NELLSEMI 26T12AI-BW

RoHS
26T Series RoHS
SEMICONDUCTOR
TRIACs, 25A
Sunbberless and Standard
FEATURES
High current triac
Low thermal resistance with clip bonding
A2
Low thermal resistance insulation ceramic
for insulated TO-220AB & TO-3P package
1
A1
A2
G
High commutation (4 quadrant) or very
High commutation (3 quadrant) capability
TO-220AB (non-Insulated)
(26TxxA)
26T series are UL certified (File ref: E320098)
Packages are RoHS compliant
APPLICATIONS
2
3
TO-220AB (lnsulated)
(26TxxAI)
A2
Applications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits,
etc., or for phase control operation in light
dimmers, motor speed controllers, and silmilar.
A1 A2 G
A1 A2
G
The snubberless versions are especially
recommended for use on inductive loads,
due to their high commutation performances.
The 26T series provides an insulated tab
(rated at 2500V RMS ).
TO-3P (non-Insulated)
(26TxxB)
MAIN FEATURES
TO-3P (Insulated)
(26TxxBI)
A2
SYMBOL
VALUE
UNIT
I T(RMS)
25
A
V DRM /V RRM
600 to 1200
V
I GT(Q1)
35 to 50
mA
A1 A2
G
TO-263 (D2PAK)
(26TxxH)
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RMS on-state current (full sine wave)
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25°C)
SYMBOL
IT(RMS)
ITSM
TEST CONDITIONS
Tc = 100ºC
TO-220AB insulated
Tc = 75ºC
F =50 Hz
t = 20 ms
250
F =60 Hz
t = 16.7 ms
260
Critical rate of rise of on-state current
IG = 2xlGT, tr≤100ns
dI/dt
F =100 Hz
Peak gate current
IGM
T p =20 µs
PG(AV)
T j =125ºC
Operating junction temperature range
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A
TO-263/TO-220AB/TO-3P insulated
t p = 10 ms
Storage temperature range
25
Tc = 105ºC
2
Average gate power dissipation
UNIT
TO-3P
I t
I2t Value for fusing
VALUE
A
340
A2s
T j =125ºC
50
A/µs
T j =125ºC
4
A
1
W
Tstg
- 40 to + 150
Tj
- 40 to + 125
ºC
Page 1 of 6
RoHS
26T Series RoHS
SEMICONDUCTOR
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)
SNUBBERLESS and Logic level (3 quadrants)
26Txxxx
SYMBOL
IGT(1)
TEST CONDITIONS
I - II - III
V D = 12 V, R L = 30Ω
V D = V DRM , R L = 3.3KΩ
I - II - III
T j = 125°C
I T = 500 mA
IL
I G = 1.2 I GT
35
50
MIN.
MAX.
I - III
(dI/dt)c(2)
BW
I - II - III
IH(2)
dV/dt(2)
CW
mA
MAX.
VGT
VGD
Unit
QUADRANT
II
MAX.
1.3
V
0.2
V
50
75
70
80
80
100
mA
500
V D = 67% V DRM , gate open ,T j = 125°C
mA
1000
V/µs
22
A/ms
MIN.
13
Without snubber, T j = 125°C
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)
Standard (4 quadrants)
26Txxxx
TEST CONDITIONS
SYMBOL
IGT(1)
QUADRANT
I - II - III
V D = 12 V, R L = 30Ω
VGT
VGD
V D = V DRM , R L = 3.3KΩ, T j = 125°C
IH(2)
I T = 500 mA
IL
I G = 1.2 I GT
B
MAX.
(dV/dt)c(2)
50
mA
IV
100
ALL
1.3
V
ALL
0.2
V
80
mA
MAX.
I - III - IV
MAX.
70
mA
160
II
dV/dt(2)
UNIT
V D = 67% V DRM , gate open, T j = 125°C
MIN.
500
V/µs
(dI/dt)c =13.3 A/ms, T j = 125°C
MIN.
10
V/µs
VALUE
UNIT
STATIC CHARACTERISTICS
SYMBOL
TEST CONDITIONS
VTM(2)
I TM = 35 A, t P = 380 µs
T j = 25°C
MAX.
1.55
V
Vt0(2)
Threshold voltage
T j = 125°C
MAX.
0.85
V
Dynamic resistance
T j = 125°C
MAX.
16
mΩ
VD = VDRM
VR = VRRM
T j = 25°C
5
µA
3
mA
VALUE
UNIT
Rd
(2)
IDRM
IRRM
MAX.
T j = 125°C
Note 1: Minimum lGT is guaranted at 5% of lGT max.
Note 2: For both polarities of A2 referenced to A1.
THERMAL RESISTANCE
SYMBOL
Rth(j-c)
Junction to case (AC)
S = 1 cm 2
Rth(j-a)
Junction to ambient
TO-3P
TO-263/TO-220AB
0.6
0.8
TO-3P Insulated
TO-220AB Insulated
0.9
1.7
TO-263
45
TO-220AB Insulated, TO-220AB
60
TO-3P, TO-3P Insulated
50
S = Copper surface under tab.
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Page 2 of 6
°C/W
RoHS
26T Series RoHS
SEMICONDUCTOR
PRODUCT SELECTOR
VOLTAGE (x x)
PART NUMBER
SENSITIVITY
TYPE
PACKAGE
V
50 mA
Standard
TO-220AB
V
V
35 mA
Snubberless
TO-220AB
V
V
V
50 mA
Snubberless
TO-220AB
V
V
V
V
50 mA
Standard
TO-3P
26TxxB -CW/26TxxBl-CW
V
V
V
V
35 mA
Snubberless
TO-3P
26TxxB -BW/26TxxBl-BW
V
V
V
V
50 mA
Snubberless
TO-3P
26TxxH-B
V
V
V
V
50 mA
Standard
D 2 PAK
26TxxH -CW
V
V
V
V
35 mA
Snubberless
D 2 PAK
26TxxH -BW
V
V
V
V
50 mA
Snubberless
D 2 PAK
600 V
800 V
1000 V
1200 V
26TxxA-B/ 26TxxAl-B
V
V
V
26TxxA-CW/26TxxAl-CW
V
V
26TxxA-BW/26TxxAl-BW
V
26TxxB-B/26TxxBl-B
AI: Insulated TO-220AB package
BI: Insulated TO-3P package
ORDERING INFORMATION
ORDERING TYPE
MARKING
PACKAGE
WEIGHT
BASE Q,TY
DELIVERY MODE
26TxxA-yy
26TxxA-yy
TO-220AB
2.0g
50
Tube
26TxxAI-yy
26TxxAI-yy
TO-220AB (insulated)
2.3g
50
Tube
26TxxB-yy
26TxxB-yy
TO-3P
4.3g
30
Tube
26TxxBI-yy
26TxxBI-yy
TO-3P (insulated)
4.8g
30
Tube
26TxxH-yy
26TxxH-yy
D 2 PAK
2.0g
50
Tube
Note: xx = voltage, yy = sensitivity
ORDERING INFORMATION SCHEME
26 T 06
Current
26 = 25A
Triac series
Voltage
06 = 600V
08 = 800V
10 = 1000V
12 = 1200V
Package type
A = TO-220AB (non-insulated)
AI = TO-220AB ( insulated)
B = TO-3P (non-insulated)
BI = TO-3P ( insulated )
H = TO-263 (D 2 PAK)
IGT Sensitivity
BW = 50mA Snubberless
CW = 35mA Snubberless
B = 50mA Standard
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Page 3 of 6
A - BW
RoHS
26T Series RoHS
SEMICONDUCTOR
Fig.1 Maximum power dissipation versus RMS on-state
current (full cycle)
Fig.2 RMS on-state current versus case temperature
(full cycle)
P (W)
IT(RMS) (A)
30
30
25
25
20
20
15
15
10
10
TO-3P
TO-220AB
( insulated )
TO-220AB
TO-263
TO-3P(insulated)
5
5
I T(RMS) (A)
T C (°C)
0
0
5
0
10
15
20
0
25
Fig.3 D 2 PAK RMS on-state current versus ambient
temperature (printed circuit board FR4,
copper thickness: 35µm)(full cycle)
4.0
25
75
50
100
125
Fig.4 Relative variation of thermal impedance
versus pulse duration.
IT(RMS) (A)
K=[Zth/Rth]
1E+0
Zth(j-c)
D 2 PAK
(S=1cm 2 )
3.5
Zth(j-a)
TO-263AB
TO-220AB
TO-220AB (insulated)
3.0
1E-1
2.5
2.0
1.5
1E-2
Zth(j-a)
1.0
TO-3P(insulated)
0.5
Tamb(°C)
0.0
0
25
75
50
100
125
1E-3
(A)
100
Tj max.
Vto = 0.85 V
Rd = 16 mΩ
1E-1
1E+0
1E+1
250
5E+2
t=20ms
One cycle
Non repetitive
200
Tj=Tj max
1E+2
ITSM (A)
300
300
1E-2
Fig.6 Surge peak on-state current versus number
of cycles.
Fig.5 On-state characteristics (maximum values).
I
tp(s)
1E-3
Tj initial=25°C
150
Tj=25°C
10
Repetitive
Tc=75°C
100
50
VTM(V)
1
0.5
1.0
1.5
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2.0
2.5
Number of cycles
0
3.0
3.5
4.0
4.5
Page 4 of 6
1
10
100
1000
RoHS
26T Series RoHS
SEMICONDUCTOR
Fig.7 Non-repetitive surge peak on-state current
for a sinusoidal pulse with width tp < 10ms.
and corresponding value of l 2 t.
Fig.8 Relative variation of gate trigger current,holding
current and latching current versus junction
temperature (typical values).
l TSM (A), l 2 t(A 2 s)
l GT , l H , l L [T j ] / l GT ,l H ,l L [T j =25°C]
3000
2.5
Tj initial=25°C
2.0
dI/dt limitation:
50A/µs
IGT
I TSM
1000
1.5
IH & IL
I2t
1.0
0.5
Tj(°C)
tp(ms)
100
0.01
0.0
0.10
1.00
10.00
Fig.9 Relative variation of critical rate of decrease
of main current versus (dV/dt)c (typical values).
-40
0
20
40
60
80
100
120
140
Fig.10 Relative variation of critical rate of decrease
of main current versus T j
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
2.4
2.2
2.0
5
1.8
1.6
4
CW/BW
B
1.4
3
1.2
1.0
2
0.8
0.6
0.4
-20
1
(dV/dt)c (V/µs)
0.1
100.0
10.0
1.0
Fig.11 D 2 PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35µm)
R th(j-a) (°C/W)
80
TO-263
70
60
50
40
30
20
10
S(cm2)
0
0
4
8
12
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16
20
24
28
32
36
40
Page 5 of 6
Tj(°C)
0
0
25
50
75
100
125
RoHS
26T Series RoHS
SEMICONDUCTOR
Case Style
TO-220AB
10.54 (0.415) MAX.
9.40 (0.370)
9.14 (0.360)
4.70 (0.185)
4.44 (0.1754)
3.91 (0.154)
3.74 (0.148)
1.39 (0.055)
1.14 (0.045)
2.87 (0.113)
2.62 (0.103)
3.68 (0.145)
3.43 (0.135)
1
PIN
2
15.32 (0.603)
14.55 (0.573)
16.13 (0.635)
15.87 (0.625)
8.89 (0.350)
8.38 (0.330)
29.16 (1.148)
28.40 (1.118)
3
4.06 (0.160)
3.56 (0.140)
2.79 (0.110)
2.54 (0.100)
1.45 (0.057)
1.14 (0.045)
2.67 (0.105)
2.41 (0.095)
2.65 (0.104)
2.45 (0.096)
14.22 (0.560)
13.46 (0.530)
0.90 (0.035)
0.70 (0.028)
0.56 (0.022)
0.36 (0.014)
5.20 (0.205)
4.95 (0.195)
TO-263(D 2 PAK)
10.45 (0.411)
9.65 (0.380)
4.83 (0.190)
4.06 (0.160)
6.22 (0.245)
9.14 (0.360)
8.13 (0.320)
1.40 (0.055)
1.14 (0.045)
1.40 (0.055)
1.19 (0.047)
15.85 (0.624)
15.00 (0.591)
0 to 0.254 (0 to 0.01)
2.79 (0.110)
2.29 (0.090)
0.940 (0.037)
0.686 (0.027)
0.53 (0.021)
0.36 (0.014)
2.67 (0.105)
2.41 (0.095)
3.56 (0.140)
5.20 (0.205)
4.95 (0.195)
TO-3P
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Page 6 of 6
2.79 (0.110)