INTERCONNECTS 1mm Grid Surface Mount Connectors Male and Female Connectors Series 891, 893 RoHS 2002/95/EC Features: • • • • • • Fig. 1 64 Position Mezzanine connectors for board stacking. 1 mm Centerline high density packaging. Mated connector board stacking height of 10 mm. Conforms to EIA-700 AAAB for IEEE 1386 applications. Suitable for "lead free" reflow soldering (260° C peak). Tape & Reel packaged per EIA-783 (56 mm wide; 16 mm pitch). Ordering Information: Figure 1: 1mm Surface Mount Male Connector 891-10-064-30-120000 Packaging: 400 Parts per 330mm reel Figure 2: 1mm Surface Mount Female Connector 893-43-064-30-420000 Packaging: 600 Parts per 330mm reel Specifications: Fig. 2 w w w. m i l l - m a x . c o m Materials: Terminals & Contacts: Phosphor Bronze Plating: Contact area - 0,76μm Gold over nickel Solder Terminals - 1,9μm Tin over nickel Vacuum Cap: Stainless Steel Insulator Material: High temperature glass filled LCP, rated UL 94V-0 Ratings: Current: (30° C Temperature Rise): 0.5 A max., all circuits wired in series (1.0A max., five adjacent circuits wired in series) Voltage: 250V AC (RMS) (contact to contact) Operating Temperature range: -55° C - +85° C Electrical: Contact resistance: 30mΩ max. Insulation resistance: 1,000 MΩ min. Dielectric Withstanding Voltage: 250V AC for one minute@sea level Mechanical: Vibration: No discontinuity > 1 μs per MIL-STD 202, Method 201 Physical Shock: No discontinuity > 1 μs per EIA 364-27 Test Condition H Durability: 100 Cycles min. per EIA 364-09 Mating Force: 60 g/terminal max. per EIA 364-13 Separation Force: 23 g/terminal min. per EIA 364-13 Contact Retention Force: .4Kg min. per EIA 364-35 Environmental: Thermal Shock: Per EIA 364-32, Test Condition I Humidity: Test conditions - Ambient temp. 40±2°C; Relative humidity: 90 - 95%; Duration: 96 Hrs. Post Humidity inspection - 1. No damage 2. Contact resistance change < 15 mΩ 3. Insulation Resistance: 100 MΩ min. Solderability: Per EIA 364-52 Category 2 65.1 516-922-6000