TI DS30BA101SQ

DS30BA101
3.125 Gbps Differential Buffer
General Description
Features
The DS30BA101 is a high-speed differential buffer for cable
driving, signal buffering, and signal repeating applications. Its
fully differential signal path ensures exceptional signal integrity and noise immunity. The DS30BA101 drives both differential and single-ended transmission lines at data rates up to
3.125 Gbps.
The output voltage amplitude is adjustable via a single external resistor for cable driving applications into 75Ω singleended and 100Ω differential mode impedances.
The DS30BA101 is powered from a single 3.3V supply and
consumes 165 mW (typical). It operates over the full industrial
temperature range of -40°C to +85°C and is available in a
4 x 4 mm 16-pin LLP package.
■
■
■
■
Data rates from DC to 3.125 Gbps
Supports SD and HD video resolutions
Power consumption: 165 mW typical
Industrial temperature range: -40°C to +85°C
Applications
■ Cable extension
■ Signal buffering and repeating
■ Security and surveillance
Typical Application
30152002
© 2012 Texas Instruments Incorporated
301520 SNLS403
www.ti.com
DS30BA101 3.125 Gbps Differential Buffer
February 9, 2012
DS30BA101
Connection Diagram
30152005
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative power supply voltage.
16-Pin LLP
Order Number DS30BA101SQ
Package Number SQB16A
Ordering Information
Part Number
Package
Quantity
DS30BA101SQ
16-Pin LLP, 4.0 x 4.0 x 0.8 mm, 0.65 mm pitch
Reel of 1000
DS30BA101SQE
16-Pin LLP, 4.0 x 4.0 x 0.8 mm, 0.65 mm pitch
Reel of 250
DS30BA101SQX
16-Pin LLP, 4.0 x 4.0 x 0.8 mm, 0.65 mm pitch
Reel of 4500
www.ti.com
2
DS30BA101
Pin Descriptions
Pin
Name
I/O, Type
Description
1
IN+
I, CML
Non-inverting input.
2
IN-
I, CML
Inverting input.
3
VEE
Ground
Negative power supply (ground).
4
RVO
I, Analog
Output voltage level control. Connect a resistor between this pin and VCC to set the
output voltage.
5
NC
N/A
No connect. Not bonded internally.
6
VCC
Power
Positive power supply (+3.3V).
7
NC
N/A
No connect. Not bonded internally.
8
NC
N/A
No connect. Not bonded internally.
9
VCC
Power
Positive power supply (+3.3V).
10
VEE
Ground
Negative power supply (ground).
11
OUT-
O, Data
Inverting output.
12
OUT+
O, Data
Non-inverting output.
13
NC
N/A
No connect. Not bonded internally.
14
NC
N/A
No connect. Not bonded internally.
15
NC
N/A
No connect. Not bonded internally.
16
NC
N/A
No connect. Not bonded internally.
DAP
VEE
Ground
Connect exposed DAP to negative power supply (ground).
3
www.ti.com
DS30BA101
≥±4.5 kV
≥±250V
≥±2 kV
ESD Rating (HBM)
Absolute Maximum Ratings (Note 1)
ESD Rating (MM)
Supply Voltage:
Input Voltage (all inputs)
Output Current
Storage Temperature Range
Junction Temperature
Package Thermal Resistance
θJA 16-pin LLP
θJC 16-pin LLP
3.6V
−0.3V to VCC+0.3V
28 mA
−65°C to +150°C
+125°C
ESD Rating (CDM)
Recommended Operating
Conditions
Supply Voltage (VCC):
Operating Free Air Temperature (TA)
+58°C/W
+21°C/W
3.3V ±5%
-40°C to +85°C
DC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified. (Note 2, Note 3)
Symbol
Parameter
VICM
Input Common Mode Voltage
VID
Input Voltage Swing
VOCM
Output Common Mode Voltage
VOUT
Output Voltage
ICC
Conditions
Reference
IN+, IN-
Differential
Min
Typ
1.1 +
VID/2
100
OUT+, OUT-
Max
Units
VCC –
VID/2
V
2200
mVP−P
VCC –
VOUT
V
Single-ended, 75Ω load,
RVO = 750Ω
800
mVP-P
Single-ended, 50Ω load,
RVO = 953Ω
400
mVP-P
Supply Current
50
59
mA
AC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified. (Note 2, Note 3)
Symbol
Parameter
DRIN
Input Data Rate
tTLH
Transition Time Low to High
tTHL
Transition Time High to Low
Conditions
Reference
Min
Typ
IN+, IN20% - 80% (Note 4)
OU++, OUT-
Max
Units
3125
Mbps
90
130
ps
90
130
ps
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device my occur, including inoperability and degradation of device reliability
and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in
the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the
device should not be operated beyond such conditions.
Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified
or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.
Note 3: Typical values represent most likely parametric norms at VCC = +3.3V, TA = +25°C, and at the Recommended Operating Conditions at the time of product
characterization and are not guaranteed.
Note 4: Specification is guaranteed by characterization and is not tested in production.
www.ti.com
4
INPUT INTERFACING
The DS30BA101 accepts either differential or single-ended
input. DC-coupled inputs must be kept within the specified
common-mode range.
Application Information
CABLE EXTENDER APPLICATION
The DS30BA101 together with the DS30EA101 form a cable
extender chipset optimized for extending serial data streams
from serializer/deseralizer (SerDes) pairs and FPGAs over
100Ω differential cables and 75Ω coaxial cables. Setting the
correct DS30BA101 output amplitude and proper cable termination are essential for optimal operation. Figure 1 shows
the recommended chipset configuration for 100Ω differential
cable and Figure 2 shows the recommended chipset configuration for 75Ω coaxial cable.
OUTPUT INTERFACING
The DS30BA101 uses current mode outputs. Single-ended
output levels are 800 mVP-P into 75Ω AC-coupled coaxial cable with an RVO resistor of 750Ω, or 400 mVP-P (800 mVP-P
differential) into 100Ω differential cable with an RVO resistor
of 953Ω. The output voltage level is controlled by the value of
the RVO resistor connected between the RVO pin and VCC.
The RVO resistor should be placed as close as possible to the
RVO pin. In addition, the copper in the plane layers below the
RVO network should be removed to minimize parasitic capacitance.
30152031
FIGURE 1. Cable Extender Chipset Application Circuit for 100Ω Differential Cable
30152032
FIGURE 2. Cable Extender Chipset Application Circuit for 75Ω Coaxial Cable
5
www.ti.com
DS30BA101
Figure 1 and Figure 2 show the typical configurations for differential output and single-ended output, respectively. For
single-ended output, the unused output must be properly terminated as shown.
Device Operation
DS30BA101
Physical Dimensions inches (millimeters) unless otherwise noted
16-Pin LLP
Order Number DS30BA101SQ
Package Number SQB16A
www.ti.com
6
DS30BA101
Notes
7
www.ti.com
DS30BA101 3.125 Gbps Differential Buffer
Notes
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated