TI JM38510/30501SDA

PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-9557401QCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QC
A
SNJ5432J
5962-9557401QDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QD
A
SNJ5432W
5962-9557401QDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QD
A
SNJ5432W
JM38510/30501B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30501B2A
JM38510/30501B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30501B2A
JM38510/30501BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BCA
JM38510/30501BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BCA
JM38510/30501BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BDA
JM38510/30501BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BDA
JM38510/30501SCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SCA
JM38510/30501SCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SCA
JM38510/30501SDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SDA
JM38510/30501SDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SDA
M38510/30501B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30501B2A
M38510/30501B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
30501B2A
M38510/30501BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BCA
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
M38510/30501BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BCA
M38510/30501BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BDA
M38510/30501BDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501BDA
M38510/30501SCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SCA
M38510/30501SCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SCA
M38510/30501SDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SDA
M38510/30501SDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
30501SDA
SN5432J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN5432J
SN5432J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN5432J
SN54LS32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS32J
SN54LS32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS32J
SN54S32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54S32J
SN54S32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54S32J
SN7432N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7432N
SN7432N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7432N
SN7432N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN7432N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN7432NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7432N
SN7432NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN7432N
SN74LS32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74LS32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBRE4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBRE4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBRG4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DBRG4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS32
SN74LS32J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
0 to 70
SN74LS32J
OBSOLETE
CDIP
J
14
TBD
Call TI
Call TI
0 to 70
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74LS32N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS32N
SN74LS32N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS32N
SN74LS32N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74LS32N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74LS32NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS32N
SN74LS32NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS32N
SN74LS32NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS32
SN74LS32NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS32
SN74LS32NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS32
SN74LS32NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS32
SN74S32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74S32DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S32
SN74S32N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S32N
SN74S32N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S32N
SN74S32N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74S32N3
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
0 to 70
SN74S32NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S32N
SN74S32NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S32N
SNJ5432J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QC
A
SNJ5432J
SNJ5432J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QC
A
SNJ5432J
SNJ5432W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QD
A
SNJ5432W
SNJ5432W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9557401QD
A
SNJ5432W
SNJ54LS32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
32FK
SNJ54LS32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
32FK
SNJ54LS32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS32J
SNJ54LS32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS32J
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SNJ54LS32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS32W
SNJ54LS32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS32W
SNJ54S32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
32FK
SNJ54S32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
32FK
SNJ54S32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S32J
SNJ54S32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S32J
SNJ54S32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S32W
SNJ54S32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S32W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5432, SN54LS32, SN54LS32-SP, SN54S32, SN7432, SN74LS32, SN74S32 :
• Catalog: SN7432, SN74LS32, SN54LS32, SN74S32
• Military: SN5432, SN54LS32, SN54S32
• Space: SN54LS32-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS32DBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74LS32DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74S32DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS32DBR
SSOP
DB
14
2000
367.0
367.0
38.0
SN74LS32DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74S32DR
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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