MICROSS LS5912C_PDIP

LS5912C
MONOLITHIC DUAL
N-CHANNEL JFET
Linear Systems replaces discontinued Siliconix & National 2N5912C
FEATURES Improved Direct Replacement for SILICONIX & NATIONAL 2N5912C LOW NOISE (10KHz) en~ 4nV/√Hz HIGH TRANSCONDUCTANCE (100MHz) gfs ≥ 4000µS ABSOLUTE MAXIMUM RATINGS 1 @ 25°C (unless otherwise noted) The LS5912C are monolithic dual JFETs. The
monolithic dual chip design reduces parasitics and
gives better performance at very high frequencies while
ensuring extremely tight matching. These devices are
an excellent choice for use as wideband differential
amplifiers in demanding test and measurement
applications. The LS5912C is a direct replacement for
discontinued Siliconix and National LS5912C.
Maximum Temperatures Storage Temperature Operating Junction Temperature Maximum Power Dissipation Continuous Power Dissipation (Total) Maximum Currents Gate Current Maximum Voltages Gate to Drain Gate to Source The 8 Pin P-DIP provides ease of manufacturing, and
the symmetrical pinout prevents improper orientation.
(See Packaging Information).
LS5912C Applications:
ƒ
Wideband Differential Amps
ƒ
High-Speed,Temp-Compensated SingleEnded Input Amps
ƒ
High-Speed Comparators
ƒ
Impedance Converters and vibrations
detectors.
MATCHING CHARACTERISTICS @ 25°C (unless otherwise stated) SYMBOL CHARACTERISTIC |VGS1 – VGS2 | Differential Gate to Source Cutoff Voltage ∆|VGS1 – VGS2 | / ∆T Differential Gate to Source Cutoff Voltage Change with Temperature IDSS1 / IDSS2 Gate to Source Saturation Current Ratio |IG1 – IG2 | Differential Gate Current 500mW 50mA ‐25V ‐25V MIN ‐‐ ‐‐ TYP ‐‐ ‐‐ MAX 40 40 UNITS mV µV/°C CONDITIONS VDG = 10V, ID = 5mA VDG = 10V, ID = 5mA TA = ‐55°C to +125°C VDS = 10V, VGS = 0V 0.95 ‐‐ 1 % ‐‐ ‐‐ 20 nA 0.95 ‐‐ 1 % VDG = 10V, ID = 5mA TA = +125°C VDS = 10V, ID = 5mA, f = 1kHz ‐‐ 85 ‐‐ dB VDG = 5V to 10V, ID = 5mA Click To Buy
gfs1 / gfs2 ‐65°C to +150°C ‐55°C to +135°C CMRR Forward Transconductance Ratio2 Common Mode Rejection Ratio ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL CHARACTERISTICS MIN. BVGSS Gate to Source Breakdown Voltage ‐25 VGS(off) Gate to Source Cutoff Voltage ‐1 VGS(F) Gate to Source Forward Voltage ‐‐ VGS Gate to Source Voltage ‐0.3 IDSS Gate to Source Saturation Current3 7 IGSS Gate Leakage Current3 ‐‐ IG Gate Operating Current ‐‐ gfs Forward Transconductance gos Output Conductance CISS CRSS NF en Input Capacitance Reverse Transfer Capacitance Noise Figure Equivalent Input Noise Voltage 4000 4000 ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ TYP. ‐‐ ‐‐ 0.7 ‐‐ ‐‐ ‐1 ‐1 MAX. ‐5 ‐‐ ‐4 40 ‐50 ‐50 UNITS V ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ ‐‐ 7 4 10000 10000 100 150 5 1.2 1 20 10 µS VDG = 10V, ID= 5mA pF dB nV/√Hz VDG = 10V, ID = 5mA, f = 1MHz mA pA CONDITIONS IG = ‐1µA, VDS = 0V VDS = 10V, ID = 1nA IG = 1mA, VDS = 0V VDG = 10V, IG = 5mA VDS = 10V, VGS = 0V VGS = ‐15V, VDS = 0V VDG = 10V, ID = 5mA VDG = 10V, ID = 5mA, f = 10kHz, RG = 100KΩ VDG = 10V, ID = 5mA, f = 100Hz VDG = 10V, ID = 5mA, f = 10kHz Notes: 1. Absolute Maximum ratings are limiting values above which serviceability may be impaired 2. Pulse Test: PW ≤ 300µs Duty Cycle ≤ 3%
3. Assumes smaller value in numerator Available Packages:
Please contact Micross for full package and die dimensions:
LS5912C in PDIP
LS5912C available as bare die
Email: [email protected]
Web: www.micross.com/distribution.aspx
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