C) Top-Side Markings (3) (4) UC3867NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3867N UC3868N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3868N UC3868NG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3868N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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OTHER QUALIFIED VERSIONS OF UC1861, UC1863, UC1864, UC1865, UC1867, UC3861, UC3863, UC3864, UC3865, UC3867 : Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 • Catalog: UC3861, UC3863, UC3864, UC3865, UC3867 • Military: UC1861, UC1863, UC1864, UC1865, UC1867 • Space: UC1863-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 5 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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