µA7900 SERIES NEGATIVE-VOLTAGE REGULATORS www.ti.com SLVS058H – JUNE 1976 – REVISED NOVEMBER 2006 FEATURES 3-Terminal Regulators Output Current up to 1.5 A No External Components Internal Thermal-Overload Protection INPUT INPUT High Power-Dissipation Capability Internal Short-Circuit Current Limiting Output Transistor Safe-Area Compensation KTE (PowerFLEX) PACKAGE (TOP VIEW) KCS (TO-220) PACKAGE (TOP VIEW) OUTPUT INPUT COMMON • • • OUTPUT INPUT COMMON KTT (TO-263) PACKAGE (TOP VIEW) INPUT • • • • OUTPUT INPUT COMMON DESCRIPTION/ORDERING INFORMATION This series of fixed-negative-voltage integrated-circuit voltage regulators is designed to complement Series µA7900 in a wide range of applications. These applications include on-card regulation for elimination of noise and distribution problems associated with single-point regulation. Each of these regulators can deliver up to 1.5 A of output current. The internal current limiting and thermal shutdown features of these regulators essentially make them immune to overload. In addition to use as fixed-voltage regulators, these devices can be used with external components to obtain adjustable output voltages and currents and also as the power-pass element in precision regulators. ORDERING INFORMATION (1) TJ –12 V –8 V 0°C to 125°C –5 V (1) (2) ORDERABLE PART NUMBER PACKAGE (2) VO(NOM) TOP-SIDE MARKING TO-220, short shoulder – KCS Tube of 50 UA7912CKCS UA7912C PowerFLEX™ – KTE Reel of 2000 UA7908CKTER UA7908C TO-220, short shoulder – KCS Tube of 50 UA7908CKCS UA7908C PowerFLEX – KTE Reel of 2000 UA7905CKTER UA7905C TO-220, short shoulder – KCS Tube of 50 UA7905CKCS UA7905C TO-263 – KTT Reel of 500 UA7905CKTTR UA7905C For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX, PowerPAD are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1976–2006, Texas Instruments Incorporated µA7900 SERIES NEGATIVE-VOLTAGE REGULATORS www.ti.com SLVS058H – JUNE 1976 – REVISED NOVEMBER 2006 SCHEMATIC 12 V 5 V and 8 V COMMON 5 kΩ OUTPUT 6.2 V 20 kΩ 0.2 kΩ INPUT All component values are nominal. Absolute Maximum Ratings (1) over virtual junction temperature range (unless otherwise noted) MIN MAX UNIT Vl Input voltage –35 V TJ Operating virtual junction temperature 150 °C Tstg Storage temperature range 150 °C (1) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Package Thermal Data (1) (1) (2) PACKAGE BOARD θJA θJC θJP (2) PowerFLEX (KTE) High K, JESD 51-5 23°C/W 3°C/W 2.7°C/W TO-220 (KCS) High K, JESD 51-5 19°C/W 17°C/W 3°C/W TO-263 (KTT) High K, JESD 51-5 25.3°C/W 18°C/W 1.94°C/W Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. Recommended Operating Conditions Vl 2 Input voltage IO Output current TJ Operating virtual junction temperature MIN MAX µA7905 –7 –25 µA7908 –10.5 –25 µA7912 –14.5 –30 1.5 A 0 125 °C Submit Documentation Feedback UNIT V µA7900 SERIES NEGATIVE-VOLTAGE REGULATORS www.ti.com SLVS058H – JUNE 1976 – REVISED NOVEMBER 2006 uA7905 Electrical Characteristics at specified virtual junction temperature, VI = –10 V, IO = 500 mA (unless otherwise noted) TEST CONDITIONS TJ (1) IO = 5 mA to 1 A, VI = –7 V to –20 V, PD ≤ 15 W PARAMETER Output voltage (2) Input regulation Ripple rejection Output regulation µA7905C MIN TYP MAX 25°C –4.8 –5 –5.2 0°C to 125°C –4.75 –5.25 VI = –7 V to –25 V 12.5 50 VI = –8 V to –12 V 4 15 VI = –8 V to –12 V, f = 120 Hz 0°C to 125°C 54 IO = 5 mA to 1.5 A IO = 250 mA to 750 mA 60 UNIT V mV dB 15 100 5 50 mV Temperature coefficient of output voltage IO = 5 mA 0°C to 125°C –0.4 mV/°C Output noise voltage f = 10 Hz to 100 kHz 25°C 125 µV Dropout voltage IO = 1 A 25°C 1.1 25°C 1.5 2 VI = –7 V to –25 V 0.15 0.5 IO = 5 mA to 1 A 0.08 0.5 Bias current Bias current change Peak output current (1) (2) 25°C V 2.1 mA mA A Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output. This specification applies only for dc power dissipation permitted by absolute maximum ratings. uA7908 Electrical Characteristics at specified virtual junction temperature, VI = –14 V, IO = 500 mA (unless otherwise noted) PARAMETER Output voltage (2) Input regulation Ripple rejection Output regulation TJ (1) TEST CONDITIONS IO = 5 mA to 1 A, VI = –10.5 V to –23 V, PD ≤ 15 W µA7908C MIN TYP MAX 25°C –7.7 –8 –8.3 0°C to 125°C –7.6 VI = –10.5 V to –25 V VI = –11 V to –17 V VI = –11.5 V to –21.5 V, f = 120 Hz 0°C to 125°C IO = 5 mA to 1.5 A IO = 250 mA to 750 mA 54 –8.4 12.5 160 4 80 60 UNIT V mV dB 15 160 5 80 mV Temperature coefficient of output voltage IO = 5 mA 0°C to 125°C –0.6 mV/°C Output noise voltage f = 10 Hz to 100 kHz 25°C 200 µV Dropout voltage IO = 1 A 25°C 1.1 25°C 1.5 Bias current Bias current change VI = –10.5 V to –25 V 0.15 1 IO = 5 mA to 1 A 0.08 0.5 Peak output current (1) (2) V 2 25°C 2.1 mA mA A Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output. This specification applies only for dc power dissipation permitted by absolute maximum ratings. Submit Documentation Feedback 3 µA7900 SERIES NEGATIVE-VOLTAGE REGULATORS www.ti.com SLVS058H – JUNE 1976 – REVISED NOVEMBER 2006 uA7912 Electrical Characteristics at specified virtual junction temperature, VI = –19 V, IO = 500 mA (unless otherwise noted) PARAMETER Output voltage (2) Input regulation Ripple rejection Output regulation TJ (1) TEST CONDITIONS IO = 5 mA to 1 A, VI = –14.5 V to –27 V, PD ≤ 15 W TYP MAX 25°C –11.5 –12 –12.5 0°C to 125°C –11.4 –12.6 VI = –14.5 V to –25 V 5 80 VI = –16 V to –22 V 3 30 VI = –15 V to –25 V, f = 120 Hz 0°C to 125°C IO = 5 mA to 1.5 A IO = 250 mA to 750 mA 54 60 UNIT V mV dB 15 200 5 75 mV Temperature coefficient of output voltage IO = 5 mA 0°C to 125°C –0.8 mV/°C Output noise voltage f = 10 Hz to 100 kHz 25°C 300 µV Dropout voltage IO = 1 A 25°C 1.1 25°C 2 3 VI = –14.5 V to –25 V 0.04 0.5 IO = 5 mA to 1 A 0.06 0.5 Bias current Bias current change Peak output current (1) (2) 4 µA7912C MIN 25°C 2.1 V mA mA A Pulse-testing techniques maintain the junction temperature as close to the ambient temperature as possible. Thermal effects must be taken into account separately. All characteristics are measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output. This specification applies only for dc power dissipation permitted by absolute maximum ratings. Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 7-Jun-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins UA7905CKC OBSOLETE TO-220 KC 3 UA7905CKCS ACTIVE TO-220 KCS 3 UA7905CKCSE3 ACTIVE TO-220 KCS 3 UA7905CKTER OBSOLETE PFM KTE 3 UA7905CKTTR ACTIVE DDPAK/ TO-263 KTT UA7905CKTTRG3 ACTIVE DDPAK/ TO-263 UA7908CKC OBSOLETE UA7908CKCS Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TBD Call TI Call TI Replaced by UA7905CKCS 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor or Sales Office 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor or Sales Office TBD Call TI Call TI Samples Not Available 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR Request Free Samples KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR Request Free Samples TO-220 KC 3 TBD Call TI Call TI Samples Not Available ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor or Sales Office UA7908CKCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type Contact TI Distributor or Sales Office UA7908CKTER OBSOLETE PFM KTE 3 TBD Call TI Call TI Samples Not Available UA7912CKC OBSOLETE TO-220 KC 3 TBD Call TI Call TI Replaced by UA7912CKCS UA7912CKCS OBSOLETE TO-220 KCS 3 TBD Call TI Call TI Samples Not Available UA7912CKTER OBSOLETE PFM KTE 3 TBD Call TI Call TI Samples Not Available UA7915CKTER OBSOLETE PFM KTE 3 TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 7-Jun-2010 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device UA7905CKTTR Package Package Pins Type Drawing SPQ DDPAK/ TO-263 500 KTT 3 Reel Reel Diameter Width (mm) W1 (mm) 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.6 15.8 4.9 16.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UA7905CKTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MPFM001E – OCTOBER 1994 – REVISED JANUARY 2001 KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT 0.375 (9,52) 0.080 (2,03) 0.070 (1,78) 0.365 (9,27) 0.360 (9,14) 0.050 (1,27) 0.040 (1,02) 0.350 (8,89) 0.220 (5,59) NOM 0.010 (0,25) NOM Thermal Tab (See Note C) 0.360 (9,14) 0.350 (8,89) 0.295 (7,49) NOM 0.320 (8,13) 0.310 (7,87) 0.420 (10,67) 0.410 (10,41) 1 3 0.025 (0,63) 0.031 (0,79) 0.100 (2,54) Seating Plane 0.004 (0,10) 0.010 (0,25) M 0.005 (0,13) 0.001 (0,03) 0.200 (5,08) 0.041 (1,04) 0.031 (0,79) 0.010 (0,25) NOM Gage Plane 3°– 6° 0.010 (0,25) 4073375/F 12/00 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC MO-169 PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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