NELLSEMI 25DR12M

25D(R)Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Glass Passivated Standard Recovery Diodes
(Stud Version), 25A
FEATURES
Glass passivated chips
High surge current capability
Stud cathode and stud anode version
Wide current range
Voltage up to 1600V VRRM
RoHS compliant
TYPICAL APPLICATIONS
Battery charges
Converters
Power supplies
Machine tool controls
DO-203AA(DO-4)
PRODUCT SUMMARY
IF(AV)
25A
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
25
A
120
ºC
39
A
356
373
634
578
A
60 HZ
50 HZ
60 HZ
Range
200 to 1600
V
-65 to 175
ºC
TC
I F(AV)
I F(RMS)
50 HZ
I FSM
I 2t
V RRM
UNIT
VALUES
TEST CONDITIONS
TJ
A 2s
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE
NUMBER
25D( R )
VOLTAGE
CODE
VRRM,MAXIMUM
REPETITIVE PEAK
REVERSE VOLTAGE
V
VRSM,MAXIMUM
NON-REPETITIVE
PEAK VOLTAGE
V
VR(BR),MIMIMUM
AVALANCHE
VOLTAGE
V(1)
02
200
275
-
04
400
500
500
06
600
725
750
08
800
950
950
10
1000
1200
1150
12
1200
1400
1350
16
1600
1800
1750
Note
(1) Avalanche version only available from VRRM 400V to 1600V
Page 1 of 5
VRRM,MAXIMUM
AT TJ=175°C
mA
12
25D(R)Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
FORWARD CONDUCTION
SYMBOL
PARAMETER
Maximum average forward current
at case temperature
I F(AV)
Maximum RMS forward current
I F(RMS)
Maximum on-repetitive peak
reverse power
P R(1)
TEST CONDITIONS
I FSM
non-reptitive surge current
25
120
39
180 ° conduction, half sine wave
10μs square pulse, T J = T J maximum
t = 10 ms
Maximum peak, one-cycle forward,
VALUES
t = 8.3 ms
t = 10 ms
10
No voltage
reapplied
356
300
t = 8.3 ms
100%V RRM
reapplied
t = 10 ms
t = 8.3 ms
No voltage
reapplied
t = 10 ms
100%V RRM
reapplied
373
Sinusoidal half wave,
initial T J = T J maximum
UNIT
A
ºC
A
K/W
A
314
634
578
450
A 2s
Maximum l²t for fusing
I 2t
Maximum l²√t for fusing
I 2√t
t = 0.1 to 10 ms, no voltage reapplied
6337
A 2√s
Maximum forward voltage drop
V FM
l pk = 78 A, T J = 25˚C, t p = 400µs rectangular wave
1.30
V
t = 8.3 ms
410
Note
(1) Avalanche only for avalanche version, all other parameters the same as 25D
THERMAL AND MECHANICAL SPECIFCATIONS
SYMBOL
PARAMETER
Maximum junction operating
temperature range
Maximum storage temperature range
Maximum thermal resistace,
junction to case
TEST CONDITIONS
VALUES
UNITS
TJ
- 65 to175
ºC
T stg
- 65 to 200
R thJC
1.5
DC operation
K/W
Maximum thermal resistance
R thCS
case to heatsink
Mounting surface, smooth, flat and greased
0.5
1.5 +0
-10%
(13)
Not lubricated threads
Allowable mounting torque
+0
1.2 -10%
(10)
6
0.21
Lubricated threads
Approximate weight
Case style
See dimensions - link at the end of datasheet
N·m
(lbf · in)
N·m
(lbf · in)
g
oz.
DO-203AA (DO-4)
ΔRthJC CONDUCTION
CONDUCTION ANGEL
SINUSOIDAL CONDUCTION
RECTANGULAR CONDUCTION
180˚
0.28
0.24
120˚
90˚
0.39
0.50
0.73
0.41
0.54
0.75
1.20
1.21
60˚
30˚
Note
• The table above shows the increment of thermal resistance RthJC when devices
operate at different conduction angles than DC
Page 2 of 5
TEST CONDUCTIONS
T J = T J maximum
UNITS
K/W
25D(R)Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.2 Current Ratings Characteristics
25D(R) Series
R thJC (DC)=1.5K/W
170
160
150
Conduction Angle
140
130
120
90°
60°
110
120°
30°
180°
100
5
0
10
15
20
25
180
Maximum Allowable Case Temperature(˚C)
180
25D(R) Series
R thJC (DC)=1.5K/W
170
160
150
Conduction Period
140
130
120
90°
120°
60°
110
180°
30°
DC
100
30
0
5
Average Forward Current (A)
25
15 20
10
30
35
40
Average Forward Current (A)
Fig. 3 Forward Power Loss Characteristics
2K
180°
3K
A
30
=
90°
60°
4K
1K
/W
/W
-D
25
/W
/W
hS
120°
Rt
30°
el
ta
20
6K
RMS Limit
8K
15
/W
/W
12K
Conduction Angle
R
Maximum Average Forward Power Loss (W)
35
10
/W
2 0 K /W
25D(R) Series
5
40K/ W
TJ = 175 ˚ C
0
0
10
5
15
20
25
30
Average Forward Current (A)
50
25
100
75
125
150
175
Maximum Allowable Ambient Temperature (°C)
Fig. 4 Forward Power Loss Characteristics
Maximum Average Forward Power Loss (W)
Maximum Allowable Case Temperature(˚C)
Fig.1 Current Ratings Characteristics
25
DC
180°
Rt
120°
90°
20
6K
RMS Limit
hS
A=
/W
60°
8K
30°
15
10K
4K
/W
-D
elt
aR
/W
/W
1 5 K /W
10
Conduction Period
2 0 K /W
3 0 K /W
5
25D(R) Series
T J = 175 °C
0
0
5
10
15
20
Average Forward Current (A)
25
30
25
50
75
Maximum Allowable Ambient Temperature (°C)
100
45
RoHS
RoHS
25D(R)Series
SEMICONDUCTOR
Nell High Power Products
350
Fig.6 Maximum Non-Repetitive Surge Current
Peak Half Sine Wave Forward Current (A)
Peak Half Sine Wave Forward Current (A)
Fig. 5 Maximum Non-Repetitive Surge Current
At Any Rated Load Condition And With
At Rated VRRM Applied Following Surge.
Initial TJ = 175°C
300
@60 Hz 0.0083 s
@50 Hz 0.0100 s
250
200
150
100
25D(R) Series
50
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration.
350
Initial TJ = 175°C
No Voltage Reapplied
300
Reted VRRM Reapplied
250
200
150
100
50
25D(R) Series
0
0.01
100
10
1
400
Number Of Equal Amplitude Half Cycle current Pulses(N)
Transient Thermal Impedance ZthJC (K/W)
Fig.8 Thermal Impedance ZthJC Characteristics
Instantaneous Forward Current (A)
1000
100
T J = 25 °C
T J = 175 °C
10
25D(R) Series
0
0.5
1
1.5
2
2.5
3
3.5
4
10
Steady State Value
RthJC = 1.5K/W
(DC Operation)
1
25D(R) Series
0.1
0.001
Instantaneous Forward Voltage (V)
0.01
0.1
1
Square Wave Pulse Duration (s)
ORDERING INFORMATION TABLE
Device code
10
Pulse Train Duration (S)
Fig. 7 Forward Voltage Drop Characterisics
1
1
0.1
25
D
R
12
M
1
2
3
4
5
1
-
Current rating: Code = IF(AV)
2
-
D = Standard recovery device
3
-
None = Stud normal polarity (cathode to stud)
R = Stud reverse polarity (anode to stud)
4
-
Voltage code × 100 = VRRM (see Voltage Ratings table)
5
-
None = Stud base DO-203AA (DO-4) #10-32 UNF-2A
M = Stud base DO-230AA (DO-4) M5× 0.8 (not available
for avalanche diodes)
10
25D(R)Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
10.6/11.2
(0.41/0.44)
11.6/12.4
(0.45/0.48)
Ø8.5/Ø8.9
(Ø0.33/Ø0.35)
3.7/4.3
(0.14/0.16)
10.5/11.5
(0.41/0.45)
9.6/10.1
(0.37/0.39)
20.0/21.0
(0.78/0.82)
5.0/5.6
(0.19/0.22)
Ø1.5/Ø1.7
Ø0.05/Ø0.06
10/32” UNF-2A
For metric devices: M5× 0.8
0.5/1.0
(0.02/0.04)