TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 DPDT USB 2.0 High-Speed (480Mbps) and Mobile High-Definition Link (MHL) Switch Check for Samples: TS3USB3000 FEATURES DESCRIPTION • • The TS3USB3000 is a double-pole, double throw (DPDT) multiplexer that includes a high speed Mobile High-Definition Link (MHL) switch and an USB 2.0 High-Speed (480Mbps) switches in the same package. These configurations allow the system designer to use a common USB or Mico-USB connector for both MHL video signals and USB data. 1 • • • • • VCC Range 2.7V to 4.3V Mobile Hi-definition Link (MHL) Switch – Bandwidth (-3dB) 6.1 GHz – Ron (Typ) 5.7 Ω – Con (Typ) 1.6 pF USB Switch – Bandwidth (-3dB) 6.1 GHz – Ron (Typ) 4.6 Ω – Con (Typ) 1.4 pF Current Consumption 30 µA Typ Special Features – IOFF Protection Prevents Current Leakage in Powered Down State (VCC and VBUS = 0 V) – 1.8-V Compatible Control Inputs (SEL, OE) – Over-Voltage Tolerance (OVT) on all I/O Pins up to 5.5V Without External Components ESD Performance – 3.5 kV Human Body Model (A114B, Class II) – 1 kV Charged Device Model (C101) 10-pin QFN Package (2.0x1.5 mm, 0.5 mm Pitch) The TS3USB3000 has a VCC range of 2.7V to 4.3V and supports over-voltage tolerance (OVT) feature, which allows the I/O pins to withstand over-voltage conditions (up to 5.5V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3000 are compatible with 1.8V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor. The TS3USB3000 comes with a small 10-pin QFN package with only 2.0mm x 1.5mm is size, which makes it a perfect candidate to be used in mobile applications. SWITCH DIAGRAM TS3USB3000 USB+ D+ MHL+ USB- D- SEL MHLControl Logic /OE ORDERING INFORMATION TA –40°C to 85°C PACKAGE QFN– RSE Tape and reel ORDERABLE PART NUMBER TOP-SIDE MARKING TS3USB3000RSER DSJ 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. VCC PIN DESCRIPTION USB+ 1 USB- 10 9 SEL 2 8 D+ MHL+ 3 7 D- MHL- 4 6 /OE GND 5 Pin Description Table PIN DESCRIPTION NO. NAME TYPE 1 USB+ I/O USB Data (Differential +) 2 USB– I/O USB Data (Differential –) 3 MHL+ I/O MHL Data (Differential +) 4 MHL– I/O MHL Data (Differential –) 5 GND Ground 6 OE Input 7 D– I/O Data Switch Output (Differential –) 8 D+ I/O Data Switch Output (Differential +) 9 SEL Input 10 VCC Power Ground Output Enable (Active Low) Output Select Supply FUNCTION TABLE SEL OE SWITCH STATUS X High Both USB and MHL switches in High-Z Low Low D+/D– to USB+/USB– High Low D+/D– to MHL+/MHL– SUMMARY OF TYPICAL CHARACTERISTICS MHL PATH Number of switches 2 2 ON-state resistance (ron) 5.7 Ω 4.6 Ω ON-state resistance match (Δron) <0.1 Ω <0.1 Ω ON-state capacitance (CI/O,on) Bandwidth (BW) 2 USB PATH 1.6 pF 1.4 pF 6.1 GHz 6.1 GHz Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 TYPICAL APPLICATION Figure 1 represents a typical application of the TS3USB3000 MHL switch. The TS3USB3000 is used to switch signals between the USB path, which goes to the baseband or application processor, or the MHL path, which goes to the HDMI to MHL bridge. The TS3USB3000 has internal 6MΩ pull-down resistors on SEL and OE. The pull-down on SEL ensure the USB channel is selected by default. The pull-down on OE enables the switch when power is applied. The TS5A3157 is a separate SPDT switch that is used to switch between MHL’s CBUS and the USB ID line that is needed for USB OTG (USB On-The-Go) application. VBAT To Battery Charger VCC TS3USB3000 USB+ VBUS D+ USB_D+ USB_D- USB- D+ D- Baseband or Application Processor D- ID GND MHL+ MHL+ MHL- MHL- HDMI to MHL Bridge SEL GPO1 MicroUSB Connector CBUS /OE HDMI GND GPO2 COM ID_USB TS5A3157 Figure 1. Typical TS3USB3000 Application Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 3 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX (3) VCC Supply voltage range VI/O Input/Output DC voltage range (3) IK Input/Output port diode current VI Digital input voltage range (SEL, /OE) VI/O < 0 (3) IIK Digital logic input clamp current ICC Continuous current through VCC IGND Continuous current through GND Tstg Storage temperature range (1) (2) (3) –0.3 5.5 –0.3 5.5 V V –50 mA –0.3 VI < 0 UNIT 5.5 V –50 mA 100 mA –100 mA –65 150 °C Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. All voltages are with respect to ground, unless otherwise specified. PACKAGE THERMAL IMPEDANCE (1) θJA (1) Package thermal impedance RSE package TYP UNIT 243 °C/W The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS VCC VI/O (USB) VI/O (MHL) MIN MAX UNIT Supply voltage range 2.7 4.3 V Analog voltage range 0 3.6 V VI Digital input voltage range (SEL, OE) 0 VCC V TRAMP (VCC) Power supply ramp time requirement (VCC) 100 1000 μs/V TA Operating free-air temperature -40 85 4 Submit Documentation Feedback ºC Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C, Typical values are at VCC = 3.3V, TA = 25°C, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT MHL SWITCH RON 9.0 Ω ON-state resistance VCC = 2.7V VI/O = 1.65V, ION = –8mA 5.7 ΔRON ON-state resistance match between + and – paths VCC = 2.7V VI/O = 1.65V, ION = –8mA 0.1 Ω RON (FLAT) ON-state resistance flatness VCC = 2.7V VI/O = 1.65V to 3.45V, ION = –8mA 1 Ω –2 2 µA IOZ OFF leakage current VCC = 4.3V Switch OFF, VMHL+/MHL– = 1.65V to 3.45V, VD+/D– = 0V IOFF Power-off leakage current VCC = 0V Switch ON or OFF, VMHL+/MHL– = 1.65V to 3.45V, VD+/D– = NC –10 10 µA ION ON leakage current VCC = 4.3V Switch ON, VMHL+/MHL– = 1.65V to 3.45V, VD+/D– = NC –2 2 µA 7.5 Ω USB SWITCH RON ON-state resistance VCC = 2.7V VI/O = 0.4V, ION = –8 mA 4.6 ΔRON ON-state resistance match between + and – paths VCC = 2.7V VI/O = 0.4V, ION = –8 mA 0.1 Ω RON (FLAT) ON-state resistance flatness VCC = 2.7V VI/O = 0V to 0.4V, ION = –8 mA 1 Ω –2 2 µA –10 10 µA –2 2 µA IOZ OFF leakage current VCC = 4.3V Switch OFF, VUSB+/USB– = 0V to 3.6V, VD+/D– = 0V IOFF Power-off leakage current VCC = 0V Switch ON or OFF, VUSB+/USB– = 0V to 3.6V, VD+/D– = NC ION ON leakage current VCC = 4.3V Switch ON, VUSB+/USB– = 0V to 3.6V, VD+/D– = NC DIGITAL CONTROL INPUTS (SEL, OE) VIH Input logic high VCC = 2.7V to 4.3V VIL Input logic low VCC = 2.7V to 4.3V IIN Input leakage current VCC = 4.3V, VI/O = 0V to 3.6V, VIN = 0 to 4.3V 1.3 –10 V 0.6 V 10 μA Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 5 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com DYNAMIC CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX tpd Propagation Delay tON Turn-on time (SEL to Output) 100 400 tOFF Turn-off time (SEL to Output) 400 tZH, ZL (MHL) MHL Enable Time (OE to Output) tHZ, LZ (MHL) MHL Disable Time (OE to Output) tZH, ZL (USB) USB Enable Time (OE to Output) tHZ, LZ (USB) USB Disable Time (OE to Output) tSK(P) Skew of opposite transitions of same output CON(MHL) MHL path ON capacitance CON(USB) USB path ON capacitance COFF(MHL) MHL path OFF capacitance COFF(USB) VI/O = 3.3 V or 0 V VI/O = 0.8 V or 0 V RL = 50Ω, CL = 5 pF, VCC = 2.7 V to 4.3 V UNIT ps 100 ns ns µs 200 ns 100 µs 200 ns 20 ps VCC = 3.3 V, VI/O = 0 or 3.3 V, f = 240 MHz Switch ON 1.6 2.0 pF Switch ON 1.4 2.0 pF VCC = 3.3 V, VI/O = 0 or 3.3 V f = 240 MHz Switch OFF 1.4 2.0 pF USB path OFF capacitance Switch OFF 1.6 2.0 pF CI Digital input capacitance VCC = 3.3 V, VI = 0 or 2 V OISO OFF Isolation VCC =2.7 V to 4.3 V, RL = 50 Ω, f = 240 MHz XTALK Crosstalk BW(MHL) BW(USB) 2.2 pF Switch OFF -34 dB VCC =2.7 V to 4.3 V, RL = 50 Ω, f = 240 MHz Switch ON -37 dB MHL path –3dB bandwidth VCC =2.7 V to 4.3 V, RL = 50 Ω, f = 240 MHz Switch ON 6.1 GHz USB path –3dB bandwidth VCC =2.7 V to 4.3 V, RL = 50 Ω, Switch ON 6.1 GHz SUPPLY VCC ICC Icc, 6 HZ Power supply voltage 2.7 Positive supply current VCC = 4.3 V, VIN = VCC or GND, VI/O = 0 V, Switch ON or OFF Power supply current in high-Z mode VCC = 4.3 V, VIN = VCC or GND, VI/O = 0 V, Switch ON or OFF, OE = H Submit Documentation Feedback 4.3 V 30 50 µA 5 10 µA Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 PARAMETER MEASUREMENT INFORMATION VDD VOUT1 VON VOUT2 + Channel ON SEL ION VSEL + RON = (VON – VI/O1) / ION or (VON – VI/O2) / ION VSEL = H or L GND Figure 2. ON State Resistance (RON) VDD VOUT1 VOUT2 + A SEL Channel OFF + VSEL IOZ VIN VSEL = H or L + GND Figure 3. OFF Leakage Current (IOZ) VDD Network Analyzer VOUT+ RS VS VOUT- RS Channel ON VS VSEL = H or L RS=RL=50Ω GND RL RL Figure 4. Bandwidth (BW) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 7 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS Figure 5. Eye Pattern and Time Interval Error Histogram: 0.7 Gbps With No Device The TS3USB3000 contributes only 8.4ps of peak-to-peak jitter for 0.7 Gbps data rate. Figure 6. Eye Pattern and Time Interval Error Histogram: 0.7 Gbps for MHL Switch 8 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 TYPICAL CHARACTERISTICS (continued) Figure 7. Eye Pattern and Time Interval Error Histogram: 2.2 Gbps With No Device The TS3USB3000 contributes only 3.8ps of peak-to-peak jitter for 2.2 Gbps data rate. Figure 8. Eye Pattern and Time Interval Error Histogram: 2.2 Gbps for MHL Switch Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 9 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 9. Eye Pattern and Time Interval Error Histogram: 3.0 Gbps With No Device The TS3USB3000 contributes only 5.8ps of peak-to-peak jitter for 3.0 Gbps data rate. Figure 10. Eye Pattern and Time Interval Error Histogram: 3.0 Gbps for MHL Switch 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 TYPICAL CHARACTERISTICS (continued) Figure 11. Eye Pattern and Time Interval Error Histogram: 4.5 Gbps With No Device The TS3USB3000 contributes only 7.6ps of peak-to-peak jitter for 4.5 Gbps data rate. Figure 12. Eye Pattern and Time Interval Error Histogram: 4.5 Gbps for MHL Switch Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 11 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) USB 2.0 EYE PATTERN Figure 13. 480-Mbps USB 2.0 Eye Pattern with No Device Figure 14. 480-Mbps USB 2.0 Eye Pattern for USB Switch 12 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 TYPICAL CHARACTERISTICS (continued) Figure 15. ON-Resistance vs. VI for MHL Switch Figure 16. ON-Resistance vs. VI for USB Switch Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 13 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 17. Differential S21 vs. Frequency for MHL Switch Figure 18. Differential S21 vs. Frequency for USB Switch 14 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 TS3USB3000 www.ti.com SCDS337 – DECEMBER 2012 TYPICAL CHARACTERISTICS (continued) Figure 19. Off Isolation vs. Frequency for MHL Path Figure 20. Off Isolation vs. Frequency for USB Path Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 15 TS3USB3000 SCDS337 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 21. Cross talk vs. Frequency for MHL Path Figure 22. Cross talk vs. Frequency for USB Path 16 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TS3USB3000 PACKAGE OPTION ADDENDUM www.ti.com 21-Dec-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish MSL Peak Temp Samples (3) (Requires Login) (2) TS3USB3000RLSR PREVIEW UQFN RLS 10 3000 TBD Call TI TS3USB3000RSER ACTIVE UQFN RSE 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Dec-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB3000RSER Package Package Pins Type Drawing UQFN RSE 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 179.0 8.4 Pack Materials-Page 1 1.75 B0 (mm) K0 (mm) P1 (mm) 2.25 0.65 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Dec-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB3000RSER UQFN RSE 10 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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